Lead Free Filler Alloys and Consumables
from MacDermid Alpha Electronics Solutions
Next-generation, high-reliability no-clean solder paste engineered to deliver advanced thermomechanical performance. Product Overview. ALPHA CVP-390V Innolot MXE Solder Paste is a lead-free, zero-halogen, no-clean solder paste rigorously engineered to deliver advanced thermomechanical performance... [See More]
- Solder Alloy: Lead Free
from RS Components, Ltd.
No Clean Tack Flux in 10cc syringe [See More]
- Solder Alloy: Lead Free
- Approvals / Conformance: RoHS Compliant
from RS Components, Ltd.
No Clean Tack Flux in 30cc syringe [See More]
- Solder Alloy: Lead Free
- Approvals / Conformance: RoHS Compliant
from RS Components, Ltd.
No Clean Tack Flux,5cc,Lead-free [See More]
- Solder Alloy: Lead Free
- Approvals / Conformance: RoHS Compliant
from RS Components, Ltd.
Tack Flux,2cc Squeeze Tube, Pack of 6 [See More]
- Solder Alloy: Lead Free
- Approvals / Conformance: RoHS Compliant
from RS Components, Ltd.
Tack Flux,8cc Squeeze Tube [See More]
- Solder Alloy: Lead Free
- Approvals / Conformance: RoHS Compliant
from RS Components, Ltd.
Tack Flux,10cc syringe water washable [See More]
- Solder Alloy: Lead Free
- Approvals / Conformance: RoHS Compliant
from RS Components, Ltd.
Liquid Flux Water-Washable in 10ml (0.34 [See More]
- Solder Alloy: Lead Free
from RS Components, Ltd.
Liquid Flux No-Clean in 10ml (0.34oz) Pe [See More]
- Solder Alloy: Lead Free
from RS Components, Ltd.
Liquid Flux No-Clean in 15ml (0.5oz) Squ [See More]
- Solder Alloy: Lead Free
from RS Components, Ltd.
Liquid Flux No-Clean in 30ml (1.0oz) Squ [See More]
- Solder Alloy: Lead Free
from RS Components, Ltd.
Smooth Flow Tack Flux No-Clean in a 10cc [See More]
- Solder Alloy: Lead Free
from RS Components, Ltd.
Smooth Flow Tack Flux No-Clean in a 30cc [See More]
- Solder Alloy: Lead Free
from RS Components, Ltd.
Rosin Paste Flux (RA) in 2oz Flat Jar 50 [See More]
- Solder Alloy: Lead Free
from RS Components, Ltd.
Flux dispensing pen,lead free,9g [See More]
- Solder Alloy: Lead Free
- Approvals / Conformance: RoHS Compliant
from Henkel Corporation - Electronics
Known as Multicore C400 Flux Cored Wire ). LOCTITE C 400 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. Multicore C400 wires provide fast soldering on copper, brass and solder coated materials. It is availalble in several alloys:... [See More]
- Joining Process / Product Form: Solid wire or rod
- Approvals / Conformance: IPC/J-STD-004 Classification - ROLO
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Lead Free; SnCu
from Indium Corporation
Indium Corporation manufactures bar solder specifically to surpass the strict quality demands of the surface mount industry in order to provide more consistent and reliable performance. Bar solder is available in a full range of SnPb and Pb-free alloys, including industry standard Sn63, and SAC305. [See More]
- Joining Process / Product Form: Bar Solder
- Approvals / Conformance: ASTM / UNS; JIS; RoHs, J-Std
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Lead Free
- Specific Standard / AWS Class: ASTM B-32, J-Std 006, JIS Z 3282
from Techsil Limited
MG Chemicals 4900 Sn96 (SAC305) is an electronic grade, lead-free solder wire. It uses the predominant lead-free alloy composition and is complemented with a no clean, synthetically refined, splatter-proof resin flux core. The 4900 solder wire meets J-STD-004 and exceeds J-STD-006 purity... [See More]
- Joining Process / Product Form: Solid wire or rod; Flux Cored Wire
- Solder Alloy: Lead Free
from ESAB Welding and Cutting Products
Features. Lead free-cadmium free solder and flux kit for joining copper and dissimilar metals in drinking water lines. Works, melts, and solders better than 50/50 lead/tin solder. Good corrosion resistance. Meets all Government and Plumbing Code specs. Flux performs to Fed O-F-506,Form A [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Lead Free
- Tensile Strength (UTS): 7000
from Henkel Corporation - Electronics
Halide-free, No-clean, SnPbSnPb solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in Pb-free formulation [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62, Sn63
from Indium Corporation
Sn995 Cobalt-Doped Pb-Free Soldering Alloy is a cobalt-doped Sn/Cu alloy that provides a low cost alternative to traditional SAC305. In addition to its low cost, it produces smoother, shinier joints and lower dross than SAC305 and other Sn/Cu-based alloys. [See More]
- Joining Process / Product Form: Bar
- Nominal Composition: SN995
- Solder Alloy: Lead Free
from Henkel Corporation - Electronics
Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb formulation [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb) (optional feature); Lead Free; 92A
from Indium Corporation
