Profilometer / AFM Semiconductor Metrology Instruments

5 Results
XE-3DM
from Park Systems, Inc.

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]

  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer
XE-HDM
from Park Systems, Inc.

XE-HDM is an automatic defect review AFM which revolutionizes the way defects in HDD substrates and media are searched, scanned, and analyzed. The new XE-HDM significantly increases throughput for the defect review process; test runs with real defects demonstrate over 500 - 800% gain in throughput... [See More]

  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer
XE-LCD
from Park Systems, Inc.

Atomic Force Microscopy (AFM) is emerging as an essential tool in many industries. With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, the AFM is becoming an essential tool choice in applications involving surface roughness, trench width, depth, sidewall... [See More]

  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer
XE-PTR
from Park Systems, Inc.

Hard Disk Drive (HDD) manufacturers can now reliably depend on Park Systems ’ XE-PTR, a fully automated industrial in-line AFM for automatic Pole Tip Recession measurements on rowbar-level sliders. As most HDD manufacturers are turning to PMR (Perpendicular Magnetic Recording), sub-nano scale... [See More]

  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer
XE-WAFER
from Park Systems, Inc.

The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology over any other system in the... [See More]

  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer