Metal Epoxy Adhesives

3M Scotch-Weld 6102 Epoxy Adhesive Black is a one component, water, and impact resistant product. It is designed for bonding dissimilar materials, and electronic-grade plastics with controlled rheology for non-sag bonding. It features a fast, low temperature cure, and flexibility after cure. Ideal... [See More]

• Substrate Compatibility: Metal; Plastic
• Viscosity: 80000

• Cure / Technology: Single Component

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled

• Cure / Technology: Thermoset; Two Component  
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling

3M Scotch-Weld Epoxy Adhesive 1751 is a two component, room temperature curing, structural adhesive that is used for bonding and repairing metals. It is aluminum filled and has excellent void filling abilities. 1 gal Kit. [See More]

• Substrate Compatibility: Metal
• Viscosity: 150000 to 400000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.2229

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Thermoset; Single Component
• Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled

3M Scotch-Weld Epoxy Adhesive 1838 Green is a two component, room temperature curing, structural adhesive that is used for bonding metal, plastics, rubber, and wood. It offers high shear strength, controlled flow, and environmental resistance. 1 qt Can Kit. [See More]

• Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 70000 to 1.00E6

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.1690

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Features: High Dielectric; Non-corrosive; Thermally Conductive; Unfilled

• Cure / Technology: Thermoset; Single Component
• Industry: Aerospace; Electronics; Electric Power; Marine; Sanitary; Photonics; Semiconductors, IC's

3M Scotch-Weld Epoxy Adhesive 1838L Clear is a two component, room temperature curing, structural adhesive that is used for bonding metal, plastics, rubber, and wood. It offers high shear strength, flowability, and environmental resistance. 1 qt Kit. [See More]

• Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 6000 to 15000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.1160

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Thermoset; Single Component
• Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Unfilled

3M Scotch-Weld 2214 Non-Metallic Epoxy Adhesive Cream is a one component, non-metal filled version of Scotch-Weld adhesive 2214 regular. It is a paste consistency, used for bonding metals and high temperature plastics. 6 oz Cartridge. [See More]

• Substrate Compatibility: Metal; Plastic
• Thermal Conductivity: 0.1210

• Cure / Technology: Single Component
• Tensile (Break): 9000

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Thermoset; Single Component
• Features: Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive; Filled

3M Scotch-Weld Epoxy Adhesive 2216 Clear is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 1:1 mix ratio by volume or... [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 5000 to 15000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.1140

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive; Unfilled

• Cure / Technology: Thermoset; Two Component  
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole

3M Scotch-Weld Epoxy Adhesive 2216 Clear is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 1:1 mix ratio by volume or... [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 5000 to 15000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.1140

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
• Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled

3M Scotch-Weld Epoxy Adhesive 2216 Clear is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 1:1 mix ratio by volume or... [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 5000 to 15000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.1140

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
• Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled

3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 1 gal... [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 40000 to 150000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.2280

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
• Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled

3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 1 pt... [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 40000 to 150000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.2280

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  
• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Unfilled

3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 1 qt... [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 40000 to 150000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.2280

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces
• Features: Sealant; Unfilled

• Cure / Technology: Thermoset; Two Component  
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling

3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 2 oz... [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 40000 to 150000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.2280

Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Two Component  
• Features: High Dielectric; Non-corrosive; Unfilled

3M Scotch-Weld 6101 Epoxy Adhesive Off-White is a one component, water, and impact resistant product. It is designed for bonding dissimilar materials, and electronic-grade plastics with controlled rheology for non-sag bonding. It features a fast, low temperature cure, and flexibility after cure with... [See More]

• Substrate Compatibility: Metal; Plastic
• Viscosity: 30000 to 80000

• Cure / Technology: Single Component
• Tensile (Break): 3916

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible

• Cure / Technology: Thermoset; Two Component  
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling

3M Scotch-Weld Epoxy Adhesive DP100 Clear is a two component, fast curing, epoxy based resin that offers high flow, easy mixing, and machinability. 1:1 mix ratio by volume. 400 mL Duo-Pak Cartridge. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
• Viscosity: 8000 to 16000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.1070

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
• Features: Sealant; Unfilled

• Cure / Technology: Thermoset; Two Component  
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling

3M Scotch-Weld Epoxy Adhesive DP110 Gray is a two component, fast curing, epoxy based resin that is used to bond metal and plastics. It offers a controlled flow, flexibility, and 20 minute handling time. 48.5 mL Duo-Pak Cartridge. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Viscosity: 40000 to 90000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.1040

