Strip / Sheet / Foil Filler Alloys and Consumables
from Indium Corporation
Indium Corporation is the leading global supplier of commercial indium, high purity indium, indium fabrications, alloys, and chemicals. Indium metal is extracted from indium-bearing ore and is refined to various grades in high volume utilizing state of the art SPC controlled refining technologies. [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.; Strip, sheet or foil; Solid wire or rod; Hollow wire or metal cored filler
- Solder Alloy: Indium Alloy Solders
from Morgan Advanced Materials
The Wesgo Metals business of Morgan Technical Ceramics manufactures and supplies high-purity, low vapour pressure brazing alloys in various forms. Precious and non-precious alloys are available in atomized powder, discs, evaporation slugs, extrudable paste, FlexibrazeTM, preforms, ribbon, rings,... [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Melting Range: 1469 to 2017
from Lucas Milhaupt Global Brazing Solutions
Aluminum brazing and soldering filler metals are used to join materials within the aluminum family of alloys. These materials are available in wire, strip, powder, paste (both corrosive and non-corrosive formulations) and preformed rings and shapes. Lucas-Milhaupt also offers aluminum flux-cored... [See More]
- Joining Process / Product Form: Braze or solder in the form of a paste.; Powder; Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.; Strip, sheet or foil; Solid wire or rod; Flux Cored Wire
- Melting Range: 1085
- Applications / Materials Joined: Aluminum Alloys
- Braze Alloy: Aluminum Alloy Braze
from Belmont Metals, Inc.
Brazing Alloys. Featuring Holtite Alloys and Miter-Al-Braze Alloys for Aluminum Metal Joining. Brazing is a metal joining process whereby a filler metal is heated above the melting point and distributed between two or more close fitting parts by capillary action. The filler metal is brought slightly... [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Braze Alloy: Holtite Alloys, Miter-Al Braze Alloys and Proprietary Alloys
- Applications / Materials Joined: Aluminum
from ESAB Welding and Cutting Products
Features. OK Band NiCrMo3 is a nickel-based strip for submerged arc or electroslag strip cladding. Together with OK Flux 10.11 for electroslag welding or OK Flux 10.16 for subarc welding, produces a weld overlay with good corrosion resistance and high-temperature properties. Industries. Nuclear. [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Welding Filler Types: Hardfacing / Repair Alloy; Nickel Alloy
- Applications / Materials Joined: Welding-ESW - Electro-Slag Welding, Welding-SAW - Submerged Arc Welding
- Nominal Composition: P - %, Si 0.10 %, Mn 0.30 %, C <0.1 %, Mo 9 %, Ni >58.0 %, Cr 22 %, S - %, Fe <2.0 %, N 0.05 %
from Indium Corporation
A low temperature lead-free alloy that is more malleable than BiSn. Alloy: 57Bi 42Sn 1.0Ag. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 140 ºC. Solidus Melting Temperature: 139 ºC. Pb-Free: Yes [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Solder Alloy: Tin-Silver Alloy Solder (Sn-Ag); Lead Free
- Diameter / Thickness: 0.0020
- Nominal Composition: 57Bi-42Sn-1Ag
from Indium Corporation
Pure indium ribbon is ideal for sealing, cryogenic applications, and joining many non-metals. Indium ribbon also makes an excellent thermal interface and allows for CTE mismatch. It can easily be cut into a variety of shapes and sizes. Alloy: 99.99 Indium. Size: 1.00" x .002". Quantity: 3 ft Spool. [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Nominal Composition: 99.99In
- Solder Alloy: Indium Alloy Solders
from Indium Corporation
Indium-lead ribbon minimizes gold leaching characteristics and has good thermal fatigue properties. Alloy: 60In 40Pb. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 181 ºC. Solidus Melting Temperature: 173 ºC. Pb-Free: No [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Solder Alloy: Indium Alloy Solders
- Diameter / Thickness: 0.0020
- Nominal Composition: 60In-40Pb
from Indium Corporation
Indium-lead-silver ribbon is good for soldering to gold because it minimizes gold leaching. It also has good thermal fatigue properties. Alloy: 80In 15Pb 5Ag. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 154 ºC. Solidus Melting Temperature: 149 ºC. Pb-Free: No [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Nominal Composition: 80In-15Pb-5Ag
- Solder Alloy: Indium Alloy Solders
from Indium Corporation
Indium-silver ribbon has nearly the wettability, thermal conductivity, and low temperature malleability of indium. Good for thermal interfaces requiring more creep resistance than pure indium. Alloy: 97In 3Ag. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 143 ºC... [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Nominal Composition: 97In-3Ag
- Solder Alloy: Indium Alloy Solders
from Indium Corporation
Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 183 ºC Eutectic. Solidus Melting Temperature: 183 ºC Eutectic. Pb-Free: No [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
- Diameter / Thickness: 0.0020
- Nominal Composition: 63Sn-37Pb
from Indium Corporation
Widely used solder for electronics. Good for silver metallization. Has improved strength and fatigue properties. Alloy: 62Sn 36Pb 2Ag. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 179 ºC Eutectic. Solidus Melting Temperature: 179 ºC Eutectic. Pb-Free: No [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
- Diameter / Thickness: 0.0020
- Nominal Composition: 62Sn-36Pb-2Ag
from Indium Corporation
This alloy has excellent thermal fatigue properties; good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 221 ºC Eutectic. Solidus Melting Temperature: 221 ºC Eutectic. Pb-Free: Yes [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Nominal Composition: 96.5Sn-3.5Ag
- Solder Alloy: Tin-Silver Alloy Solder (Sn-Ag)
from Indium Corporation
Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu. Size: 1.00" x .002". Quantity: 3 ft Spool. Liquidus Melting Temperature: 220 ºC. Solidus Melting Temperature: 217 ºC. Pb-Free: Yes [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Solder Alloy: Tin-Silver Alloy Solder (Sn-Ag); Lead Free
- Diameter / Thickness: 0.0020
- Nominal Composition: 96.55Sn-3Ag-0.5Cu
from Indium Corporation
High quality Solder Ribbon and Foil manufactured by Indium Corporation is available in many standard alloys and sizes. Material can also be custom made to your unique material and dimensional requirements. Solder Ribbon is supplied in continuous lengths and is packaged on spools. Solder Foil is... [See More]
- Joining Process / Product Form: Strip, sheet or foil
- Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free; Tin, Gold, Lead