Single Component System Epoxy Adhesives

3M Scotch-Weld 6102 Epoxy Adhesive Black is a one component, water, and impact resistant product. It is designed for bonding dissimilar materials, and electronic-grade plastics with controlled rheology for non-sag bonding. It features a fast, low temperature cure, and flexibility after cure. Ideal... [See More]

• Cure / Technology: Single Component
• Viscosity: 80000

• Substrate Compatibility: Metal; Plastic

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates

• Type / Form: Liquid
• Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled

Tuffbond ® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 395 will change from amber to a reddish brown upon cure. Bonding the voice... [See More]

• Cure / Technology: Thermoset; Two Component  ; Single Component

• Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

3M Scotch-Weld 2214 Hi-Temp New Epoxy Gray is a one part, aluminum filled, deaerated adhesive. It is a paste consistency used for bonding metals and many high temperature plastics such as fiberglass reinforced plastic, polyester, and phenolics. 6 oz Cartridge. [See More]

• Cure / Technology: Single Component
• Elongation: 1.0

• Thermal Conductivity: 0.2440
• Dielectric Strength: 347

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: High Dielectric; Non-corrosive; Thermally Conductive; Unfilled

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Industry: Aerospace; Electronics; Electric Power; Marine; Sanitary; Photonics; Semiconductors, IC's

Hernon  397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond  397 will change from amber-yellow to a reddish brown upon cure. Product... [See More]

• Cure / Technology: Thermoset; Single Component
• Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

• Features: Encapsulant, Potting Compound

3M Scotch-Weld 2214 Non-Metallic Epoxy Adhesive Cream is a one component, non-metal filled version of Scotch-Weld adhesive 2214 regular. It is a paste consistency, used for bonding metals and high temperature plastics. 6 oz Cartridge. [See More]

• Cure / Technology: Single Component
• Thermal Conductivity: 0.1210

• Substrate Compatibility: Metal; Plastic
• Tensile (Break): 9000

Master Bond EP17HTDA-2 is a one component, heat cured epoxy system for bonding, sealing, and die attach. It is recommended when its exceptionally high Tg of 185-190°C is a critical factor in die attach applications. [See More]

• Cure / Technology: Thermoset; Single Component
• Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive; Unfilled

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Industry: Aerospace; Automotive; Electronics; Photonics; OEM or Industrial; Semiconductors, IC's

3M Scotch-Weld 6101 Epoxy Adhesive Off-White is a one component, water, and impact resistant product. It is designed for bonding dissimilar materials, and electronic-grade plastics with controlled rheology for non-sag bonding. It features a fast, low temperature cure, and flexibility after cure with... [See More]

• Cure / Technology: Single Component
• Viscosity: 30000 to 80000

• Substrate Compatibility: Metal; Plastic
• Tensile (Break): 3916

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates

• Type / Form: Liquid
• Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Unfilled

3M Scotch-Weld 6104 Epoxy Adhesive Black is a one component, impact and water-resistant industrial adhesive product. It is engineered for bonding materials that are dissimilar as well as electronic-grade plastics with controlled rheology to provide non-sag bonding. It provides a quick, low... [See More]

• Cure / Technology: Single Component

• Viscosity: 80000

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates

• Type / Form: Liquid
• Features: Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive; Filled

AI Technology ME7155-3 is a slightly lower bond strength but more flexible version of ME7155. The ME7155-3 exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it... [See More]

• Cure / Technology: Single Component
• Thermal Conductivity: 1.7

• Viscosity: 175000
• Dielectric Strength: 750

EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. [See More]

• Cure / Technology: Thermoset; Single Component
• Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Filled

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Industry: Aerospace; Automotive; Electronics; Photonics; OEM or Industrial; Semiconductors, IC's

AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. [See More]

• Cure / Technology: Single Component
• Thermal Conductivity: 7.9

• Viscosity: 255000

Master Bond Polymer System EP3HT is a one component system featuring high shear strength, good temperature resistance along with a fast cure schedule. Typical curing schedules are 5-10 minutes at 300 °F or 20-30 minutes at 250 °F (minimum cure temperature is 235 °F-240 °F). Tensile... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: Sealant; Unfilled

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling

Henkel Loctite 3609 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical characteristics are... [See More]

• Cure / Technology: Single Component
• Thermal Conductivity: 0.4000

• Viscosity: 160 to 2000

Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to +350 °F making it suitable for cryogenic applications. Supreme 10HTFL features highly desirable... [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood

• Type / Form: Liquid
• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Unfilled

Henkel Loctite 3616 is a heat curing epoxy adhesive designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are... [See More]

