G

GALLIUM ARSENIDE (GaAs): A semiconductor typically used for high-speed, high frequency circuit applications.
GLASS BINDER: The glass powder added to a thick film ink to hold the functional particles together and to promote adhesion to the surface of the ceramic.
GLASSIVATION: A method of passivating a semiconductor die by coating with a glass layer leaving only the bond pads exposed.
GLAZE: General term for a glass coating.
GLAZED SUBSTRATE: A ceramic substrate that has been coated with a glass layer for smoothness.
GLOB TOP: An epoxy encapsulant. Typically used for Chip on Board.
GRAM-FORCE: In wire bonding or flip chip attachment the amount of physical force required to create an open bond.
GREEN: A term used to identify an unfired ceramic sheet or tape. For example, a green substrate is one that has been formed, but has not been fired.
GROUND PLANE: A conductive layer used as a common reference point for one or more electrical connections.

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Integrated Circuit Packaging, Assembly and Interconnections