ACA Anisotropic Conductive Adhesive

ACF Anisotropic Conductive Film

APWB Advanced Printed Wiring Board

ASIC Application Specific Integrated Circuit

BBUL Bumpless Build Up Layer

BCB Benzene Cyclobutene (Cyclotene)

BGA Ball Grid Array

BUT Build Up Technology

C-4 Controlled Collapse Chip Connection

C-4NP C-4 New Process

CAD Computer Aided Design

C & W Chip and Wire

CBGA Ceramic Ball Grid Array

CC Chip Carrier

CMOS Complimentary Metal Oxide Semiconductor

CMP Chemical Mechanical Polishing

COB Chip On Board

CSP Chip Scale Package

DCA Direct Chip Attach

DIP Dual Inline Package

DRAM Dynamic Random Access Memory

ECBU Embedded Chip Build Up

ESD Electro Static Discharge

FC Flip Chip

FCA Flip Chip Assembly

FCM Few Chip Module

FCOB Flip Chip On Board

FCIP Flip Chip In Package

FP Flat Pack

FQFP Fine Pitch Quad Flat Pack

GaAs Gallium Arsenide

HC Hybrid Circuit

HDI High Density Interconnect

HDI-PWB High Density Interconnect Printed Wiring Board

HIC Hybrid Integrated Circuit

HTCC High Temperature Cofired Ceramic

I/O Input/Output

IC Integrated Circuit

ICA Isotropic Conductive Adhesive

ILB Inner Lead Bond