• Cure / Technology: Single Component
• Thermal Conductivity: 0.2000

• Viscosity: 15000 to 55000
• Dielectric Strength: 851

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: High Dielectric; Non-corrosive; Sealant; Unfilled

• Substrate Compatibility: Ceramic, Glass; Metal
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling

Henkel Loctite 3621 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical characteristics are... [See More]

• Cure / Technology: Single Component
• Thermal Conductivity: 0.3000

• Viscosity: 500 to 3000
• Dielectric Strength: 1016

Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: Non-corrosive; Sealant; Unfilled

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Dissimilar Substrates
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling

Henkel Loctite 3621 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical characteristics are... [See More]

• Cure / Technology: Single Component
• Thermal Conductivity: 0.3000

• Viscosity: 500 to 3000
• Dielectric Strength: 1016

Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: High Dielectric; Sealant; Thermally Conductive; Unfilled

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Dissimilar Substrates
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling

Henkel Loctite 3981 is a low viscosity, heat curing epoxy adhesive suitable for applications that require fast cure, excellent environmental resistance and high adhesion. The product cures rapidly when exposed to temperatures as low as 100 °C and achieves excellent adhesion to plastics, metals... [See More]

• Cure / Technology: Single Component
• Viscosity: 4000 to 6000

• Industry: Sanitary
• Tensile (Break): 8970

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates

• Type / Form: Liquid
• Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled

Henkel Loctite 3984 is a high viscosity, heat curing epoxy adhesive suitable for applications that require fast cure, excellent environmental resistance and high adhesion. The product cures rapidly when exposed to temperatures as low as 100 °C and achieves excellent adhesion to plastics, metals... [See More]

• Cure / Technology: Single Component
• Viscosity: 22000 to 28000

• Industry: Sanitary
• Tensile (Break): 5540

Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also... [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates

• Type / Form: Liquid
• Features: High Dielectric; Non-corrosive; Sealant; Unfilled

Henkel Loctite EA 529WCG AERO is a modified epoxy film adhesive on a synthetic carrier that is used for bonding metal to metal and metal to honeycomb. It is designed for applications that require a wide service temperature range. It offers 100% solids, moderate tack, durability, and chemical... [See More]

• Cure / Technology: Single Component

• Substrate Compatibility: Metal

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates

• Type / Form: Liquid
• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Sealant; Anti-static, ESD; Flexible; Unfilled

Henkel Loctite EA E-214HP Gray is a one component, no-mix industrial grade epoxy adhesive. The heat activated formulation provides strong structural bonds and superior thermal shock resistance. 300 mL Cartridge. [See More]

• Cure / Technology: Single Component
• Viscosity: 800000 to 3.00E6

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Tensile (Break): 4460

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates

• Type / Form: Liquid
• Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Unfilled

Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe. [See More]

• Cure / Technology: Single Component
• Viscosity: 4000

• Features: Encapsulant, Potting Compound
• Thermal Conductivity: 0.4200

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Unfilled

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces
• Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Tooling

Henkel Loctite ECCOBOND EO1016 Epoxy Encapsulant Black is a one component epoxy used for applications requiring excellent handling properties. It offers fast cure, flame-out, and excellent shelf stability. 30 cc Syringe. [See More]

• Cure / Technology: Single Component
• Thermal Conductivity: 0.3900

• Features: Encapsulant, Potting Compound
• Tensile (Break): 8000

Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's

Miller-Stephenson EPON ™ 828 Epoxy Adhesive Resin Clear is a standard epoxy resin used in formulation, fabrication, and fusion technology. It also has the ability to work in fiber reinforced pipes, construction, and tooling. 1 gal Can. [See More]

• Cure / Technology: Single Component

• Substrate Compatibility: Textiles or Fabrics

Master Bond Polymer System EP17 is a toughened one component heat curing epoxy resin system featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at a minimum temperature of 300 °F to 350 °F for 60-90 minutes. Post curing for 1... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: Flame Retardant; Non-corrosive; Sealant; Unfilled

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: Electrically Conductive; Thermally Conductive; Flexible; Filled

• Substrate Compatibility: Ceramic, Glass; Metal
• Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: Filled

• Substrate Compatibility: Metal; Plastic
• Industry: Aerospace; OEM or Industrial

LOCTITE ABLESTIK 84-1LMINB, Epoxy, Die attach LOCTITE ® ABLESTIK 84-1LMINB electrically conductive adhesive is designed for die attach applications. Electrically conductive. High purity die attach adhesive. Solvent-free [See More]

• Cure / Technology: Single Component

• Viscosity: 60000

G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]

• Cure / Technology: Thermoset; Single Component
• Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial

