Tin-Lead (Sn-Pb) Filler Alloys and Consumables

SOLDER WIRE, EL 1,5 % AG, 1,0M [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Diameter / Thickness: 0.0394

• Joining Process / Product Form: Solid wire or rod; Wire

Leaded Bar Solder Sn63Pb37 (63/37) Bar, 1.66 lbs (750g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361

• Joining Process / Product Form: Bar
• Nominal Composition: Sn63Pb37 (63/37)

Fair Solder Wire 0.5mm 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0197

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

SN63PB37 UP FLO-BAR 10 LB [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Bar

Fair Solder Wire 0.5mm 100g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0197

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

R500 SN63PB37 T3 86% 100G SYR [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 3.53 oz (100g)

Fair Solder Wire 1.0mm 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0394

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 26 AWG, 27 SWG Spool, 17.64 oz (500g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361

• Joining Process / Product Form: Solid wire or rod; Spool, 17.64 oz (500g)
• Nominal Composition: Sn63Pb37 (63/37)

Fair Solder Wire 1.0mm 100g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0394

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Leaded Wire Solder Sn60Pb40 (60/40) 18 AWG, 19 SWG Spool, 1 lb (454 g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361 to 374

• Joining Process / Product Form: Solid wire or rod; Spool, 1 lb (454 g)
• Nominal Composition: Sn60Pb40 (60/40)

Trilence 2708,0.5mm Solder Wire 500g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Diameter / Thickness: 0.0197

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Leaded Rosin Activated (RA) Wire Solder Sn60Pb40 (60/40) 17 AWG, 18 SWG Tube, 0.71 oz (20g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 360

• Joining Process / Product Form: Solid wire or rod; Tube, 0.71 oz (20g)
• Nominal Composition: Sn60Pb40 (60/40)

Trilence 2708,0.7mm Solder Wire 500g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Diameter / Thickness: 0.0276

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

No-Clean Solder Paste Sn63Pb37 (63/37) Syringe, 0.53 oz (15g), 5cc [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc

Trilence 3505,0.5mm Solder Wire 500g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Diameter / Thickness: 0.0197

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

No-Clean Solder Paste Sn63Pb37 (63/37) Syringe, 1.23 oz (35g), 10cc [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc

Trilence 3505,0.7mm Solder Wire 500g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Diameter / Thickness: 0.0276

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Syringe, 0.53 oz (15g), 5cc [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361

• Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc
• Nominal Composition: Sn63Pb37 (63/37)

Kristall 511 0.5 Sn95Ag4CU1 Solder 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Diameter / Thickness: 0.0197

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361

• Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)
• Nominal Composition: Sn63Pb37 (63/37)

Kristall 511 0.7 Sn95Ag4CU1 Solder 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Diameter / Thickness: 0.0276

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Syringe, 1.23 oz (35g), 10cc [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361

• Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc
• Nominal Composition: Sn63Pb37 (63/37)

Kristall 511 1.0 Sn95Ag4CU1 Solder 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Diameter / Thickness: 0.0394

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 1.76 oz (50g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361

• Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)
• Nominal Composition: Sn63Pb37 (63/37)

Kristall 511 0.5mm SN99CU1 Solder 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0197

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Water Soluble Solder Paste Sn63Pb37 (63/37) Syringe, 0.53 oz (15g), 5cc [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc

Kristall 511 0.7mm SN99CU1 Solder 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0276

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Water Soluble Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)

Kristall 511 1.0mm SN99CU1 Solder 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0394

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Water Soluble Solder Paste Sn63Pb37 (63/37) Syringe, 1.23 oz (35g), 10cc [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc

Sn100e Water Soluble 33 Flux Core 081mm [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Diameter / Thickness: 0.0319

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Water Soluble Solder Paste Sn63Pb37 (63/37) Jar, 1.76 oz (50g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)

Tip Tinner LEAD FREE [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
• Melting Range: 430

• Joining Process / Product Form: Solid wire or rod; Wire
• Approvals / Conformance: RoHS Compliant

Rosin Mildly Activated (RMA), Water Soluble Solder Paste Sn63Pb37 (63/37) Syringe, 0.53 oz (15g), 5cc [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 0.53 oz (15g), 5cc

Leaded Rosin Mild Solder 0.5mm 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0197

• Joining Process / Product Form: Solid wire or rod; Wire

Rosin Mildly Activated (RMA), Water Soluble Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)

Leaded Rosin Mild Solder 0.5mm 500g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0197

• Joining Process / Product Form: Solid wire or rod; Wire

Rosin Mildly Activated (RMA), Water Soluble Solder Paste Sn63Pb37 (63/37) Syringe, 1.23 oz (35g), 10cc [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Syringe, 1.23 oz (35g), 10cc

Leaded Rosin Mild Solder 0.7mm 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0276

• Joining Process / Product Form: Solid wire or rod; Wire

Rosin Mildly Activated (RMA), Water Soluble Solder Paste Sn63Pb37 (63/37) Jar, 1.76 oz (50g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)

