Electrical Power / HV Epoxy Adhesives
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 302... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
Henkel Loctite OXY-CAST 6850FT-LV Epoxy with HARDENER RT-7LC is a two component, low viscosity, epoxy casting system that is used for electrical casting, encapsulating, and high voltage applications. It offers high thermal conductivity, electrical, flow, and wetting properties. It is resistant to... [See More]
- Industry: Electric Power
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Viscosity: 3000 to 10000
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 304... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from Ellsworth Adhesives
ResinLab OXY-BOND ™ 109-DP Epoxy Clear is a two component, room temperature curing, resin that is used for laminating, small potting, and industrial applications. It bonds well to plastics, metal, optical fibers, and ceramics. It offers low viscosity, low shrinkage, wide service temperature... [See More]
- Industry: Electric Power
- Viscosity: 2500
- Cure / Technology: Two Component
- Tensile (Break): 7300
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Industry: Aerospace; Electronics; Electric Power; Marine; Sanitary; Photonics; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component
- Features: High Dielectric; Non-corrosive; Thermally Conductive; Unfilled
from Hernon Manufacturing, Inc.
Tuffbond ® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 305... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond ® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 315 is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive; Unfilled
from Hernon Manufacturing, Inc.
Tuffbond ® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 395 will change from amber to a reddish brown upon cure. Bonding the voice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Single Component
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Tuffbond ® 47771 adhesive/sealant is a two-component epoxy. This adhesive is a 100% solid system, one to one ratio, room temperature cure system. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Hernon Manufacturing, Inc.
Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure. Product... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces
- Cure / Technology: Thermoset; Two Component
- Features: Sealant; Unfilled
from Hernon Manufacturing, Inc.
Tuffbond ® 326 is a two-component epoxy known for its low-viscosity, toughness, and long working life at ambient temperatures with shortened cure times at elevated temperatures. The resin offers a combination of high shear strength and hardness. Often used for potting, this epoxy creates a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Two Component
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Cure / Technology: Thermoset; Two Component
- Features: Sealant; Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Metal
- Cure / Technology: Thermoset; Single Component
- Features: High Dielectric; Non-corrosive; Sealant; Unfilled
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Powder
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component
- Features: Non-corrosive; Sealant; Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Flexible; Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Aerospace; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Fiberglass/Tanks/Drums/Pipes & Fittings
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Sealant; Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Cure / Technology: Thermoset; Two Component
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Thermally Conductive; Anti-static, ESD; Filled
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Metal
- Cure / Technology: Thermoset; Single Component
- Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 150000 to 155000
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Option of one or two component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; FR4 Substrates, Ferrites
from Epoxies Etc...
50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Substrate Compatibility: Composites; Metal; Plastic
- Cure / Technology: Thermoset; Single Component
- Features: High Dielectric; Thermally Conductive; Filled
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 80000 to 85000
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Metal
from Epoxies Etc...
50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. [See More]
- Industry: Electronics; Electric Power
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; Unfilled
from Graphene Laboratories, Inc.
G6 Epoxy® is excited to announce the release of our latest product - a one-component electrically conductive epoxy. This innovative solution provides excellent electrical conductivity and bonding strength in a single component formula, making it easier and more convenient to use than traditional... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Features: Electrically Conductive; Sealant
- Cure / Technology: Thermoset; Single Component
- Use Temperature: 600
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Flexible Photovoltaic (Solar) Cell Packaging, Surface Acoustic Wave (SAW) Devices
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Flexible; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 285000 to 295000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Flexible; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 210000 to 220000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Flexible; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 110000 to 125000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, Display Packaging / Bonding, Temperature Sensitive Electronics, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 145000 to 155000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 18000 to 420000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Radio Frequency Identification (RFID) tags, EMI / RFI Shielding, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 220000 to 230000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 290000 to 310000
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; Thermal Interface Materials (TIMs), Solar panels
- Features: Electrically Conductive; Sealant; Filled
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Viscosity: 400000 to 450000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Cold Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 320000 to 500000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 93000 to 440000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Solder Replacement, Display Packaging / Bonding
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Cure / Technology: Thermoset; Two Component
- Viscosity: 110000 to 120000
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; Thermal Interface Materials (TIMs), Solar panels
- Features: Electrically Conductive; Sealant; Filled
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Viscosity: 40000 to 50000