Preform Filler Alloys and Consumables
from Lucas Milhaupt Global Brazing Solutions
Aluminum brazing and soldering filler metals are used to join materials within the aluminum family of alloys. These materials are available in wire, strip, powder, paste (both corrosive and non-corrosive formulations) and preformed rings and shapes. Lucas-Milhaupt also offers aluminum flux-cored... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Powder; Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.; Strip, sheet or foil; Solid wire or rod; Flux Cored Wire
- Melting Range: 1085
- Applications / Materials Joined: Aluminum Alloys
- Braze Alloy: Aluminum Alloy Braze
from Indium Corporation
Indalloy ® 182 (80Au/20Sn) has a melting point of 280 °C (556 °F). It can be made into solder preforms with various options to address specific applications. Gold-tin solder preforms are generally used in applications that require a high melting temperature (over 150 °C), good... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Solder Alloy: Gold-Tin
from Sunstone Engineering
Sunstone is dedicated to providing complete solutions to our customer needs. That ’s why we offer pre-cut nickel tabs for battery pack manufacturing. Need a spool of nickel? See or nickel spool options. [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Welding Filler Types: Nickel Alloy
from Indium Corporation
Indium Corporation is the leading global supplier of commercial indium, high purity indium, indium fabrications, alloys, and chemicals. Indium metal is extracted from indium-bearing ore and is refined to various grades in high volume utilizing state of the art SPC controlled refining technologies. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.; Strip, sheet or foil; Solid wire or rod; Hollow wire or metal cored filler
- Solder Alloy: Indium Alloy Solders
from Indium Corporation
Features. AuSn (gold-tin) alloy provides great joint strength. AuSn alloy offers superior resistance to corrosion and superior thermal conductivity when compared to standard solders. AuSn alloy is compatible with precious metals. AuSn is RoHS compliant. When to Use AuSn Eutectic Solder. Die-Attach:... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Nominal Composition: Au80/Sn20
- Solder Alloy: Lead Free; Gold-Tin
from Indium Corporation
InFORMS ® are fabrications in which a copper mesh is embedded into a solder preform. This process produces a reinforced solder fabrication with improved strength and creates a more consistent bondline thickness. A uniform bondline maximizes the thermal and mechanical reliability in the solder... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Nominal Composition: Sn63, Sn62, SAC305, Sb05, Sb10, 90Pb, 92.5Pb, 100In, InSn, InAg, InPb
- Solder Alloy: Indium Alloy Solders
from Indium Corporation
InTEGRATED ® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform separation. Applications. InTEGRATED ® Solder Preforms save assembly time and labor costs by allowing... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag); Indium Alloy Solders
from Indium Corporation
Indium Corporation produces spheres with accurate diameters; bright, shiny surface finishes; and highly spherical shapes. Our spheres are made in dedicated manufacturing cells supported by Statistical Process Controls (SPC). [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Nominal Composition: 95.5Sn3.8Ag0.7Cu, 96.5Sn3Ag0.5Cu, 95.5Sn4Ag0.5Cu, 100In
- Solder Alloy: Tin-Gold
from Indium Corporation
The need for high-temperature solders is growing as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as a result of increased power ratings. Indalloy ®182 (80Au/20Sn eutectic solder) has been the workhorse for... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Nominal Composition: 88Au/12Ge
- Solder Alloy: Gold-Tin
from Indium Corporation
Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components make this increasingly difficult. Solder Fortification ® Preforms can... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free
from Indium Corporation
Solder preforms are used in a variety of applications that require precise amounts of solder. Preforms come in standard shapes such as squares, rectangles, washers, and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Solder Alloy: Indium Alloy Solders; Lead Free
from Indium Corporation
Solder Fortification ® preforms are used in conjunction with solder paste to give more volume (and therefore more strength) to the solder join that can be achieved through the printing process. This increases the reliability of the joint on the first pass, reducing rework time. It will also give... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
from Indium Corporation
Solder Fortification ® preforms are used in conjunction with solder paste to give more volume (and therefore more strength) to the solder join that can be achieved through the printing process. This increases the reliability of the joint on the first pass, reducing rework time. It will also give... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
from Indium Corporation
Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components make this increasingly difficult. Solder Fortification ® Preforms can... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free
from Indium Corporation
NanoFoil ®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil ® sheets are available as standard or plated with solder. Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4 ” x 5 ” up to 43.5 ” x 9... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.