Leaded Rosin Mild Solder 0.7mm 500g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0276

• Joining Process / Product Form: Solid wire or rod; Wire

Bar Solder Sn60Pb40 (60/40) Bar, 1 lb (454g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361 to 370

• Joining Process / Product Form: Bar
• Nominal Composition: Sn60Pb40 (60/40)

Leaded Rosin Mild Solder 1.0mm 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0394

• Joining Process / Product Form: Solid wire or rod; Wire

Leaded Bar Solder Sn63Pb37 (63/37) Bar, 0.5 lb (266.79g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63Pb37 (63/37)

• Joining Process / Product Form: Bar

Leaded Rosin Mild Solder 1.0mm 500g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0394

• Joining Process / Product Form: Solid wire or rod; Wire

Bar Solder Sn63Pb37 (63/37) Bar, 1 lb (454g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361

• Joining Process / Product Form: Bar
• Nominal Composition: Sn63Pb37 (63/37)

Leaded Rosin Mild Solder 1.2mm 500g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0472

• Joining Process / Product Form: Solid wire or rod; Wire

Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 24 AWG, 25 SWG Spool, 2 oz (56.70g) [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Melting Range: 361

• Joining Process / Product Form: Solid wire or rod; Spool, 2 oz (56.70g)
• Nominal Composition: Sn63Pb37 (63/37)

Leaded Rosin Mild Solder 1.57mm 250g [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0618

• Joining Process / Product Form: Solid wire or rod; Wire

Indium Corporation manufactures bar solder specifically to surpass the strict quality demands of the surface mount industry in order to provide more consistent and reliable performance. Bar solder is available in a full range of SnPb and Pb-free alloys, including industry standard Sn63, and SAC305. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Lead Free
• Approvals / Conformance: ASTM / UNS; JIS; RoHs, J-Std

• Joining Process / Product Form: Bar Solder
• Specific Standard / AWS Class: ASTM B-32, J-Std 006, JIS Z 3282

Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste, powder or... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Joining Process / Product Form: Braze or solder in the form of a paste.; Powder; Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.; Strip, sheet or foil; Solid wire or rod

• Applications / Materials Joined: Copper, Ferrous Alloys
• Melting Range: 460

Features. A 50/50 lead/tin solder for sealing, joining or tinning most common metals, except aluminum. Can be used with soldering iron or torch. Working temperature is 360 °F to 375 °F. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Tensile Strength (UTS): 6000

• Joining Process / Product Form: Braze or solder in the form of a paste.

Solders. Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders. Soldering is a process in which two or more metal items are joined together by melting and flowing a... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Joining Process / Product Form: 1/4 lb Capping Bar

• Applications / Materials Joined: Electronics, Plating, Plumbing

Known as Multicore C400 Flux Cored Wire ). LOCTITE C 400 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. Multicore C400 wires provide fast soldering on copper, brass and solder coated materials. It is availalble in several alloys:... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Lead Free; SnCu
• Approvals / Conformance: IPC/J-STD-004 Classification - ROLO

• Joining Process / Product Form: Solid wire or rod

Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are rectangular in shape (1.66 lbs./ each). 15 bars per box. 25 lbs. per box Minimum order quantity is 25 lbs. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: 63Sn-37Pb

• Joining Process / Product Form: Bar

InTEGRATED ® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform separation. Applications. InTEGRATED ® Solder Preforms save assembly time and labor costs by allowing... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag); Indium Alloy Solders

• Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.

Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components make this increasingly difficult. Solder Fortification ® Preforms can... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free

• Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.

Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free; Gold-Tin, Bismuth Alloys
• Diameter / Thickness: 1.00E-3 to 0.2500

• Joining Process / Product Form: Solid wire or rod
• Nominal Composition: 52In/48Sn, 58Bi/42Sn, 97In/3Ag, 80In/15Pb/5Ag, 100In, 70Sn/18Pb/12In, 70In/30Pb

High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. Additional diameters and alloys are available - please call 1-800-4-INDIUM. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0320

• Joining Process / Product Form: Flux Cored Wire
• Fluxes & Cleaners: Soldering Flux / Rosin

High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. Additional diameters and alloys are available - please call 1-800-4-INDIUM. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0620

• Joining Process / Product Form: Flux Cored Wire
• Fluxes & Cleaners: Soldering Flux / Rosin

High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0320

• Joining Process / Product Form: Flux Cored Wire
• Fluxes & Cleaners: Soldering Flux / Rosin

High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0620

• Joining Process / Product Form: Flux Cored Wire
• Fluxes & Cleaners: Soldering Flux / Rosin

High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0320

• Joining Process / Product Form: Flux Cored Wire
• Fluxes & Cleaners: Soldering Flux / Rosin

High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0620

• Joining Process / Product Form: Flux Cored Wire
• Fluxes & Cleaners: Soldering Flux / Rosin

High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0320

• Joining Process / Product Form: Flux Cored Wire
• Fluxes & Cleaners: Soldering Flux / Rosin

