Ceramic / Glass Epoxy Adhesives
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP100 Clear is a two component, fast curing, epoxy based resin that offers high flow, easy mixing, and machinability. 1:1 mix ratio by volume. 400 mL Duo-Pak Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Viscosity: 8000 to 16000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1070
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP110 Clear is a two component, fast curing, epoxy based resin that is used to bond metal and plastics. It offers a controlled flow, flexibility, and 20 minute handling time 48.5 mL Duo-Pak Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 30000 to 70000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1060
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP110 Gray is a two component, fast curing, epoxy based resin that is used to bond metal and plastics. It offers a controlled flow, flexibility, and 20 minute handling time. 48.5 mL Duo-Pak Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 40000 to 90000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1040
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Features: High Dielectric; Non-corrosive; Thermally Conductive; Unfilled
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Electronics; Electric Power; Marine; Sanitary; Photonics; Semiconductors, IC's
from Ellsworth Adhesives
Bostik Epoxy Adhesive 7575 Clear is a two component, structural adhesive that is used for bonding phenolic plastics, glass, wood, masonry, rubber, ceramics, metal, and polyesters. It is typically used for sealing electrical components, encapsulation, and potting applications. It offers fast cure... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Features: Sealant
- Cure / Technology: Two Component
- Viscosity: 12000 to 16000
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant; Thermally Conductive; Unfilled
from Ellsworth Adhesives
HARDMAN DOUBLE/BUBBLE 4005 Epoxy is Amber in color, two component, room temperature curing, general purpose adhesive that is used for bonding and repairing furniture, tools, aluminum, plastics, metal, rubber, glass, wood, and stone. It offers a long work life, high strength bonds, vibration and... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Wood
- Viscosity: 30000
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Features: Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive; Filled
from Ellsworth Adhesives
Henkel Loctite Ablestik 104 Black, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, liquid epoxy adhesive that is used for the assembly of thermoset plastics, metal, ceramics, and glass. It offers a long pot life, high shear strength, non-conductive properties, excellent high... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 25000
- Cure / Technology: Two Component
- Dielectric Strength: 399
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
from Ellsworth Adhesives
Henkel Loctite Ablestik 104 Black, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, liquid epoxy adhesive that is used for the assembly of thermoset plastics, metal, ceramics, and glass. It offers a long pot life, high shear strength, non-conductive properties, excellent high... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 25000
- Cure / Technology: Two Component
- Dielectric Strength: 399
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
from Ellsworth Adhesives
Henkel Loctite Ablestik 104 White, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, powder epoxy adhesive that is used for the assembly of thermoset plastics, metal, ceramics, and glass. It offers a long pot life, high shear strength, non-conductive properties, excellent high... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Dielectric Strength: 399
- Cure / Technology: Two Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
from Ellsworth Adhesives
Henkel Loctite Ablestik 104 White, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, powder epoxy adhesive that is used for the assembly of thermoset plastics, metal, ceramics, and glass. It offers a long pot life, high shear strength, non-conductive properties, excellent high... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Dielectric Strength: 399
- Cure / Technology: Two Component
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
from Ellsworth Adhesives
Henkel Loctite Ablestik 83C Silver, formerly Emerson and Cuming ECCOBOND, is an two component, silver filled, epoxy adhesive paste that is used to replace hot soldering for electrical connections and bonding to plastics, metal, ceramics, and glass. It offers excellent electrical and thermal... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Thermal Conductivity: 2.6
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Unfilled
from Ellsworth Adhesives
Henkel Loctite EA 445 Fast Cure Epoxy is a two component, room temperature curing epoxy adhesive used for high strength, permanent bonding of metals, ceramics, concrete, wood, glass, and most plastics. Includes 10 mixer cups. 4 g Kit. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces
- Features: Sealant; Unfilled
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite EA 9340 is a two component, low viscosity, high strength epoxy adhesive with resistance to chemicals and exceptional high temperature performance. 2.7 oz Kit. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Cure / Technology: Two Component
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Two Component
- Features: High Dielectric; Non-corrosive; Unfilled
from Ellsworth Adhesives
Henkel Loctite EA 9464 is a two component, room temperature curing epoxy adhesive formulated to give good peel strength and shear strength. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Rubber or Elastomer
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite EA E-00CL is a two component, low viscosity, fast-setting, industrial grade epoxy adhesive. It works on a wide variety of substrates including plastic, metal, glass, rubber, wood and ceramics. 50 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer; Wood
- Viscosity: 2200 to 13000
- Cure / Technology: Two Component
- Tensile (Break): 3800
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Features: Sealant; Unfilled
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite EA E-00NS is a industrial grade epoxy adhesive that cures at room temperature, is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. 200 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Viscosity: 20000 to 700000
- Cure / Technology: Two Component
- Tensile (Break): 1500
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Features: High Dielectric; Non-corrosive; Sealant; Unfilled
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite EA E-00NS is a industrial grade epoxy adhesive that cures at room temperature, is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. 50 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Viscosity: 20000 to 700000
- Cure / Technology: Two Component
- Tensile (Break): 1500
