Defects / ADC Semiconductor Metrology Instruments
from SemiProbe
SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system has... [See More]
- Measurements: Defects, dimples or film residues; Device, gate or circuit electrical testing; Particle contamination; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: ProbingSystem
- Technology: Optical / Imaging
from Phenom-World BV
The Phenom Pro desktop SEM is one of the most advanced imaging models in the Phenom series. With its long-life high-brightness CeB6 electron source, the Phenom Pro creates state-of-the-art images with a minimum of user maintenance intervention. The backscattered-electron detector (BSED) and... [See More]
- Measurements: Composition; Defects, dimples or film residues; Critical dimensions or Trench geometry; Particle contamination; Roughness / Waviness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: FIB
from Nanotronics Imaging
The Nanotronics Imaging nSpec ® is an inspection device designed for high resolution microscopy and detection of wafer defects. With particular application in silicon carbide and Galium Nitride epi wafers, the nSpec ® offers fast quantification and qualification of defects with detailed... [See More]
- Measurements: Defects, dimples or film residues
- Mounting / Loading: Manual loading
- Form Factor: ProbingSystem
- Technology: Optical / Imaging
from WDI Wise Device Inc.
This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]
- Measurements: Defects, dimples or film residues; Thin Film and TFT Array Repairs
- Mounting / Loading: Floor (optional feature)
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
from Nikon Metrology
The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors. Improved wafer-sensing functions... [See More]
- Measurements: Defects, dimples or film residues
- Mounting / Loading: Floor
- Form Factor: ProbingSystem; Wafer Loading System
- Technology: Optical / Imaging
from Park Systems, Inc.
Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]
- Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
from Hiden Analytical
Static and Dynamic SIMSAuger Electron SpectroscopyIon Beam SputteringSurface Science StudiesRastering / Depth Profiling [See More]
- Measurements: Defects, dimples or film residues; Area mapping (optional feature); DepthProfiling
- Technology: FIB; Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
- Form Factor: Ion Beam Gun
- Applications: Wafer; CVD / PVD
from Phenom-World BV
The Phenom ProX desktop scanning electron microscope is the ultimate all-in-one imaging and X-ray analysis system. With the Phenom ProX desktop SEM, sample structures can be physically examined and their elemental composition determined. Viewing three-dimensional images of microscopic structures... [See More]
- Measurements: Composition; Defects, dimples or film residues; Critical dimensions or Trench geometry; Particle contamination; Roughness / Waviness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: FIB
from WDI Wise Device Inc.
The LSCM has the advantages of a confocal laser scanning microscope with the size and price of an IR camera. The combination of high contrast imaging, infrared capabilities, extremely small size and low cost enables many new applications. [See More]
- Measurements: Defects, dimples or film residues; FilmThickness; Area mapping; Mask Alignment
- Technology: Optical / Imaging
- Form Factor: Monitor or instrument
- Applications: Wafer; CVD / PVD; Packaged IC or substrate; Photolithography
from Park Systems, Inc.
XE-HDM is an automatic defect review AFM which revolutionizes the way defects in HDD substrates and media are searched, scanned, and analyzed. The new XE-HDM significantly increases throughput for the defect review process; test runs with real defects demonstrate over 500 - 800% gain in throughput... [See More]
- Measurements: Defects, dimples or film residues
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
from Hiden Analytical
Low power, high brightness, surface ionisation source coupled to a compact ion column, providing high performance in a small package. [See More]
- Measurements: Defects, dimples or film residues; Area mapping (optional feature); DepthProfiling
- Technology: FIB; Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
- Form Factor: Ion Beam Gun
- Applications: Wafer; CVD / PVD