UL Approved Epoxy Adhesives
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Features: High Dielectric; UL Rating; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
from Master Bond, Inc.
Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60 °F to 200... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Thermal Insulation; UL Rating; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Techsil Limited
Techsil ® EP21480 is a two part epoxy resin systems that cures at room temperature to a high gloss black finish. It is flame retardant and thermally conductive. This resin system is slightly flexible to allow for thermal fluctuations and is suitable for the encapsulation of PCB's and general... [See More]
- Features: UL Rating
- Cure / Technology: Thermoset
from DuPont Electronics & Imaging
Product Description. DuPont ™ Pyralux ® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With good processability and high thermal resistivity, Pyralux ® GPL... [See More]
- Features: UL Rating
- CTE: 58
- Industry: Electronics; OEM or Industrial
- Tensile (Break): 1595