Electrical Insulating / Dielectric Epoxy Adhesives
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Features: High Dielectric; UL Rating; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite Ablestik 789-3 Epoxy Die Attach Adhesive Amber is a one component adhesive used for microelectronic applications. It offers good moisture resistance, high bond strength, and is non-conductive. 3 cc Syringe. [See More]
- Features: High Dielectric
- Viscosity: 36500
- Cure / Technology: Single Component
- Thermal Conductivity: 0.3000
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Features: High Dielectric; Non-corrosive; Thermally Conductive; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Electronics; Electric Power; Marine; Sanitary; Photonics; Semiconductors, IC's
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Features: High Dielectric; Non-corrosive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Unfilled
- Substrate Compatibility: Ceramic, Glass; Metal
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Unfilled
- Type / Form: Powder
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Flexible; Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
- Cure / Technology: Thermoset; Two Component
- Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Features: High Dielectric; Sealant; Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Fiberglass/Tanks/Drums/Pipes & Fittings
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Features: High Dielectric; Sealant; Thermally Conductive; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also... [See More]
- Features: High Dielectric; Non-corrosive; Sealant; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Sealant; Anti-static, ESD; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Features: High Dielectric; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Features: High Dielectric; Thermally Conductive
- Type / Form: Liquid
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Industry: Electronics; Sanitary; Optical; Photonics
- Cure / Technology: Thermoset; Two Component
- Viscosity: 2000 to 7000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 104, Epoxy, Assembly. LOCTITE ® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230 ºC. It has also been tested to withstand short term exposures up to... [See More]
- Features: High Dielectric
- Type / Form: Liquid
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Metal
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Features: High Dielectric; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Option of one or two component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; FR4 Substrates, Ferrites
from Epoxies Etc...
UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed... [See More]
- Features: High Dielectric
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Cure / Technology: Two Component
- Viscosity: 60000
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; Filled
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal
from Epoxies Etc...
20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Plastic; Rubber or Elastomer; Dissimilar Substrates
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE ® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to weather, galvanic action, most petroleum solvents, lubricants, gasoline, jet... [See More]
- Features: High Dielectric
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Viscosity: 100000
from Epoxies Etc...
50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]
- Features: High Dielectric; Thermally Conductive; Filled
- Substrate Compatibility: Composites; Metal; Plastic
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive. LOCTITE ® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for alternate cure... [See More]
- Features: High Dielectric
- Type / Form: Liquid
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Epoxies Etc...
50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics; Electric Power
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 45 CLEAR, Epoxy, Assembly, Controllable Flexibility, Clear, Unfilled Adhesive LOCTITE ® ABLESTIK 45 CLEAR is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can adjust the hardness from flexible to rigid. It has an easy mix ratio and bonds well to... [See More]
- Features: High Dielectric
- Viscosity: 20000
- Cure / Technology: Two Component
- Use Temperature: 67 to 176
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE ® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. [See More]
- Features: High Dielectric; Thermally Conductive
- Cure / Technology: Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE ® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive. Black pigmentation for blocking stray light [See More]
- Features: High Dielectric
- Viscosity: 9200
- Cure / Technology: Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-3, Epoxy, Die attach LOCTITE ® ABLESTIK 84-3 adhesive is designed for medium die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand. Electrically Insulating. One component. Solvent-free formulation. Long work life. [See More]
- Features: High Dielectric
- Viscosity: 50000
- Cure / Technology: Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Features: High Dielectric; Thermally Conductive
- Viscosity: 247500
- Cure / Technology: Two Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 958-11, Epoxy, Die attach LOCTITE ® ABLESTIK 958-11 adhesive is designed to absorb stresses produced when bonding large ICs. Non-conductive. Stress absorbing [See More]
- Features: High Dielectric
- Viscosity: 45000
- Cure / Technology: Single Component
- CTE: 24
from Henkel Corporation - Industrial
LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE ® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive. One component. Readily pourable. Fast cure. Good toughness. Excellent chemical resistance [See More]
- Features: High Dielectric; Sealant
- Viscosity: 21500
- Cure / Technology: Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 3280, Epoxy, Rapid Cure, Non-conductive Adhesive LOCTITE ® ABLESTIK NCA 3280 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high throughput in applications, such as, bonding of light diffusing lenses over... [See More]
- Features: High Dielectric
- Viscosity: 46100
- Cure / Technology: Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 3285, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK NCA 3285 is designed for heat sensitive applications requiring a low cure temperature. It cures rapidly providing customers high throughput in applications, such as, bonding of light diffusing lenses over LEDs and... [See More]
- Features: High Dielectric
- Type / Form: Liquid
- Cure / Technology: Single Component
- Viscosity: 59000
from Henkel Corporation - Industrial
LOCTITE ECCOBOND BF 4, Epoxy, Die Attach LOCTITE ® ECCOBOND BF 4 adhesive is designed to encapsulate, protect and provide a structural bond for optoelectronic applications. This material compliments the use of AA50 and AA50T adhesives for active alignment of opto components. The combined use of... [See More]
- Features: High Dielectric
- Viscosity: 23500
- Cure / Technology: Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8387B, Epoxy, Die Attach, Non-Conductive Adhesive. LOCTITE ® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In... [See More]
- Features: High Dielectric
- Viscosity: 9500
- Cure / Technology: Single Component
- CTE: 52
from Henkel Corporation - Industrial
LOCTITE ABLESTIK S3869, Silicone Epoxy Resin, Die Attach, Thermosetting, Dielectric Adhesive LOCTITE ® ABLESTIK S3869 is a thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied by pin transfer,... [See More]
- Features: High Dielectric
- Substrate Compatibility: Ceramic, Glass
- Cure / Technology: Single Component
- Viscosity: 7880