Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections

William J. Greig

Consultant
Somerville, New Jersey, USA

Springer

William J. Greig
Consultant
10 Imperial Drive
Somerville, NJ 08876

Integrated Circuit Packaging, Assembly and Interconnections

Library of Congress Control Number: 2006927423

ISBN 0-387-28153-3
e-ISBN 0-387-33913-2

ISBN 9780387281537

e-ISBN 978-0387-33913-9

2007 Springer Science+Business Media LLC

All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden.

The use in this publication of trade names, trademarks, service marks and similar terms, even if the are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights.

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Dedication

To my family,

my wife Joan

and

our children, their spouses and grandchildren

Karen Christopher, Ryan, Kevin
Billy and Cathy Alli, Jeff, Shauna
Joni and Fred Danny, Kerri, Traci Jo
Jimmy and Colleen Maggie, Molly, Katie, Claire
Ronny and Meryl RJ, Connor
Steven
Kenny

About the Author

A graduate of Fordham University with a BS in Physics Bill has had extensive experience in Microelectronics...

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