Leveling / Filling Compound Epoxy Adhesives Datasheets

Acrylic Polymer Based, Pressure Sensitive Hot Melt -- MB528
from Master Bond, Inc.

Master Bond Polymer System MB528 is a high performance 100% solid acrylic resin based hot melt compound designed for use as a hot melt pressure sensitive adhesive. It exhibits good adhesion to a wide variety of materials including polyester, glass, aluminum, steel, fabric and paper. Master Bond... [See More]

  • Features: High Dielectric; Leveling Filling
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
3M 05883 Blue Two-Part Epoxy Adhesive - Blue - Base & Accelerator (B/A) - 5 oz Tube 05883 -- 051131-05883 [60980030880 from 3M]
from R. S. Hughes Company, Inc.

3M 05883 blue two-part epoxy adhesive is compatible with frp and smc materials. Provides a 10 min working time. [See More]

  • Features: Leveling Filling
3M™ Scotch-Weld™ Core Splice Adhesive -- EC-3500 Part A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]

  • Features: Leveling Filling; Sealant
  • Substrate Compatibility: Honeycomb Core
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; OEM or Industrial
Fixmaster® Fast Cure Poxy Pak™ -- 81120 [81120 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

Bonds virtually any material to repair, fill, and seal holes, cracks, etc.. [See More]

  • Features: Flame Retardant; Leveling Filling; Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Filled
  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset
  • Use Temperature: 400
Ultra Clear Epoxy Adhesive -- 10-3713
from Epoxies Etc...

10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV Weatherometer... [See More]

  • Features: High Dielectric; Leveling Filling; Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Electronics; OEM or Industrial