• Features: Electrically Conductive; Sealant
• Use Temperature: 600

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: Electrically Conductive; Thermally Conductive; Filled

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Industry: Electronics; Semiconductors, IC's

These ThreeBond adhesives use epoxy resin as their main component. They are excellent for a myriad of purposes including general purpose adhesion and sealing, and for electronic device bonding, filling, repair, casting and impregnation. Epoxy resins, also known as polyepoxides, are reactive... [See More]

• Cure / Technology: Single Component
• Industry: Automotive

• Substrate Compatibility: Rubber or Elastomer
• Viscosity: 13000

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

• Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
• Features: Encapsulant, Potting Compound; Thermally Conductive; Filled

• Type / Form: Liquid
• Industry: Tooling

CONAPOXY ® AD-10 is a unique single component epoxy that may be used as a structural adhesive or miniature electronic potting compound. The heat-cure formulation was designed for rapid cure at temperatures as low as 200 °F, yet it exhibits good storage life at room temperature. Good... [See More]

• Cure / Technology: Single Component

HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. It is used as insulation of copper and other materials and attaching leads to coils. [See More]

• Cure / Technology: Single Component

• Industry: Electronics

It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured, epoxy... [See More]

• Cure / Technology: Single Component; Heat Curing
• Viscosity: 65000 to 120000

• Substrate Compatibility: Composites; Metal
• Use Temperature: -67 to 356

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Metal; Plastic

• Type / Form: Liquid
• Features: High Dielectric; Thermally Conductive

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 is a cream colored, one-part heat curing high viscosity epoxy,. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Metal

• Type / Form: Liquid
• Features: Unfilled

LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]

• Cure / Technology: Single Component

• Features: Thermally Conductive

40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic... [See More]

• Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
• Substrate Compatibility: Ceramic, Glass; Plastic

• Type / Form: Liquid
• Features: Electrically Conductive; Flexible; Filled

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Metal

• Type / Form: Liquid
• Features: Electrically Conductive; Thermally Conductive; Filled

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Metal

• Type / Form: Liquid
• Features: Unfilled

LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE ® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications. [See More]

• Cure / Technology: Single Component

• CTE: 30

These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood; Magnets

• Type / Form: Liquid
• Features: Encapsulant, Potting Compound; Unfilled

Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA. [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Ceramic, Glass; Metal

• Type / Form: Liquid
• Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; Filled

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 is a gray colored, one-part heat curing very high viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

• Cure / Technology: Thermoset; Single Component
• Substrate Compatibility: Metal

• Type / Form: Liquid
• Features: Unfilled

LOCTITE ECCOBOND LUX AA50T, Acrylate, Die Attach LOCTITE ® ECCOBOND LUX AA50T die attach adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices. This adhesive cures in seconds when exposed to the appropriate intensity of visible (blue)... [See More]

• Cure / Technology: UV or Radiation Cured; Single Component
• Viscosity: 96000

• Industry: Optical

UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. [See More]

• Cure / Technology: UV or Radiation Cured; Single Component
• Features: Encapsulant, Potting Compound; Unfilled

• Type / Form: Liquid
• Industry: Electronics; OEM or Industrial

Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured material is flame retardant. Meets the flammability requirements of F.A.R. 25.853 (a). [See More]

• Cure / Technology: Thermoset; Single Component
• Features: Flame Retardant; Leveling Filling; Sealant

• Substrate Compatibility: Honeycomb Core
• Industry: Aerospace; OEM or Industrial

LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach LOCTITE ® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe. Electrically conductive. Low bleed. Low outgassing [See More]

• Cure / Technology: Single Component

• Viscosity: 30000

3M ™ Scotch-Weld ™ Structural Adhesive Film AF 126 FR is a flame retardant, thermosetting, toughened, epoxy adhesive film designed for structural bonding. Cure at temperatures as low as 180F (82C). Excellent strength for honeycomb sandwich applications. High degree of tack in the uncured... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: Flame Retardant

• Substrate Compatibility: Metal
• Industry: Aerospace; OEM or Industrial

LOCTITE ABLESTIK 958-7, Epoxy, Die attach LOCTITE ® ABLESTIK 958-7 electrically conductive epoxy adhesive is designed for hybrid die attach. This adhesive provides better adhesion to gold than other versions of ABLEBOND 958 adhesive series. Electrically conductive. Good adhesion to gold [See More]

• Cure / Technology: Single Component

• Viscosity: 90000

3M ™ Scotch-Weld ™ Structural Adhesive Film AF 130-2 is designed for the bonding of honeycomb to metal and metal applications where high performance properties are needed over the -67 to 400 °F (-55 to 204 °C) temperature range. Scotch-Weld AF 130-2 film can be used with 3M... [See More]

