Shape / Flatness Semiconductor Metrology Instruments Datasheets

Semi-Automated Wafer Measurement System -- Proforma™ 300SA
from MTI Instruments Inc.

The Proforma 300SA is a benchtop/desktop, semi-automated wafer measurement system for semi-conducting and semi-insulating materials. Based on MTII ’s exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning for thickness, thickness variation, bow,... [See More]

  • Measurements: Flatness; Roughness / Waviness; WaferThickness; Area mapping
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem; Sensor or sensing element
  • Technology: Capacitance or electromagnetic gage
Packaging Metrology System -- APM650™
from Zygo Corporation

The APM650 ™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral... [See More]

  • Measurements: Critical dimensions or Trench geometry; Flatness; Roughness / Waviness; Area mapping; DepthProfiling
  • Mounting / Loading: Manual loading
  • Form Factor: Monitor or instrument
  • Technology: Interferometer
Tropel® FlatMaster® -- FlatMaster® Wafer
from Corning Specialty Materials

Ideal for processes development, particularly for new, non-silicon material [See More]

  • Measurements: Flatness; FilmThickness; WaferThickness; Area mapping
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Interferometer
Semiconductor Metrology Instruments - Spectral Interference Laser Displacement Meter -- SI-F01
from KEYENCE

SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]

  • Measurements: Flatness; FilmThickness
  • Mounting / Loading: In-line; Floor
  • Form Factor: Monitor or instrument; Controller; Sensor or sensing element
  • Technology: Interferometer
Ultra Gage -- 9500
from KLA-Tencor Corporation

Multi-tool functionality including thickness, shape stress, global and site flatness measurements. Measures 8,700 data points in under 60 seconds. Thin film stress on patterned or monitor wafers. Wide range of options including wafer typing. The 9500 UltraGage is a versatile, multifunctional... [See More]

  • Measurements: Flatness; Microstructure or crystal structure; WaferThickness
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Technology: Capacitance or electromagnetic gage
SigmaTech Wafer Metrology Systems -- UltraMap-300IR
from MicroSense, LLC

Automated Thickness measurement system. IR interferometry probe technology. Single or dual probes. Manual Loading. 0.5um accuracy. 0.1um resolution. Wafer 4" to 12" (100 to 300mm) round or square. Thickness range: 20um to 1mm. Flexible recipe generation. 2D & 3D mapping capability. SECS/GEM... [See More]

  • Measurements: Flatness; WaferThickness
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Interferometer