Encapsulating / Potting Epoxy Adhesives
from Hernon Manufacturing, Inc.
Tuffbond ® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 302... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
3M Scotch-Weld DP270 Epoxy Adhesive Duo-Pak Black is a two-part epoxy adhesive. It is used for the potting and encapsulation of many heat sensitive or delicate components. It has good thermal shock resistance, long worklife, and excellent electrical properties. 400 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 6000 to 16000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1770
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 304... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Viscosity: 6000 to 16000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1770
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 305... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Viscosity: 6000 to 16000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1770
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond ® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 315 is also... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
ELANTAS PDG CONAPOXY AD-10 Epoxy Brown is a one component, structural adhesive that is used for bonding and sealing electronics, metals, plastics, ceramics, batteries, structural materials, and mini potting. It offers fast heat curing, good dielectric properties, thermal stability, and reduces... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Dielectric Strength: 0.0095
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 200 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 6200 to 13000
- Cure / Technology: Two Component
- Tensile (Break): 6800
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure. Product... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 400 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 6200 to 13000
- Cure / Technology: Two Component
- Tensile (Break): 6800
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 50 mL Cartridge. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 6200 to 13000
- Cure / Technology: Two Component
- Tensile (Break): 6800
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 4000
- Cure / Technology: Single Component
- Thermal Conductivity: 0.4200
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite ECCOBOND EO1016 Epoxy Encapsulant Black is a one component epoxy used for applications requiring excellent handling properties. It offers fast cure, flame-out, and excellent shelf stability. 30 cc Syringe. [See More]
- Features: Encapsulant, Potting Compound
- Thermal Conductivity: 0.3900
- Cure / Technology: Single Component
- Tensile (Break): 8000
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite OXY-CAST 6850FT-LV Epoxy with HARDENER RT-7LC is a two component, low viscosity, epoxy casting system that is used for electrical casting, encapsulating, and high voltage applications. It offers high thermal conductivity, electrical, flow, and wetting properties. It is resistant to... [See More]
- Features: Encapsulant, Potting Compound
- Industry: Electric Power
- Cure / Technology: Two Component
- Viscosity: 3000 to 10000
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 1265 Clear, formerly Emerson and Cuming, is a two component, flexible epoxy gel that is used for bonding, replacing, and repairing stress sensitive components. It offers low exotherm, long pot life, and easy application. Part A, 1 gal Pail. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 600 to 10000
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 1265 Clear, formerly Emerson and Cuming, is a two component, flexible epoxy gel that is used for bonding, replacing, and repairing stress sensitive components. It offers low exotherm, long pot life, and easy application. Part A, 40 lb Pail. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 600 to 10000
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Sealant; Anti-static, ESD; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 1265 Clear, formerly Emerson and Cuming, is a two component, flexible epoxy gel that is used for bonding, replacing, and repairing stress sensitive components. It offers low exotherm, long pot life, and easy application. Part B, 1 gal Pail. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 230 to 600
- Cure / Technology: Two Component
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 1265 Clear, formerly Emerson and Cuming, is a two component, flexible epoxy gel that is used for bonding, replacing, and repairing stress sensitive components. It offers low exotherm, long pot life, and easy application. Part B, 40 lb Pail. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 230 to 600
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces
- Cure / Technology: Thermoset; Single Component
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite STYCAST 1266 Clear, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for bonding lenses, glass, plastics, metal, and display embedments. It offers low viscosity and good visibility, electrical properties, impact strength, and... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 600 to 700
- Cure / Technology: Two Component
- Tensile (Break): 5801 to 7977
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
from Ellsworth Adhesives
Henkel Loctite STYCAST 1266 Clear, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for bonding lenses, glass, plastics, metal, and display embedments. It offers low viscosity and good visibility, electrical properties, impact strength, and... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 600 to 700
- Cure / Technology: Two Component
- Tensile (Break): 5801 to 7977
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Features: Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation; Flexible
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 1266 Clear, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for bonding lenses, glass, plastics, metal, and display embedments. It offers low viscosity and good visibility, electrical properties, impact strength, and... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 600 to 700
- Cure / Technology: Two Component
- Tensile (Break): 5801 to 7977
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 1266 Clear, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for bonding lenses, glass, plastics, metal, and display embedments. It offers low viscosity and good visibility, electrical properties, impact strength, and... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 600 to 700
- Cure / Technology: Two Component
- Tensile (Break): 5801 to 7977
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 2651-40 Black, formerly Emerson and Cuming, is two component, heat curing, epoxy encapsulant that is used for bonding plastics, metal, and ceramics. It offers low viscosity, easy application, and good machinability. 1 gal Pail. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 5000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.5000
from Master Bond, Inc.
EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 2651-40 Black, formerly Emerson and Cuming, is two component, heat curing, epoxy encapsulant that is used for bonding plastics, metal, and ceramics. It offers low viscosity, easy application, and good machinability. 1 qt Can. [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 5000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.5000
from Master Bond, Inc.
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for bonding, sealing, and potting electronic components that are exposed to high temperatures. It offers excellent electrical and physical properties; it is resistant to... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Industry: Electronics
- Cure / Technology: Two Component
- Viscosity: 40000
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 2741 LV Black, formerly Emerson and Cuming, is a two component, room temperature curing, filled epoxy encapsulant that is used for cementing, sealing, bonding, and embedding electronic components, plastics, metal, and glass. It offers low viscosity, flexibility, impact and... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Viscosity: 16000 to 30000
from Master Bond, Inc.
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100 °F to +500 °F with a glass transition temperature... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 2741 LV Black, formerly Emerson and Cuming, is a two component, room temperature curing, filled epoxy encapsulant that is used for cementing, sealing, bonding, and embedding electronic components, plastics, metal, and glass. It offers low viscosity, flexibility, impact and... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Viscosity: 16000 to 30000
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 2760 Black, formerly Emerson and Cuming, is a two component, room temperature curing, liquid epoxy/urethane encapsulant that is used for potting and bonding vinyl. It offers low viscosity and excellent electrical, physical, mechanical, and cycling properties. It is resistant... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 18000 to 53000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.6000
from Master Bond, Inc.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Henkel Loctite STYCAST 2760 Black, formerly Emerson and Cuming, is a two component, room temperature curing, liquid epoxy/urethane encapsulant that is used for potting and bonding vinyl. It offers low viscosity and excellent electrical, physical, mechanical, and cycling properties. It is resistant... [See More]
- Features: Encapsulant, Potting Compound
- Viscosity: 9600 to 18000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.6000
from Master Bond, Inc.
Master Bond EP110F8-5 was developed for potting, sealing, encapsulation and casting applications. It is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties, resists thermal cycling, and provides dimensional stability. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Electro-Lite Corporation
ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
from ACCRAbond, Inc.
INSTAbond ® M810 -- a two-part epoxy compound that is used in potting, casting, encapsulation, adhesive and coatings applications. Key benefits include excellent adhesion, good water resistance, good toughness and flexibility. Certified to Mil-A-81236 Type 1 & Type 2. [See More]
- Features: Encapsulant, Potting Compound
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Type / Form: Liquid
- Cure / Technology: Two Component
- Substrate Compatibility: Metal; Plastic
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Features: Encapsulant, Potting Compound; Unfilled
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics
from Shenzhen DeepMaterial Technologies Co., Ltd
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy [See More]
- Features: Encapsulant, Potting Compound
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Heat Curing
- Viscosity: 32500 to 50000
from Protavic America, Inc.
Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Features: Encapsulant, Potting Compound; Sealant
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass
from Epoxies Etc...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; Filled
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal
from Epoxies Etc...
50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics; Electric Power
from Epoxies Etc...
UV Cure 60-7157 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to "dark cure." Once exposed to UV light the UV Cure 60-7157 will continue to cure in the absence of light. This is... [See More]
- Features: Encapsulant, Potting Compound; Unfilled
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
from Epoxies Etc...
UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. [See More]
- Features: Encapsulant, Potting Compound; Unfilled
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Industry: Electronics; OEM or Industrial