Interferometer Semiconductor Metrology Instruments
from Zygo Corporation
The APM650 ™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral... [See More]
- Technology: Interferometer
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Applications: Wafer
from KEYENCE
SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]
- Technology: Interferometer
- Mounting / Loading: In-line; Floor
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Applications: Wafer; Packaged IC or substrate
from MicroSense, LLC
Automated Thickness measurement system. IR interferometry probe technology. Single or dual probes. Manual Loading. 0.5um accuracy. 0.1um resolution. Wafer 4" to 12" (100 to 300mm) round or square. Thickness range: 20um to 1mm. Flexible recipe generation. 2D & 3D mapping capability. SECS/GEM... [See More]
- Technology: Interferometer
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Applications: Wafer