F

FAILURE ANALYSIS: A process to determine reasons why a device, circuit or assembly does not meet performance specifications.
FAILURE MECHANISM: A process intended to determine cause for the failure of a device, circuit or assembly fails to meet its intended performance specifications, e.g., and open or shorted conductor trace.
FAILURE RATE: The ratio of the number of failures to the total number tested. Usually specified as %/1000 hours of operation.
FATIGUE: With solder bonds, a failure mechanism caused by exposure to repetitive levels of mechanical stress over time resulting from mismatch in thermal coefficient of expansion, e.g. a bare die and an organic substrate or board.
FEEDTHROUGH: A method of making electrical connection between both faces of a circuit board, substrate or package, e.g., a plated through-hole or through a package wall.
FILLED POLYMER: The addition of a powder (ceramic or metal) to change the thermal and/or electrical properties of the polymer e.g. silver particles to an epoxy to increase electrical conductivity or born nitride to an epoxy to improve thermal conductivity.
FILLER: The general term for any addition agent into a material to change its properties, i.e., electrical and/or thermal conductivity.
FILLET: Refers to the extension around the edge of a die from the adhesive or alloy used in bonding a die to a package, substrate or board.
FILM: Any thin layer on the surface of a substrate such as...

< Previous Excerpt Next Excerpt >

Integrated Circuit Packaging, Assembly and Interconnections