High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Diameter / Thickness: 0.0620

• Joining Process / Product Form: Flux Cored Wire
• Fluxes & Cleaners: Soldering Flux / Rosin

Indium Corporation has developed a range of flux-cored wire solutions to meet the needs of virtually every electrical and non-critical electronic assembly and rework operation. Flux-cored wire solutions are created when the desired alloy, cored wire flux, and flux percentage are combined into a... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Lead Free; High Lead
• Nominal Composition: SnPb <80% Pb, Pb-Free Alloys, High Lead >80%

• Joining Process / Product Form: Flux Cored Wire
• Approvals / Conformance: IPC J-STD-004/B

NC-SMQ92J is a halide free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue. The residue is easily penetrated and will not clog multi-point probes. In addition, NC-SMQ92J offers excellent wetting, unsurpassed stencil life, and consistent fine pitch deposition. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: 63Sn-37Pb

• Joining Process / Product Form: Braze or solder in the form of a paste.

Indium9.52 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Indium9.52 is formulated for reflow in nitrogen... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: 63Sn/37Pb, 62Sn/36Pb/2Ag, 62.6Sn/37Pb/0.4Ag, 95.5 Sn/3.8Ag/0.7Cu, 96.5Sn/3.0Ag/0.5Cu,

• Joining Process / Product Form: Braze or solder in the form of a paste.
• Approvals / Conformance: ANSI/JSTD-004/5

Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Normally used with high temperature alloys,... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn10/Pb88/Ag2, Sn5/Pb92.5/Ag2.5, Sn5/Pb95, Sn5/Pb85/Sb10

• Joining Process / Product Form: Braze or solder in the form of a paste.
• Approvals / Conformance: J-STD-004, J-STD-005

Indium9.72-HF is a dispensing solder paste designed and formulated specifi cally for die attach processes. The fl ux vehicle is completely free of halides and halogens to eliminate halogen-corrosion of wirebond pads and for improved environmental compliance. Normally used with high temperature... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Lead-Gold

• Joining Process / Product Form: Braze or solder in the form of a paste.

NC-SMQ ®71 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. NC-SMQ ®71 is formulated for reflow in... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Lead-Gold
• Nominal Composition: Sn10/Pb88/Ag2, Sn5/Pb92.5/Ag2.5, Sn5/Pb95

• Joining Process / Product Form: Braze or solder in the form of a paste.
• Approvals / Conformance: J-STD-004A, J-STD-005

NC-SMQ ®75 is a halogen-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0.4% of paste or <5% of flux vehicle. It is designed for reflow in a nitrogen atmosphere of 100-ppm oxygen or less. This product has superior wetting capabilities compared to most... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn10/Pb88/Ag2, Sn5/Pb92.5/Ag2.5 ,Sn5/Pb95, Sn5/Pb85/Sb10

• Joining Process / Product Form: Braze or solder in the form of a paste.
• Approvals / Conformance: J-STD-004, J-STD-005

PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn63/Pb37

• Joining Process / Product Form: Braze or solder in the form of a paste.
• Approvals / Conformance: J-STD-004

PoP Paste Indium9.91 is a no-clean solder paste designed for use in package-on-package (0.3mm and larger) applications. PoP Paste Indium9.91 has a rheology designed to provide a long-lasting dipping process. Features: Eliminates defects due to package-warping. Air-reflow. Rheology optimized for both... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); SAC305
• Nominal Composition: Sn63/Pb37

• Joining Process / Product Form: Braze or solder in the form of a paste.
• Approvals / Conformance: J-STD-004

SMQ ®51-SC is a dispensing solder paste designed and formulated specifically for die-attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. When used with high temperature alloys, SMQ... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb)
• Nominal Composition: Sn10/Pb88/Ag2, Sn5/Pb92.5/Ag2.5, Sn5/Pb95, Sn5/Pb85/Sb10

• Joining Process / Product Form: Braze or solder in the form of a paste.
• Approvals / Conformance: J-STD-004, J-STD-005

Indium Corporation's Wafer Pastes are a nitrogen refl ow, no-clean solder pastes using Type 5 and Type 6 powder, which are specifi cally formulated for fl ip-chip attachment and CSP and wafer bumping applications. The fl ux is formulated so that it is applicable to Sn/Ag and Sn/Ag/ Cu alloy systems. [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Tin-Gold
• Nominal Composition: 95.5Sn/3.8Ag/0.7Cu, 95.5Sn/4.0Ag/0.5Cu, 96.5Sn/3.0Ag/0.5Cu, 96.5Sn/3.5Ag, 63Sn/37Pb, 95.5Sn/3.8Ag/0.7Cu

• Joining Process / Product Form: Braze or solder in the form of a paste.

Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components make this increasingly difficult. Solder Fortification ® Preforms can... [See More]

• Solder Alloy: Tin-Lead Alloy Solder (SN-Pb); Indium Alloy Solders; Lead Free

• Joining Process / Product Form: Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.