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EDGE DEFINITION/EDGE ACUITY: The sharpness of a pattern deposited by a thick film or thin film process. See Definition.
ELECTRICAL ISOLATION: Separating two or more conductors from each other by means of a dielectric.
ELECTROLESS DEPOSITION: The deposition of an electrically conductive film from an autocatalytic plating solution without the use of electric current.
ELECTROPLATING: The deposition of an electrically conductive film from a solution (plating bath) of the ions of that metal, by means of an electric current.
ELECTRONIC PACKAGING: A process involving the interconnection of semiconductor devices into packages (single or multichip), substrates or boards to complete the manufacture of a fully functional electronic system or subsystem.
ELEMENT: A bare unpacked die typically referring to an Integrated Circuit.
ELEMENT EVALUATION: Assembly and electrical testing of a sample of bare die taken from a manufacturing lot to assess the electrical integrity (number of parts electrically good following assembly and burn-in) of the particular die lot. Also called a Lot Acceptance Test (LAT).
ELONGATION: The ratio of wire length at rupture to original length. A measure of ductility. Measured in percent.
EMBEDDED LAYER: A conductive or passive layer deposited between two di-electric layers.
EMULSION: In screen printing, the light sensitive material used to pattern coat a mesh screen. When exposed and patterned it is used for depositing distinct patterns of thick film paste that are subsequently dried and fired.

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Integrated Circuit Packaging, Assembly and Interconnections

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