D

DEFECT: An anomaly that is in non-conformance with normally accepted characteristics.
DEFINITION: The sharpness of a deposited pattern, or the exactness with which a feature is patterned with respect to the intended design.
DEGRADATION: A debilitating change in a material characteristic or a device performance.
DENSITY: In packaging: Refers to the number of components on a circuit or board or the amount of conductor circuitry on a device package, a substrate or board.
DEVICE: A bare die (an element) or a packaged component.
DEWETTING: A condition that results when molten solder has coated a surface and upon cooling recedes leaving areas of uncovered base material.
DICE: Plural of die.
DIE: An unpackaged semiconductor, e.g. a diode, transistor or an integrated circuit, separated from a wafer. Also referred to as a bare die or a chip.
DIE ATTACH: Bonding of semiconductor die to a package/substrate. Same as die bonding.
DIE ATTACH: Adhesive attachment of a semiconductor die to a package/substrate. Can be thermally conductive or non-thermally conductive.
DIE BONDING: The process of attaching a semiconductor die to a package, substrate or board with a eutectic or solder alloy.
DIE BONDER: The machine used for die bonding.
DIELECTRIC: Any material that does not conduct electricity, an insulator, such as glass, ceramic or epoxy. Sometimes used to refer to a nonconducting ink or paste.
DIELECTRIC...

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Integrated Circuit Packaging, Assembly and Interconnections