Optical Grade / Material Epoxy Adhesives
from Master Bond, Inc.
Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/ °C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates, including... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermal Insulation; Unfilled
from Master Bond, Inc.
For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K •m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Non-corrosive; Thermally Conductive; Filled
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30D-7 is a versatile two component flexible epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance characteristics of... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Industry: Aerospace; Automotive; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Flexible; Unfilled
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Two component, low viscosity EP121CL-LO features an extraordinary long open time at room temperature of at least 2-3 days. This heat curable epoxy has excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, rubbers and plastics. EP121CL-LO is noteworthy for... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance properties including... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30FL is a low viscosity, flexible, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
from Master Bond, Inc.
Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety of substrates including metals, ceramics, glass, optical fibers, graphite and many rubbers and plastics. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Epoxies Etc...
20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This... [See More]
- Industry: Electronics; Optical
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: Encapsulant, Potting Compound; Unfilled
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Industry: Sanitary; Optical; Photonics
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass
from Henkel Corporation - Industrial
LOCTITE ECCOBOND LUX AA50T, Acrylate, Die Attach LOCTITE ® ECCOBOND LUX AA50T die attach adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices. This adhesive cures in seconds when exposed to the appropriate intensity of visible (blue)... [See More]
- Industry: Optical
- Viscosity: 96000
- Cure / Technology: UV or Radiation Cured; Single Component
from Epoxies Etc...
40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its' wide operating temperature... [See More]
- Industry: Electronics; Optical; Photonics
- Features: Electrically Conductive; Filled
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Use Temperature: -58 to 338
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive. LOCTITE ® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for alternate cure... [See More]
- Industry: Optical
- Type / Form: Liquid
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Henkel Corporation - Industrial
LOCTITE ECCOBOND F 113, Epoxy, Assembly LOCTITE ® ECCOBOND F 113 is an optically clear adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays and other optical components. LOCTITE ECCOBOND F 113 bonds offer resistance to... [See More]
- Industry: Optical
- Viscosity: 180
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Use Temperature: 76 to 230
from Henkel Corporation - Industrial
LOCTITE ECCOBOND F 120, Epoxy, Assembly LOCTITE ® ECCOBOND F 120 adhesive is designed for high performance fiber optic and optical bonding applications. This adhesive provides outstanding chemical resistance to a variety of ambient gases, solvents and solutions. LOCTITE ECCOBOND F 120 is... [See More]
- Industry: Optical
- Use Temperature: 76 to 239
- Cure / Technology: Two Component
from Henkel Corporation - Industrial
LOCTITE STYCAST OS 8300, two components - requires mixing, epoxy. LOCTITE STYCAST OS 8300 is a two-component adhesive formulated to enhance productivity in the assembly of semiconductor, optical, fiber optic, and optoelectronic devices. High spectral transmission . Excellent adhesion . [See More]
- Industry: Optical
- Cure / Technology: Two Component
from Henkel Corporation - Industrial
LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE ® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are required. This two-part adhesive... [See More]
- Industry: Optical
- Features: Leveling Filling
- Cure / Technology: Two Component
- Viscosity: 25000
from Henkel Corporation - Industrial
2-part, low viscosity, industrial grade epoxy adhesive. It cures at room temperature with minor shrinkage to form an ultra clear adhesive bondline. LOCTITE ®EA E-30CL is a clear, colorless to slightly yellowish, 2-part, low viscosity, industrial grade epoxy adhesive. It cures at room... [See More]
- Industry: Optical
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Viscosity: 10000
from Henkel Corporation - Industrial
Epoxy light white translucent adhesive for electronic component bonding applications. A set open time following activation allows component assembly. LOCTITE ® EA 3355 is a translucent, light white, medium-viscosity, cationic epoxy adhesive liquid designed for bonding optical connectors,... [See More]
- Industry: Optical
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Viscosity: 5000