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal
• Features: High Dielectric; Non-corrosive; Sealant; Unfilled

• Cure / Technology: Thermoset; Single Component
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling

3M Scotch-Weld Epoxy Adhesive DP125 Clear is a two component, fast curing, epoxy based resin that is low odor, flexible, and has high shear and peel strength. It is used for bonding wood, metal, ceramics, and most plastics. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 2000 to 33000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.8900

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
• Type / Form: Powder

• Cure / Technology: Thermoset; Two Component  
• Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Unfilled

3M Scotch-Weld Epoxy Adhesive DP190 Clear is a two component, fast curing, epoxy based resin that offers flexibility, 90 minute handling time, high shear and peel strength. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 2000 to 15000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.0790

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Unfilled

• Cure / Technology: Thermoset; Two Component  
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling

3M Scotch-Weld Epoxy Adhesive DP190 Gray is a two component, fast curing, epoxy based resin that offers flexibility, 90 minute handling time, good environmental aging properties, high shear and peel strength. 1:1 mix ratio by volume. 200 mL Duo-Pak Cartridge. [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 40000 to 150000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.2200

Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Dissimilar Substrates
• Features: Non-corrosive; Sealant; Unfilled

• Cure / Technology: Thermoset; Single Component
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling

3M Scotch-Weld Epoxy Adhesive DP190 Gray is a two component, fast curing, epoxy based resin that offers flexibility, 90 minute handling time, good environmental aging properties, high shear and peel strength. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 40000 to 150000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.2200

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Flexible; Unfilled

• Cure / Technology: Thermoset; Two Component  
• Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling

3M Scotch-Weld DP2216 Epoxy Adhesive Gray is a two component, room temperature curing, industrial adhesive that offers flexibility, high peel and shear strength, and resistance to flexing, vibration, and shock. 2:3 mix ratio by volume. Compatible with 2:1 plungers. 41.5 mL Duo-Pak Cartridge. [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 40000 to 150000

• Cure / Technology: Two Component  
• Thermal Conductivity: 0.2280

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  
• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Flexible; Unfilled

Bostik Epoxy Adhesive 7575 Clear is a two component, structural adhesive that is used for bonding phenolic plastics, glass, wood, masonry, rubber, ceramics, metal, and polyesters. It is typically used for sealing electrical components, encapsulation, and potting applications. It offers fast cure... [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Features: Sealant

• Cure / Technology: Two Component  
• Viscosity: 12000 to 16000

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  
• Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation; Unfilled

HARDMAN DOUBLE/BUBBLE 4005 Epoxy is Amber in color, two component, room temperature curing, general purpose adhesive that is used for bonding and repairing furniture, tools, aluminum, plastics, metal, rubber, glass, wood, and stone. It offers a long work life, high strength bonds, vibration and... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Wood
• Viscosity: 30000

• Cure / Technology: Two Component  

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
• Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled

HARDMAN DOUBLE/BUBBLE 4002 Epoxy is Aluminum in color, two component, room temperature curing, machineable epoxy that is used for filling voids, patching, and bonding plastics, metal, furniture, leather, glass, wood, and stone. It contains no solvents and has little shrinking. When fully cured it... [See More]

• Substrate Compatibility: Metal; Plastic
• Viscosity: 60000

• Cure / Technology: Two Component  

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Fiberglass/Tanks/Drums/Pipes & Fittings
• Features: High Dielectric; Sealant; Unfilled

• Cure / Technology: Thermoset; Two Component  
• Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling

INSTAbond ® 811UF. Long work life (2 hours), flowable formula. Excellent adhesion to most substrates including dissimilar ones, in particular metals and ceramics. Forms rigid bonds. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal

• Cure / Technology: Two Component  

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
• Type / Form: Liquid

• Cure / Technology: Two Component  
• Features: High Dielectric; Thermally Conductive

3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
• Industry: Aerospace; OEM or Industrial

It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured, epoxy... [See More]

• Substrate Compatibility: Composites; Metal
• Viscosity: 65000 to 120000

• Cure / Technology: Single Component; Heat Curing
• Use Temperature: -67 to 356

Grey. A two-part adhesive kit (2/3 full container of base, 1 full container of accelerator). 1 Quart. Bonds rubber, metal, wood, plastic and masonry. Available Sizes. 1 Quart [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Type / Form: Liquid

• Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Features: Electrically Conductive; Thermally Conductive; Filled

• Cure / Technology: Thermoset; Single Component
• Industry: Electronics; Semiconductors, IC's

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal
• Features: Electrically Conductive; Thermally Conductive; Flexible; Filled

• Cure / Technology: Thermoset; Single Component
• Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's

Vibra-Tite is one of the world ’s market leaders in anaerobics, cyanoacrylates, epoxies and ultraviolet technologies. Vibra-Tite is quickly becoming one of the most highly respected names in the adhesive industry. And, as a result of ND ’s low overhead expenses and in-house capabilities,... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Wood
• Type / Form: Liquid

• Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
• Industry: Construction

Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]

• Substrate Compatibility: Metal; Textiles or Fabrics; Dissimilar Substrates
• Industry: Electronics; Tooling

• Type / Form: Liquid
• Viscosity: 5000

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
• Type / Form: Liquid

• Cure / Technology: UV or Radiation Cured
• Features: Encapsulant, Potting Compound

LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE ® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It can also be used as a "cold solder" for heat sensitive components... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal
• Viscosity: 6500

• Cure / Technology: Two Component  

Devcon Wear Resistant Putty is a smooth, non-rusting ceramic-filled epoxy putty used to repair and rebuild interfacing metallic, low-friction surfaces such as machine ways and flanges. This product will repair in tight spots where a fine flowing putty is required, it will easily bond to steel, iron,... [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic
• Features: Sealant

• Cure / Technology: Thermoset

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
• Features: High Dielectric; Unfilled

3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 is a flexible, two-part epoxy. 2:3 mix ratio, 90 minute work life and handling strength in 10 hours. This kit contains parts A and B. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 cures at room temperature and provides high strength bonds with... [See More]

• Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
• Industry: Aerospace; OEM or Industrial

Clear. A very clear, two-part adhesive for bonding a variety of materials. 1.7 oz. tube. Bonds ceramics, wood and many metals and plastics. Available Sizes. 1.7 oz. tube [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood

• Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; FR4 Substrates, Ferrites
• Type / Form: Liquid

• Cure / Technology: Thermoset; Option of one or two component
• Features: High Dielectric; Unfilled

LOCTITE ABLESTIK 56C CAT 9, Epoxy, Assembly. LOCTITE ® ABLESTIK 56C CAT 9 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures. LOCTITE ABLESTIK... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Use Temperature: 76 to 248

• Cure / Technology: Two Component  

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

• Substrate Compatibility: Metal; Plastic
• Type / Form: Liquid

• Cure / Technology: Two Component  
• Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
• Type / Form: Liquid

• Cure / Technology: UV or Radiation Cured; Single Component
• Features: High Dielectric; Encapsulant, Potting Compound; Sealant

3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  
• Features: Flame Retardant

A specifically formulated epoxy adhesive that will bond treated fluoropolymers to all common materials (wood, metal, glass, ceramics, etc.) One pint offers 80 square feet of coverage. Available Sizes. Container Size: pint [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Wood

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

• Substrate Compatibility: Metal
• Type / Form: Liquid

• Cure / Technology: Thermoset; Single Component
• Features: Electrically Conductive; Thermally Conductive; Filled

LOCTITE ABLESTIK 57C, Epoxy, Assembly. LOCTITE ® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the TDS for alternate cure schedules. Electrically conductive. Thermally conductive. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Use Temperature: 76 to 248

• Cure / Technology: Two Component  
• Thermal Conductivity: 1.75

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Features: Electrically Conductive; Filled

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
• Industry: Electronics

3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 has medium viscosity that... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  
• Features: Flexible

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal
• Type / Form: Gel

• Cure / Technology: Thermoset; Two Component  
• Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; Filled

LOCTITE ABLESTIK CE 3104WXL, Epoxy, Electrically Conductive Adhesive LOCTITE ® ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. This product uses a unique blend of fillers with tightly controlled particle sizes to provide ultra-fine pitch... [See More]

• Substrate Compatibility: Metal
• Features: Leveling Filling

• Cure / Technology: Single Component
• Viscosity: 65000

3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 is a toughened, off white, two-part epoxy. 2:1 mix ratio, 20 minute work life and handling strength in 2 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 has medium viscosity... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
• Industry: Aerospace; OEM or Industrial

• Cure / Technology: Thermoset; Two Component  
• Viscosity: 8000 to 50000

LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE ® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend of fillers with tightly controlled particle sizes to provide fine pitch printing... [See More]

