Critical Dimension / Trench Geometry Semiconductor Metrology Instruments
from Zygo Corporation
The APM650 ™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral... [See More]
- Measurements: Critical dimensions or Trench geometry; Flatness; Roughness / Waviness; Area mapping; DepthProfiling
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: Interferometer
from Phenom-World BV
The Phenom Pro desktop SEM is one of the most advanced imaging models in the Phenom series. With its long-life high-brightness CeB6 electron source, the Phenom Pro creates state-of-the-art images with a minimum of user maintenance intervention. The backscattered-electron detector (BSED) and... [See More]
- Measurements: Composition; Defects, dimples or film residues; Critical dimensions or Trench geometry; Particle contamination; Roughness / Waviness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: FIB
from Park Systems, Inc.
Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]
- Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
from MicroSense, LLC
The SigmaTech UltraMap-TSV system is the world ’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer —up to 300mm in diameter. The UltraMap-TSV system can be offered in class-1... [See More]
- Measurements: Critical dimensions or Trench geometry; TSV
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Applications: Wafer
from Phenom-World BV
The Phenom ProX desktop scanning electron microscope is the ultimate all-in-one imaging and X-ray analysis system. With the Phenom ProX desktop SEM, sample structures can be physically examined and their elemental composition determined. Viewing three-dimensional images of microscopic structures... [See More]
- Measurements: Composition; Defects, dimples or film residues; Critical dimensions or Trench geometry; Particle contamination; Roughness / Waviness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: FIB
from Park Systems, Inc.
Atomic Force Microscopy (AFM) is emerging as an essential tool in many industries. With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, the AFM is becoming an essential tool choice in applications involving surface roughness, trench width, depth, sidewall... [See More]
- Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM