Flexible / Dampening Epoxy Adhesives Datasheets

Two Component, Low Temperature Curing, Nano Rubber Toughened Epoxy -- EPO-TEK® OD2003
from Epoxy Technology

A two component, low temperature curing, nano rubber toughened epoxy. It has very good adhesion on metals and other substrates, excellent shear strength and vibration resistance. [See More]

  • Features: Flexible; Unfilled
  • Substrate Compatibility: Ceramic, Glass; Plastic
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Electronics; Optical; Photonics; Semiconductors, IC's
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Features: Encapsulant, Potting Compound; Laminaes; Sealant; Flexible; Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
3M™ Scotch-Weld™ Adhesive And Sealant Kit -- 3537
from 3M Aerospace and Aircraft Maintenance Division

Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]

  • Features: Sealant; Flexible
  • Industry: Aerospace; OEM or Industrial
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Features: High Dielectric; Flexible; Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Dissimilar Substrates
INSULBOND 5-171-1 Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]

  • Features: Flexible
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Electronics; OEM or Industrial
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's