• Substrate Compatibility: Metal
• Features: Leveling Filling

• Cure / Technology: Single Component
• Viscosity: 54000

Two component epoxy adhesive that cures at room temperature or with heat to form a tough, impact-resistant bond. High shear strength. High peel strength. Outstanding environmental resistance. 20 minute worklife. Excellent adhesion to many metal and plastic substrates. [See More]

• Substrate Compatibility: Metal; Plastic
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
• Industry: Aerospace; OEM or Industrial

LOCTITE ABLESTIK 104, Epoxy, Assembly. LOCTITE ® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230 ºC. It has also been tested to withstand short term exposures up to... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal
• Type / Form: Liquid

• Cure / Technology: Two Component  
• Features: High Dielectric

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]

• Substrate Compatibility: Metal; Plastic
• Features: Filled

• Cure / Technology: Thermoset; Single Component
• Industry: Aerospace; OEM or Industrial

LOCTITE ABLESTIK 2106T BIPAX, Epoxy, Assembly LOCTITE ® ABLESTIK 2106T BIPAX is designed for high strength structural bonding applications. LOCTITE ABLESTIK 2106T BIPAX develops significant properties 1 hour after mixing. Two component. Room temperature cure. Solvent-free. Low shrinkage. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Rubber or Elastomer

• Cure / Technology: Two Component  

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 is a cream colored, one-part heat curing high viscosity epoxy,. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

• Substrate Compatibility: Metal
• Type / Form: Liquid

• Cure / Technology: Thermoset; Single Component
• Features: Unfilled

LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
• Features: High Dielectric

• Cure / Technology: Two Component  
• Viscosity: 60000

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

• Substrate Compatibility: Metal
• Type / Form: Liquid

• Cure / Technology: Thermoset; Single Component
• Features: Unfilled

LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE ® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to weather, galvanic action, most petroleum solvents, lubricants, gasoline, jet... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Features: High Dielectric

• Cure / Technology: Two Component  
• Viscosity: 100000

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 is a gray colored, one-part heat curing very high viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

• Substrate Compatibility: Metal
• Type / Form: Liquid

• Cure / Technology: Thermoset; Single Component
• Features: Unfilled

LOCTITE ABLESTIK 2143D, Epoxy, Medium viscosity adhesive, Assembly LOCTITE ® ABLESTIK 2143D medium viscosity adhesive is recommended for industrial bonding and sealing applications where toughness, impact resistance and superior mechanical properties are required. Good toughness. Easy mixing. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Wood
• Viscosity: 38000

• Cure / Technology: Two Component  

3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 is a gray, two-part epoxy. 1:1 mix ratio, 90 minute work life and handling strength in 12 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 has medium viscosity that allows for... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  
• Industry: Aerospace; OEM or Industrial

LOCTITE ABLESTIK 2158 BIPAX, Epoxy, a Two-part Adhesive, Electrically Insulating, Assembly, NCA LOCTITE ® ABLESTIK 2158 BIPAX is a two-part adhesive that develops strong, durable high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. LOCTITE... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood

• Cure / Technology: Two Component  

3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 is a toughened, two-part epoxy. 2:1 mix ratio, 60 minute work life and handling strength in 4 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 has medium viscosity that allows... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
• Industry: Aerospace; OEM or Industrial

• Cure / Technology: Thermoset; Two Component  
• Viscosity: 8000 to 275000

LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive. LOCTITE ® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for alternate cure... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Type / Form: Liquid

• Cure / Technology: Two Component  
• Features: High Dielectric

3M ™ Scotch-Weld ™ Structural Adhesive Film AF 126 FR is a flame retardant, thermosetting, toughened, epoxy adhesive film designed for structural bonding. Cure at temperatures as low as 180F (82C). Excellent strength for honeycomb sandwich applications. High degree of tack in the uncured... [See More]

• Substrate Compatibility: Metal
• Features: Flame Retardant

• Cure / Technology: Thermoset; Single Component
• Industry: Aerospace; OEM or Industrial

LOCTITE ABLESTIK 45, Epoxy, Assembly, General purpose, Adhesive LOCTITE ® ABLESTIK 45 is designed as a general purpose, adhesive and is particularly useful when bonding dissimilar substrates such as metal to plastic. It is designed for use where shock and peel resistance are desired. LOCTITE... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Viscosity: 37000