Features. AuSn (gold-tin) alloy provides great joint strength. AuSn alloy offers superior resistance to corrosion and superior thermal conductivity when compared to standard solders. AuSn alloy is compatible with precious metals. AuSn is RoHS compliant. When to Use AuSn Eutectic Solder. Die-Attach:... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Nominal Composition: Au80/Sn20
- Solder Alloy: Lead Free; Gold-Tin
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeIndustry-leading solder paste in paste-transfer efficiency. Improved stability at different storage and operating temperatures, with extended stencil life up to 72 hours and extended abandon time up to 24 hours. Suitable for high-density, small to large boards. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC305
from Indium Corporation
Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components make this increasingly difficult. Solder Fortification ® Preforms can... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free
from Henkel Corporation - Electronics
Halogen-free, Pb-free, Water WashRoHS-compliant solder paste with excellent resistance in high humidity. Improved stability at different storage and operating temperatures, with extended stencil life over 24 hours. Suitable for high-density, small to large boards. Residues can be removed with... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC305
from Indium Corporation
Solder preforms are used in a variety of applications that require precise amounts of solder. Preforms come in standard shapes such as squares, rectangles, washers, and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Solder Alloy: Indium Alloy Solders; Lead Free
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste designed for medium to large boards. Robust reflow process window with exceptional solderability across a wide range of challenging surfaces finishes including immersion Ag and OSP copper. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC305, SAC387
from Indium Corporation
Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes. [See More]
- Joining Process / Product Form: Solid wire or rod
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free; Gold-Tin, Bismuth Alloys
- Diameter / Thickness: 1.00E-3 to 0.2500
- Nominal Composition: 52In/48Sn, 58Bi/42Sn, 97In/3Ag, 80In/15Pb/5Ag, 100In, 70Sn/18Pb/12In, 70In/30Pb
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste suitable for high speed printing. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range of challenging surface finishes including OSP copper. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 90iSC, SAC305, SAC387
from Indium Corporation
CORE 230 wire solder is cored with a no-clean flux fully compatible with Indium ’s NC-SMQ230 Pb-Free solder paste. It contains a heat-stabilized rosin that provides excellent wetting and solder spread on various metallizations used in Pb-Free assembly processes. [See More]
- Joining Process / Product Form: Flux Cored Wire
- Solder Alloy: Lead Free
- Diameter / Thickness: 0.0100 to 0.0320
- Nominal Composition: Sn95.5 Ag3.8 Cu0.7
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeHalogen and Pb-free solder paste designed for medium to large boards. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP copper, ENIG and CuNiZn. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 90iSC, SAC0307, SAC305, SAC387
from Indium Corporation
Lead (Pb)-containing solders have been used for many years for wafer and substrate-bumping applications. Most recently, these solders have been replaced by Sn-based Pb-free solders; however, the majority of cutting-edge applications, such as copper pillar/microbump, have moved to a low-silver plated... [See More]
- Solder Alloy: Lead Free
from Henkel Corporation - Electronics
Halogen-free, No-clean, Pb-freeDispensing grade, halogen and Pb-free solder paste with exceptional dot-to-dot consistency, colorless residues and high-speed dispense capability with zero slump. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC387
from Indium Corporation
Indium8.9E is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium 8.9E offers unprecedented... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Lead Free
from Henkel Corporation - Electronics
Halogen-free, SnPb, Water WashSnPb water washable, halogen-free solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed by deionized water for 5 to 15 minutes at 40°C to 60°C. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn63
from Indium Corporation
BiAgX ® is a true solder paste technology. It reflows, solders, wets, and solidifies, just like any other solder paste. When converting from a standard high-Pb solder paste-based process, minimal process adjustments are required, eliminating the need for new capital expenditure. Solder joints... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Low Ag BiAgX® Indium7.xx, High Ag BiAgX® Indium7.xx
- Solder Alloy: Lead Free
- Approvals / Conformance: J-STD-004, J-STD-005
from Henkel Corporation - Electronics
