Flame Retardant (e.g. UL 94 Rated) Epoxy Adhesives
from DigiKey
EPOXY ADH DP100FR 48.5ML [See More]
- Features: Flame Retardant
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from DigiKey
FLAME RETARDANT STRUCTURAL EPOXY [See More]
- Features: Flame Retardant
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from DigiKey
FLAME RETARDANT STRUCTURAL EPOXY [See More]
- Features: Flame Retardant
from Master Bond, Inc.
Master Bond Polymer System EP17 is a toughened one component heat curing epoxy resin system featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at a minimum temperature of 300 °F to 350 °F for 60-90 minutes. Post curing for 1... [See More]
- Features: Flame Retardant; Non-corrosive; Sealant; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® EA 9365FST AERO is a FST retardant toughened paste that provides high color stability after curing. The product is Halogen- and Antimony-free and curable at room temperature or accelerated with heat. Service temperature: -55 to 85 °C (-67 to 185 °F). Halogen- and... [See More]
- Features: Flame Retardant
- Industry: OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing (optional feature)
- Use Temperature: -67 to 185
from Protavic America, Inc.
PNE-47207 ™ is an adhesive/sealant and potting compound. PNE-47207 ™ is designed to provide air free potting and casting of electronic devices. PNE-47207 ™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Sealant; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal
from Mitsubishi Chemical Carbon Fiber and Composites, Inc.
Mitsubishi Chemical Carbon Fiber and Composites, Inc. manufacturing facility utilizes advanced, highly efficient production equipment and technology. This enables us to provide our customers with the advanced composite materials they require. Our facility can process nearly every high performance... [See More]
- Features: Flame Retardant
- Industry: Aerospace; Military
- Cure / Technology: Cure Temperature: 250 - 320 F
- Use Temperature: 200
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]
- Features: Flame Retardant
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Type / Form: Liquid
- Cure / Technology: Two Component
- Substrate Compatibility: Metal; Plastic
from 3M Aerospace and Aircraft Maintenance Division
Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured material is flame retardant. Meets the flammability requirements of F.A.R. 25.853 (a). [See More]
- Features: Flame Retardant; Leveling Filling; Sealant
- Substrate Compatibility: Honeycomb Core
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; OEM or Industrial
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Film AF 126 FR is a flame retardant, thermosetting, toughened, epoxy adhesive film designed for structural bonding. Cure at temperatures as low as 180F (82C). Excellent strength for honeycomb sandwich applications. High degree of tack in the uncured... [See More]
- Features: Flame Retardant
- Substrate Compatibility: Metal
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; OEM or Industrial