• Cure / Technology: Single Component
• CTE: 33

3M ™ Scotch-Weld ™ Structural Adhesive Film AF 130-2 is designed for the bonding of honeycomb to metal and metal applications where high performance properties are needed over the -67 to 400 °F (-55 to 204 °C) temperature range. Scotch-Weld AF 130-2 film can be used with 3M... [See More]

• Substrate Compatibility: Metal; Honeycomb Core
• Industry: Aerospace; OEM or Industrial

• Cure / Technology: Thermoset; Single Component
• Use Temperature: -67 to 400

LOCTITE ABLESTIK FDA 2 BIPAX, Epoxy, Medical LOCTITE ® ABLESTIK FDA 2 BIPAX is designed for medical device applications. This material bonds offer resistance to water, weather, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis and other organic and inorganic... [See More]

• Substrate Compatibility: Metal
• Industry: Sanitary

• Cure / Technology: Two Component  
• Viscosity: 14000

LOCTITE ABLESTIK FDA 2T, Epoxy, Medical LOCTITE ® ABLESTIK FDA 2T is designed for medical device applications. LOCTITE ABLESTIK FDA 2T bonds offer resistance to water, weather, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis and other organic and inorganic... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Industry: Sanitary

• Cure / Technology: Two Component  
• Viscosity: 26000

LOCTITE ABLESTIK FDA 8, Epoxy, Medical LOCTITE ® ABLESTIK FDA 8 is designed for bonding and coating applications. LOCTITE ABLESTIK FDA 8 bonds offer resistance to water and weathering, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis and other organic and inorganic... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Industry: Sanitary

• Cure / Technology: Two Component  
• Viscosity: 1500

LOCTITE ABLESTIK G 500HF, Epoxy, Assembly LOCTITE ® ABLESTIK G 500HF is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. One component. Sag resistant. Process ease. Non-abrasive. No flow during cure even on vertical surface. High adhesion strength at elevated... [See More]

• Substrate Compatibility: Metal
• Features: Sealant

• Cure / Technology: Single Component
• Use Temperature: 40 to 356

LOCTITE ECCOBOND F 113, Epoxy, Assembly LOCTITE ® ECCOBOND F 113 is an optically clear adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays and other optical components. LOCTITE ECCOBOND F 113 bonds offer resistance to... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Viscosity: 180

• Industry: Optical
• Use Temperature: 76 to 230

LOCTITE ECCOBOND F 123, Epoxy, Assembly LOCTITE ® ECCOBOND F 123 is formulated for terminating single or multi-channel fiber optic connectors. LOCTITE ECCOBOND F 123 bonds offer resistance to water and weathering, gasses, petroleum products and other organic and inorganic compounds. Fast cure. [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Viscosity: 4000

• Cure / Technology: Two Component  
• Use Temperature: 76 to 347

LOCTITE ECCOBOND F 202, Epoxy, Component assembly, NCA LOCTITE ® ECCOBOND F 202 epoxy adhesive is recommended for photonic applications exposed to high temperatures. This material exhibits low exotherm during its short cure cycle and, for most applications, does not require degassing. Two... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Viscosity: 1000

• Cure / Technology: Two Component  
• Use Temperature: 76 to 509

LOCTITE ECCOBOND F 253, Two-part, Epoxy, Assembly LOCTITE ® ECCOBOND F 253 two-part epoxy is formulated to change color during the cure process to indicate the cure status. LOCTITE ECCOBOND F 253 bonds offer resistance to water and weathering, gasses and vapors, petroleum products and other... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic
• Viscosity: 1750

• Cure / Technology: Two Component  
• Use Temperature: 76 to 347

LOCTITE STYCAST 3103 BIPAX, Epoxy, Potting, Encapsulant LOCTITE ® STYCAST 3103 BIPAX epoxy casting compound is designed for use in applications where a combination of good mechanical, thermal and electrical insulating properties are required. LOCTITE STYCAST 3103 BIPAX passes cytotoxicity... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal

• Cure / Technology: Two Component  

Off-white, 2-part, epoxy adhesive which cures at room temperature to form a tough bondline providing high peel resistance and high shear strengths. LOCTITE ® EA M-21HP is an off-white, 2-part, epoxy adhesive which cures at room temperature once mixed, to form a tough bondline which provides... [See More]

• Substrate Compatibility: Ceramic, Glass; Metal; Plastic

• Industry: Sanitary