• Cure / Technology: Thermoset; Single Component
• Industry: Aerospace; OEM or Industrial

• Substrate Compatibility: Metal; Honeycomb Core
• Use Temperature: -67 to 400

LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach LOCTITE ® ABLESTIK 958-8C is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metalizations or traditional printed circuit board surfaces. Electrically conductive. Stress absorbing. [See More]

• Cure / Technology: Single Component

• Viscosity: 22000

3M ™ Scotch-Weld ™ Core Splice Adhesive Film AF 3002 is a 250-350 °F (121-177 °C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C)... [See More]

• Cure / Technology: Thermoset; Single Component
• Features: Sealant

• Substrate Compatibility: Honeycomb Core
• Industry: Aerospace; OEM or Industrial

LOCTITE ABLESTIK C 805-1, Epoxy, Heat cure LOCTITE ® ABLESTIK C 805-1 is the lower viscosity version of ECCOBOND C 805. Electrically conductive. Thermally conductive. Thixotropic. Bond strength. Good adhesion to a variety of substrates. Long room temperature stability. Process ease. Good green... [See More]

• Cure / Technology: Single Component
• Use Temperature: 49 to 302

• Viscosity: 130000

LOCTITE ABLESTIK C850-6L, Epoxy, Electrically Conductive Adhesive LOCTITE ® ABLESTIK C850-6L electrically conductive adhesive is designed for LED die bonding and other die attach applications. Electrically conductive. One component. Low cure temperature. High adhesion. Long shelf life [See More]

• Cure / Technology: Single Component

• Viscosity: 60000

LOCTITE ABLESTIK CE 3104WXL, Epoxy, Electrically Conductive Adhesive LOCTITE ® ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. This product uses a unique blend of fillers with tightly controlled particle sizes to provide ultra-fine pitch... [See More]

• Cure / Technology: Single Component
• Features: Leveling Filling

• Substrate Compatibility: Metal
• Viscosity: 65000

LOCTITE ABLESTIK CE 3511PHV, Epoxy, Electrically Conductive Adhesive LOCTITE ® ABLESTIK CE 3511PHV electrically conductive adhesive is designed for circuit assembly applications. Electrically conductive. One component. Fast cure at high temperatures. Long shelf life at room temperature. No... [See More]

• Cure / Technology: Single Component
• Use Temperature: 302

• Viscosity: 62500

LOCTITE ABLESTIK CE 3513, Epoxy, Assembly LOCTITE ® ABLESTIK CE 3513 adhesive is designed for use in automated assembly and in-line curing operations. Electrically conductive. One component. Low viscosity. No bleed. Good dispense behavior. Fast cure at high temperatures. Long shelf life at room... [See More]

• Cure / Technology: Single Component
• Use Temperature: 302

• Viscosity: ? to 45000
• Thermal Conductivity: 2.5

LOCTITE ABLESTIK CE 3520-3, Epoxy, Electrically Conductive Adhesive LOCTITE ® ABLESTIK CE 3520-3 adhesive combines a high elasticity with a good adhesion on a variety of surfaces, making it suitable for applications with mismatched CTE. Electrically conductive. One component. Low stress. [See More]

• Cure / Technology: Single Component
• Use Temperature: 49 to 257

• Viscosity: 73000

LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE ® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend of fillers with tightly controlled particle sizes to provide fine pitch printing... [See More]

• Cure / Technology: Single Component
• Features: Leveling Filling

• Substrate Compatibility: Metal
• Viscosity: 54000

LOCTITE 3220W, Epoxy, Adhesive and Sealant LOCTITE ® 3220W is designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. LOCTITE 3220W is an white colored version of LOCTITE 3220 adhesive. One... [See More]

• Cure / Technology: Single Component
• Features: Sealant

• Substrate Compatibility: Ceramic, Glass
• Viscosity: 31800

Viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. LOCTITE ® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is particularly suitable for... [See More]

• Cure / Technology: Single Component
• Viscosity: ? to 20000

• Type / Form: Gel

LOCTITE 3614, Epoxy, Surface mount adhesive LOCTITE ® 3614 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium print speeds, high dot profile, high wet strength and good electrical... [See More]

• Cure / Technology: Single Component
• Viscosity: ? to 65000

• Type / Form: Gel

LOCTITE 3616, Epoxy, Surface mount adhesive, Small parts bonding. LOCTITE ® 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength... [See More]

• Cure / Technology: Single Component

• Viscosity: ? to 55000