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INERT ATMOSPHERE: A gas atmosphere composed on one of the inert gases, i.e., non-oxidizing, non-reducing. Ar or N ₂ are most commonly used.
INFANT MORTALITY: Early device electrical failures occurring when subjected to stress conditions, e.g., burn-in testing. Electronic components are generally characterized by an initially high failure rate that decreases with increasing time. (Bathtub curve).
INJECTION MOLDING: Molding of electronic packages by forcing a heated liquid epoxy into a steel mold containing the parts to be encapsulated.
INK or PASTE: A general term for screenable thick film compositions.
INSERTION LOSS: The difference between power received at the load before and after the insertion of a device in the line.
INSPECTION LOT: A sample quantity of devices, representing a production lot, submitted at one time, to determine compliance with acceptance requirements as specified on the procurement documents.
INSULATORS: A class of materials with high insulation resistance. Also refers to thermal or electrical insulators.
INTEGRATED CIRCUIT (IC): A microcircuit or microchip. A single semiconductor die (Si, GaAs, SiGe) containing multiple transistors interconnected by a single or multiple layers of patterned conductors, each separated by a layer of dielectric. This monolithic structure may also contain passive elements as well. An IC is also referred to as microcircuit or microchip.
INTERCONNECTION: Use of conductive metal, e.g. wires, bumps and packages or substrates with embedded conductor circuitry, to electrically link a single...

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Integrated Circuit Packaging, Assembly and Interconnections

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