This halide-free, no-clean and Pb-free solder paste has an excellent humidity resistance and a broad process window for both reflow and printing. It offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide range of... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free
from Indium Corporation
BiAgX ® is a true solder paste technology. It reflows, solders, wets, and solidifies, just like any other solder paste. When converting from a standard high-Pb solder paste-based process, minimal process adjustments are required, eliminating the need for new capital expenditure. Solder joints... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Nominal Composition: Low Ag BiAgX® Indium7.xx, High Ag BiAgX® Indium7.xx
- Solder Alloy: Lead Free
- Approvals / Conformance: J-STD-004, J-STD-005
from Henkel Corporation - Electronics
No-clean, Pb-freePb-free solder paste designed for low-temperature, Pb-free solder alloys. This material is formulated to provide excellent dispensability, printability and solderability through various reflow profiles. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; B158
from Indium Corporation
Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components make this increasingly difficult. Solder Fortification ® Preforms can... [See More]
- Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free
from Henkel Corporation - Electronics
Halide-free, No-clean, SnPbSnPb, halide-free solder paste designed for high speed printing. Extended printed open time and tack life. Resistant to both hot and cold slump. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62, Sn63
from Indium Corporation
Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-Free alloy systems. This product formulation offers consistent, repeatable printing performance combined... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Solder Alloy: Lead Free
from Henkel Corporation - Electronics
Halide-free, No-clean, SnPbSnPb, halide-free, high activity solder paste that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including rheo pump, proflow, large, high-density. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62, Sn63
from Indium Corporation
Indium Corporation manufactures bar solder specifically to surpass the strict quality demands of the surface mount industry in order to provide more consistent and reliable performance. Bar solder is available in a full range of SnPb and Pb-free alloys, including industry standard Sn63, and SAC305. [See More]
- Joining Process / Product Form: Bar Solder
- Approvals / Conformance: ASTM / UNS; JIS; RoHs, J-Std
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Lead Free
- Specific Standard / AWS Class: ASTM B-32, J-Std 006, JIS Z 3282
from Henkel Corporation - Electronics
No-clean, SnPbSnPb, halide-containing solder paste formulated for dispensing or printing and reflow in air, where process yield is critical. Offers excellent open time, good soldering activity, especially on OSP copper. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62
from Indium Corporation
A low temperature lead-free alloy that is more malleable than BiSn. Alloy: 57Bi 42Sn 1.0Ag. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 140 ºC. Solidus Melting Temperature: 139 ºC. Pb-Free: Yes [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Solder Alloy: Tin-Silver Alloy Solder (Sn-Ag); Lead Free
- Diameter / Thickness: 0.0020
- Nominal Composition: 57Bi-42Sn-1Ag
from Henkel Corporation - Electronics
SnPb, Water WashSnPb water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time, greatly extended abandon times and good soldering activity over a wide range of reflow profile types and surface... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; 63S4, Sn62, Sn63
from Indium Corporation
Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 220 ºC. Solidus Melting Temperature: 217 ºC. Pb-Free: Yes [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Solder Alloy: Tin-Silver Alloy Solder (Sn-Ag); Lead Free
- Diameter / Thickness: 0.0020
- Nominal Composition: 96.55Sn-3Ag-0.5Cu
from Henkel Corporation - Electronics
Pb-free, Water WashPb-free water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time and good soldering activity over a wide range of reflow profiles and surface finishes. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Solder Alloy: Lead Free; SAC305, SAC387
from Indium Corporation
High quality Solder Ribbon and Foil manufactured by Indium Corporation is available in many standard alloys and sizes. Material can also be custom made to your unique material and dimensional requirements. Solder Ribbon is supplied in continuous lengths and is packaged on spools. Solder Foil is... [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free; Tin, Gold, Lead
from Indium Corporation
Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications. Indium6.6HF exhibits... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.
- Approvals / Conformance: J-STD-006
- Solder Alloy: Lead Free