B

BACK END: In semiconductor manufacturing the point at which all wafer processing has been completed and testing, assembly and packaging begins.
BAKE: Subjecting a part, package, board, substrate or an assembly to an elevated temperature. Used primarily to drive off moisture or contaminants, e.g. organics, or assess quality of surface finish, e.g. blisters in plating. Used to react components with in a formulation, e.g. photoresist or a polymer to pre-cure or fully cure.
BALL BOND: In chip and wire assembly, a bond formed with a capillary tool where the end of the wire has first been shaped into a ball.
BALL BONDING: A wire bonding technique in which the wire is inserted into a capillary tool and by heating a ball is first formed at the end of a wire. The bond is formed between the ball and a metal pad by heating and application of pressure by the bonding tool (capillary).
BALL GRID ARRAY (BGA): A packaging technology in which a device s I/O pads are arranged as an array of conducting pads on the base of the package. Small balls of solder are attached to each conducting pad.
BALL BUMPING: The process of forming or placing bumps on packages or bare die, in wafer format or singulated, using a wire ball bonder.
BARE DIE: An unpackaged transistor, diode or integrated circuit.
BISBENZOCYCLOBUTANE (BCB): High purity polymer resins formulated as high-solids, low...

Integrated Circuit Packaging, Assembly and Interconnections