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HALOGENS: The elements Chlorine, Fluorine, Bromine and Iodine.
HALOGENATED SOLVENTS: Organic liquids containing one or more of the halogens. Generally used as cleaning solvents. For example, trichloroethane.
HARD SOLDER: Solders containing Au, e.g., 80%Au/20%Sn, melting point 280 C.
HARDNESS: A material property. The ability of a material to resist penetration.
HARDNESS: Property of a material to resist indentation or scratching.
HEAT SINK: A piece of high thermal conductivity material slightly larger than the component (bare die or packaged) used to conduct heat away from the heat-sensitive device. Examples are most metals and diamond.
HEEL OF THE BOND: In wire bonding, that part of the wire where deformation begins. It is noted on the first and second bond in wedge bonding and the second bond in ball bonding.
HEEL BREAK: A break in a bonded wire at the heal of the bond.
HERMETIC SEAL: Capping of a package containing an active device to provide an enclosure that maintains a controlled ambient.
HIGH TEMPERATURE CO-FIRED CERAMIC (HTCC): A monolithic multilayer ceramic package or substrate containing an embedded conductor interconnect circuit. Individual layers of ceramic with patterned conductor traces (typically tungsten or molybdenum) are processed separately, inspected, collated, stacked and co-fired at temperatures in the range of 1400 to 1600 C.
HI-K CERAMIC: A ceramic material with high dielectric constant.
HIGH PURITY ALUMINA: Alumina with over 99.9% Al ₂O

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Integrated Circuit Packaging, Assembly and Interconnections

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