C

CAMBER: The amount of bow or warpage in a board or substrate. See BOW.
CAPILLARY: In wire bonding a tool used to guide wire and to apply pressure to form a bond between the wire and a metallized pad on a device, package or substrate.
CAPILLARY ACTION: The action by which the surface of a liquid in contact with walls of a capillary tube or between two closely spaced plates is drawn into the tube or between the plates by a wicking action. An example of capillary action is in the flip chip assembly, the underfill is dispensed next to the die and the material is pulled into the gap by the force of capillary action.
CENTRIFUGE: A method of testing circuits and packages by spinning at high speed. Places high G loads (a centrifugal force) on IC s and bonds to evaluate mechanical robustness).
CERAMIC: An inorganic material that is a non-conductor of electricity. Examples are alumina (Al ₂O ₃), beryllia (BeO), aluminum nitride (AlN) steatite, or forsterite. All have high temperature melting points. Ceramics are used extensively in microelectronics manufacturing as packages or substrates.
CERDIP: A ceramic dual in-line package.
CERMET: A mixture of glass and/or ceramic, it has come to mean the general class of high resistivity thick film resistors and dielectrics paste materials that are fired at temperatures above 500 C.
CHAMFER: A corner or edge of a substrate...

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Integrated Circuit Packaging, Assembly and Interconnections