From Integrated Circuit Packaging, Assembly and Interconnections


An anomaly that is in non-conformance with normally accepted characteristics.
The sharpness of a deposited pattern, or the exactness with which a feature is patterned with respect to the intended design.
A debilitating change in a material characteristic or a device performance.
In packaging: Refers to the number of components on a circuit or board or the amount of conductor circuitry on a device package, a substrate or board.
A bare die (an element) or a packaged component.
A condition that results when molten solder has coated a surface and upon cooling recedes leaving areas of uncovered base material.
Plural of die.
An unpackaged semiconductor, e.g. a diode, transistor or an integrated circuit, separated from a wafer. Also referred to as a bare die or a chip.
Bonding of semiconductor die to a package/substrate. Same as die bonding.
Adhesive attachment of a semiconductor die to a package/substrate. Can be thermally conductive or non-thermally conductive.
The process of attaching a semiconductor die to a package, substrate or board with a eutectic or solder alloy.
The machine used for die bonding.
Any material that does not conduct electricity, an insulator, such as glass, ceramic or epoxy. Sometimes used to refer to a nonconducting ink or paste.

Products & Services
Die Bonders

Die bonders permanently attach a semiconductor die or chip to a package or substrate.

Semiconductor Bonding Tools
Semiconductor bonding tools include tools for die bonding and wire bonding. Semiconductor bond tools are used to attach and interconnect a semiconductor die or IC chip to a package or substrate. Die bonding tools include bonding capillaries, bonding wedges, EFO wands, die attach collets, die shear tools, ejector pins or push up needles, flip chip tools, spanking tools, push-up needles (pepperpots) and tab tools (microBGA, waffle).
Electronic and IC Packaging Services
Electronic packaging and IC packaging services perform the final stage of semiconductor device fabrication, places dies or boards inside of a protective package that provides connectors or pins for connecting to other devices.
Electrical Insulation and Dielectric Materials
Electrical insulation and dielectric materials includes various forms of materials that surround and protect electrical conductors and prevent unwanted current flow, leakage or crosstalk.
Conductive Compounds
Conductive compounds provide an electrically and/or thermally conductive path between components.

Topics of Interest

E EDGE DEFINITION/EDGE ACUITY The sharpness of a pattern deposited by a thick film or thin film process. See Definition. ELECTRICAL ISOLATION Separating two or more conductors from each other by means...


B BACK END In semiconductor manufacturing the point at which all wafer processing has been completed and testing, assembly and packaging begins. BAKE Subjecting a part, package, board, substrate or an...


F FAILURE ANALYSIS A process to determine reasons why a device, circuit or assembly does not meet performance specifications. FAILURE MECHANISM A process intended to determine cause for the failure of...

Ken Gilleo Cookson Electronics 21.0 INTRODUCTION The semiconductor die or chip typically is bonded to a substrate for several critical reasons. First, an unattached die is subject to much greater...

OVERVIEW Adhesives used in the assembly of electronic circuits serve four main functions: Mechanically attach parts such as semiconductor die, components, substrates, packages, and heat sinks.

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