Non-destructive Semiconductor Metrology Instruments
from Zygo Corporation
The APM650 ™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral... [See More]
- Form Factor: Monitor or instrument
- Technology: Interferometer
- Mounting / Loading: Manual loading
- Applications: Wafer
from Xenemetrix Ltd.
EX-6600 SDD. Secondary Target EDXRF. Xenemetrix ’s EX-6600 SDD Energy Dispersive X-ray Fluorescence (EDXRF) spectrometer offers the ultimate in sensitivity and selectivity. The Silicon Drift Detector (SDD) simultaneously delivers lower electronic noise and higher count rates which translates... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Mounting / Loading: Manual loading; Floor
- Applications: Wafer; CVD / PVD; Electroplate
from KEYENCE
SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Interferometer
- Mounting / Loading: In-line; Floor
- Applications: Wafer; Packaged IC or substrate
from Unitron Ltd.
Modular microscope system that readily adapts to instrumentation [See More]
- Form Factor: Mask Aligner
- Applications: Wafer
- Technology: Optical / Imaging
- Features: Noncontact; Non-destructive
from Park Systems, Inc.
Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
- Mounting / Loading: Floor
- Applications: Wafer
from Hitachi High-Tech America
Microspot XRF coating thickness and materials analyzers for rapid quality control and validation testing, making it easy to get the right results in seconds. Coating thickness and materials analysis based on X-ray fluorescence (XRF) is a widely accepted and industry-proven analytical technique,... [See More]
- Form Factor: Monitor or instrument
- Technology: X-ray Diffractometer
- Mounting / Loading: Manual loading
- Applications: Wafer; Electroplate
from StellarNet, Inc.
TF Systems for Non-Contact Film Thickness Measurements. We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry systems consist of a portable USB... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer (optional feature); CVD / PVD (optional feature); Polishing / CMP (optional feature); Polymer or photoresist films (optional feature); Thin-Film Photovoltaics
- Technology: Reflectometer
- Measurements: FilmThickness (optional feature); WaferThickness (optional feature)
from Nikon Metrology
The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors. Improved wafer-sensing functions... [See More]
- Form Factor: ProbingSystem; Wafer Loading System
- Technology: Optical / Imaging
- Mounting / Loading: Floor
- Applications: Wafer
from MTI Instruments Inc.
The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII ’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow,... [See More]
- Form Factor: ProbingSystem; Sensor or sensing element
- Technology: Capacitance or electromagnetic gage
- Mounting / Loading: Manual loading
- Applications: Wafer
from Filmetrics, Inc.
Automated Cassette-to-Cassette Thin-Film Thickness Mapping System for Production Environments. The Filmetrics F60-c family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These include automatic... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer; CVD / PVD
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
- Measurements: Area mapping
from WDI Wise Device Inc.
WDI's Laser Auto-Focus ATF6 sensor is an active optical device (incorporating a class II semiconductor laser) designed to provide focusing servo systems with fast feedback signals needed to quickly and accurately focus all types of infinity corrected microscopes. [See More]
- Form Factor: Sensor or sensing element
- Applications: Wafer; CVD / PVD; Photolithography
- Technology: Optical / Imaging
- Features: Noncontact; Non-destructive
from Xenemetrix Ltd.
RoHS Vision. The Fast and Easy Method for Ensuring Compliance. with Regulations for Hazardous Substances. The Restriction of Hazardous Substances Directive (RoHS) restricts toxic metals in electrical and electronic equipment. Xenemetrix ’s new RoHS Vision uses a high resolution detector, a... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Mounting / Loading: Manual loading; Floor
- Applications: Wafer; CVD / PVD; Electroplate
from KEYENCE
LT-9000 Surface Scanning Laser Confocal Sensor. The LT-9000 Surface Scanning Laser Confocal Displacement Meter excels in measuring micron-level defects or thicknesses without being affected by target color or angle. The confocal principle requires only that the light reflect off a surface and be... [See More]
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Confocal
- Mounting / Loading: In-line; Floor
- Applications: Wafer; Packaged IC or substrate
from Park Systems, Inc.
XE-HDM is an automatic defect review AFM which revolutionizes the way defects in HDD substrates and media are searched, scanned, and analyzed. The new XE-HDM significantly increases throughput for the defect review process; test runs with real defects demonstrate over 500 - 800% gain in throughput... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
- Mounting / Loading: Floor
- Applications: Wafer
from MTI Instruments Inc.
The Proforma 300i wafer thickness gage is a capacitance based, differential measurement system that performs non-contact thickness measurements of semiconducting and semi-insulating wafers. By utilizing MTI Push/Pull technology, the Proforma 300i does not require the wafers to have a consistent... [See More]
- Form Factor: ProbingSystem; Sensor or sensing element
- Technology: Capacitance or electromagnetic gage
- Mounting / Loading: Manual loading
- Applications: Wafer
from Filmetrics, Inc.
Automated Film Thickness Mapping. The Filmetrics F50 family of products can map film thickness as quickly as two points per second. A motorized R-Theta stage accepts standard and custom chucks for samples up to 450mm in diameter. Map patterns can be polar, rectangular, or linear, or you can create... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer; CVD / PVD
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
- Measurements: Area mapping
from WDI Wise Device Inc.
The LSCM has the advantages of a confocal laser scanning microscope with the size and price of an IR camera. The combination of high contrast imaging, infrared capabilities, extremely small size and low cost enables many new applications. [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer; CVD / PVD; Packaged IC or substrate; Photolithography
- Technology: Optical / Imaging
- Measurements: Defects, dimples or film residues; FilmThickness; Area mapping; Mask Alignment
from Xenemetrix Ltd.
X-Calibur SDD. Bench Top EDXRF Spectrometer. versatile, high energy resolution. Our X-Calibur SDD EDXRF spectrometer features similar configuration like X-Calibur but with Silicon Drift Detector. Thanks to SDD high count rates the instrument improves its response time thus minimizing down time. The... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Mounting / Loading: Manual loading; Floor
- Applications: Wafer; CVD / PVD; Electroplate
from KEYENCE
LK-G5000 High-Speed / High-Accuracy Laser Displacement Sensor. The LK-G5000 is a High-Speed 1D Laser Displacement Sensor for precision displacement measurement. With a sampling speed of 392 kHz, this sensor is able keep up with just about any inline process as well as account for vibration for... [See More]
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Laser Triangulation
- Mounting / Loading: In-line; Floor
- Applications: Wafer; Packaged IC or substrate
from Park Systems, Inc.
Atomic Force Microscopy (AFM) is emerging as an essential tool in many industries. With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, the AFM is becoming an essential tool choice in applications involving surface roughness, trench width, depth, sidewall... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
- Mounting / Loading: Floor
- Applications: Wafer
from Filmetrics, Inc.
Automated Thickess Mapping for Production Environments. The Filmetrics F60-t family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These include automatic notch finding, automatic on-board... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer; CVD / PVD
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
- Measurements: Area mapping
from WDI Wise Device Inc.
The LLC6 is a precise linear lens changer with 6 lens ports providing ultra fast, automatic lens changing without the need of re-qualifying the lens. It is the ideal tool for TFT-LCD and Photomask Inspection/Repair applications or other tasks where multiple optical magnifications are required. The... [See More]
- Form Factor: Lens Changer
- Features: Noncontact; Non-destructive
- Applications: Wafer