Thickness - Film / Layer Semiconductor Metrology Instruments
from Rigaku Corporation
Rigaku's WaferX 300 represents the culmination of 25 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates "bridge tool" technology — servicing 6", 8", as well as the latest 12"... [See More]
- Measurements: Composition; FilmThickness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); WDXRF
from KEYENCE
SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]
- Measurements: Flatness; FilmThickness
- Mounting / Loading: In-line; Floor
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Interferometer
from Filmetrics, Inc.
The Most Powerful Tool Available for Monitoring Thin-Film Deposition. Measure deposition rates, film thickness, optical constants (n and k), and uniformity of semiconductors and dielectric layers in real-time with the F30 spectral reflectance system. Example Layers. MBE and MOCVD: Smooth and... [See More]
- Measurements: Optical constants (n or k); FilmThickness
- Mounting / Loading: In-line
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
from WDI Wise Device Inc.
The LSCM has the advantages of a confocal laser scanning microscope with the size and price of an IR camera. The combination of high contrast imaging, infrared capabilities, extremely small size and low cost enables many new applications. [See More]
- Measurements: Defects, dimples or film residues; FilmThickness; Area mapping; Mask Alignment
- Technology: Optical / Imaging
- Form Factor: Monitor or instrument
- Applications: Wafer; CVD / PVD; Packaged IC or substrate; Photolithography
from Hitachi High-Tech America
Microspot XRF coating thickness and materials analyzers for rapid quality control and validation testing, making it easy to get the right results in seconds. Coating thickness and materials analysis based on X-ray fluorescence (XRF) is a widely accepted and industry-proven analytical technique,... [See More]
- Measurements: Composition; FilmThickness
- Mounting / Loading: Manual loading
- Form Factor: Monitor or instrument
- Technology: X-ray Diffractometer
from Rigaku Corporation
The Rigaku MFM65 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks. The... [See More]
- Measurements: Composition; Particle contamination; FilmThickness; Roughness / Waviness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Reflectometer; X-ray Diffractometer; XRR, XRF, XRD
from KEYENCE
LT-9000 Surface Scanning Laser Confocal Sensor. The LT-9000 Surface Scanning Laser Confocal Displacement Meter excels in measuring micron-level defects or thicknesses without being affected by target color or angle. The confocal principle requires only that the light reflect off a surface and be... [See More]
- Measurements: Flatness; FilmThickness
- Mounting / Loading: In-line; Floor
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Confocal
from Filmetrics, Inc.
Measure film thickness in-line and in real-time at up to seven locations with the F37. Example Layers. Almost any smooth and at-least-partially transparent films may be measured. This includes virtually any semiconducting material, including those used in thin-film photovoltaics. Example Layers. MBE... [See More]
- Measurements: FilmThickness
- Mounting / Loading: In-line
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
from Rigaku Corporation
The WDA-3650 X-ray fluorescence spectrometer for thin film evaluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film thickness, film... [See More]
- Measurements: Composition; FilmThickness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); WDXRF
from KEYENCE
LK-G5000 High-Speed / High-Accuracy Laser Displacement Sensor. The LK-G5000 is a High-Speed 1D Laser Displacement Sensor for precision displacement measurement. With a sampling speed of 392 kHz, this sensor is able keep up with just about any inline process as well as account for vibration for... [See More]
- Measurements: Flatness; FilmThickness
- Mounting / Loading: In-line; Floor
- Form Factor: Monitor or instrument; Controller; Sensor or sensing element
- Technology: Laser Triangulation