Thickness - Wafer / Disc (TTV) Semiconductor Metrology Instruments
from MicroSense, LLC
Benchtop, automated Thickness measurement systems. Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution). Wafer 2 ” to 4 ” (50 to 100mm). Thickness range: 50um to 3mm. Throughput up to 100W/hours. 2D & 3D... [See More]
- Measurements: WaferThickness
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
from MTI Instruments Inc.
The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII ’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow,... [See More]
- Measurements: Flatness; Roughness / Waviness; WaferThickness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: ProbingSystem; Sensor or sensing element
- Technology: Capacitance or electromagnetic gage
from MicroSense, LLC
Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8 ” round and for square wafers up to 156mmx156mm. Dual white light chromatic coding probe technology with 10nm resolution. Thickness range from 50um to 1mm. Automated calibration. Hiscan option for... [See More]
- Measurements: WaferThickness
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
from MTI Instruments Inc.
The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent... [See More]
- Measurements: Flatness; Roughness / Waviness; WaferThickness; Area mapping
- Mounting / Loading: Manual loading
- Form Factor: ProbingSystem; Sensor or sensing element
- Technology: Capacitance or electromagnetic gage
from MicroSense, LLC
Automated Wafer Thickness Measurement System. Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution). Wafer 4 ” to 12 ” (100 to 300mm). Thickness range: 50um to 3mm. Extended warpage range up to 5mm. Throughput... [See More]
- Measurements: Roughness / Waviness (optional feature); WaferThickness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
from MicroSense, LLC
Automated Thickness measurement system. IR interferometry probe technology. Single or dual probes. Manual Loading. 0.5um accuracy. 0.1um resolution. Wafer 4" to 12" (100 to 300mm) round or square. Thickness range: 20um to 1mm. Flexible recipe generation. 2D & 3D mapping capability. SECS/GEM... [See More]
- Measurements: Flatness; WaferThickness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Interferometer