From Integrated Circuit Packaging, Assembly and Interconnections


While the integrated circuit drives the packaging and assembly, the IC manufacturing process, and associated methodologies, serves as an invaluable technology resource. IC manufacturing is made up of a Front End and a Back End . The Front End encompasses the actual fabrication of the IC and is most often referred to as Wafer Fab . The Back End covers subsequent packaging, assembly, and testing of the IC. Many of the materials, the processes, procedures, and equipments, particularly those associated with the photolithography, have direct application to relevant packaging and assembly needs.

Areas of application for these types of methodologies supporting current and future IC packaging and assembly include:

  • Wafer bumping for TAB and flip chip,

  • Wafer Level Packaging (WLP) for Chip Scale Packages (CSP),

  • Interconnect Substrates for MCPs, and

  • Level 2 High Density Interconnects, HDI PWBs.

The IC photolithographic process and the above applications share the same basic technology for pattern transfer. The inherent advantages of much of the IC methodologies can best be assessed by first reviewing the various processes emphasizing some of the important lessons learned and secondly (and perhaps more importantly) their significance and impact on yields and cost-effective manufacturing.

2.1 Overview of the IC Manufacturing Processes [1 4]

An IC is fabricated in a wafer format. Multiple ICs are manufactured simultaneously on a single wafer. Today wafers are processed in 6", 8" and 12" diameters (Figure 2-1). When completed, a wafer can contain literally hundreds or thousands of ICs. Larger...

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Electronic and IC Packaging Services
Electronic packaging and IC packaging services perform the final stage of semiconductor device fabrication, places dies or boards inside of a protective package that provides connectors or pins for connecting to other devices.
Electronics Test Fixtures
Electronics test fixtures are used to test contact points on circuit boards during manual or automated testing.
IC Sockets and Headers
IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips.
RF and Wireless Chips
RF and wireless chips are integrated circuits (IC) that are designed specifically for radio frequency (RF), microwave, and other wireless communications or data transmission applications.
Semiconductor Equipment Repair Services
Semiconductor equipment repair services repair, rebuild and refurbish equipment related to the manufacture and processing of semiconductors.

Topics of Interest

3 THE IC PACKAGE [1,2] Starting with the transistor, the package has functioned as both a carrier and as an enclosure. As a carrier it allows the device s functionality to be fully accessed and to be...

Dr. Phil Garrou Dow Chemical Prof. Rao R. Tummala Georgia Institute of Technology CHAPTER OBJECTIVES Explain the reasons for wafer-level packaging Compare and contrast wafer-level packaging with...

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12 HIGH DENSITY PACKAGE/SUBSTRATE MANUFACTURING TECHNOLOGIES Successful electronics manufacturing means being responsive to the packaging and the assembly demands of both the IC and end product.

M.Chiao and L.Lin 3.1 CHAPTER SCOPE This chapter will give an overview of wafer-level sealing processes for MEMS packaging technology. The integrated sealing process using thin film materials will be...