Specialty / Other Epoxy Adhesives
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Sets at R.T. with E 810-1 Accelerator
- Substrate Compatibility: Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Filled
from Shenzhen DeepMaterial Technologies Co., Ltd
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a... [See More]
- Cure / Technology: Heat curing
- Industry: Semiconductors, IC's
- Features: Electrically Conductive
from Epoxies Etc...
10-3705 is a two component, solvent free, underwater curing epoxy system. This system was formulated for applications requiring high adhesion to wet, cold or underwater surfaces. Kevlar has been added to the 10-3705 formulation for added strength and abrasion resistance. 10-3705 may be used as a... [See More]
- Cure / Technology: Two Component ; Underwater
- Viscosity: 20500 to 350000
- Industry: OEM or Industrial
from Mitsubishi Chemical Carbon Fiber and Composites, Inc.
Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high performance... [See More]
- Cure / Technology: Cure Temperature: 250 - 320 F
- Use Temperature: 180
- Industry: Sanitary; OEM or Industrial; Sporting Goods
from Shenzhen DeepMaterial Technologies Co., Ltd
Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It can quickly provide customers with high-throughput applications, such as attaching light... [See More]
- Cure / Technology: Heat Curing
- Viscosity: 8700
- Industry: Electronics
from Mitsubishi Chemical Carbon Fiber and Composites, Inc.
Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high performance... [See More]
- Cure / Technology: Cure Temperature: 250 - 320 F
- Use Temperature: 180
- Industry: Aerospace; Marine; OEM or Industrial; Sporting Goods
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured, epoxy... [See More]
- Cure / Technology: Single Component; Heat Curing
- Viscosity: 65000 to 120000
- Substrate Compatibility: Composites; Metal
- Use Temperature: -67 to 356