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
- Type / Form: Powder
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Unfilled
from Ellsworth Adhesives
Henkel Loctite EA E-05CL is a medium viscosity, industrial grade epoxy adhesive. It is used for bonding metal, glass, plastic, wood, ceramic, and masonry materials. It offers excellent peel resistance and acts as an electrical insulator. 50 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
- Viscosity: 1900
- Cure / Technology: Two Component
- Tensile (Break): 270
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Unfilled
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite EA E-20NS is a non-sag, high peel, high shear, industrial grade epoxy adhesive. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. 50 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 30000 to 280000
- Cure / Technology: Two Component
- Tensile (Break): 3335
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Dissimilar Substrates
- Features: Non-corrosive; Sealant; Unfilled
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite EA E-214HP Gray is a one component, no-mix industrial grade epoxy adhesive. The heat activated formulation provides strong structural bonds and superior thermal shock resistance. 300 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 800000 to 3.00E6
- Cure / Technology: Single Component
- Tensile (Break): 4460
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Flexible; Unfilled
- Cure / Technology: Thermoset; Two Component
- Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite EA E-30CL is a low viscosity, impact resistant, industrial grade epoxy adhesive. When cured it can withstand exposure to a wide range of chemicals and solvents, and maintains stability over a wide temperature range. 50 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Features: Laminaes
- Cure / Technology: Two Component
- Viscosity: 2250 to 10500
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Flexible; Unfilled
from Ellsworth Adhesives
Henkel Loctite EA E-40HT is a two component, industrial grade epoxy adhesive that is used for strong bonding of aluminum, steel, glass, ceramics, and plastics. It offers resistance to shear, impact, and elevated temperatures as well as excellent mechanical and electrical properties. 50 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 16000
- Cure / Technology: Two Component
- Tensile (Break): 269200
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation; Unfilled
from Ellsworth Adhesives
Henkel Loctite EA E-90FL is a flexible, impact resistant general purpose adhesive. Its typical applications include bonding plastic, metal, glass, wood, ceramic, rubber, and masonry materials when flexibility is necessary. 400 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Viscosity: 10000 to 81000
- Cure / Technology: Two Component
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
from Ellsworth Adhesives
Henkel Loctite EA E-90FL is a flexible, impact resistant general purpose adhesive. Its typical applications include bonding plastic, metal, glass, wood, ceramic, rubber, and masonry materials when flexibility is necessary. 50 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Viscosity: 10000 to 81000
- Cure / Technology: Two Component
- Tensile (Break): 1900
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Fiberglass/Tanks/Drums/Pipes & Fittings
- Features: High Dielectric; Sealant; Unfilled
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
Henkel Loctite EA M-121HP is a non-sagging, room temperature curing epoxy adhesive that cures to form a tough bond line with excellent resistance to peel and impact forces. It is ISO 10993 Biological Tested for use in the assembly of disposable medical devices. 50 mL Cartridge. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 2000 to 61000
- Cure / Technology: Two Component
- Tensile (Break): 5910
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
from Ellsworth Adhesives
Henkel Loctite STYCAST 2741 LV Black, formerly Emerson and Cuming, is a two component, room temperature curing, filled epoxy encapsulant that is used for cementing, sealing, bonding, and embedding electronic components, plastics, metal, and glass. It offers low viscosity, flexibility, impact and... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Features: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Two Component
- Viscosity: 16000 to 30000
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
from Electro-Lite Corporation
ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured
- Features: Encapsulant, Potting Compound
from ACCRAbond, Inc.
INSTAbond ® 811UF. Long work life (2 hours), flowable formula. Excellent adhesion to most substrates including dissimilar ones, in particular metals and ceramics. Forms rigid bonds. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Cure / Technology: Two Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE ® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It can also be used as a "cold solder" for heat sensitive components... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Viscosity: 6500
- Cure / Technology: Two Component
from ND Industries, Inc.
Vibra-Tite is one of the world ’s market leaders in anaerobics, cyanoacrylates, epoxies and ultraviolet technologies. Vibra-Tite is quickly becoming one of the most highly respected names in the adhesive industry. And, as a result of ND ’s low overhead expenses and in-house capabilities,... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Wood
- Type / Form: Liquid
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Construction
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
- Type / Form: Liquid
- Cure / Technology: Two Component
- Features: High Dielectric; Thermally Conductive
from Total Plastics, Inc.
Clear. A very clear, two-part adhesive for bonding a variety of materials. 1.7 oz. tube. Bonds ceramics, wood and many metals and plastics. Available Sizes. 1.7 oz. tube [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Substrate Compatibility: Ceramic, Glass
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Encapsulant, Potting Compound; Sealant
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: High Dielectric; Unfilled
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
- Cure / Technology: Thermoset; Single Component
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
from Koford Engineering, LLC
E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Use Temperature: 257 to 356
- Cure / Technology: Thermoset; Single Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: Flame Retardant
from Techsil Limited
Devcon Wear Resistant Putty is a smooth, non-rusting ceramic-filled epoxy putty used to repair and rebuild interfacing metallic, low-friction surfaces such as machine ways and flanges. This product will repair in tight spots where a fine flowing putty is required, it will easily bond to steel, iron,... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic
- Features: Sealant
- Cure / Technology: Thermoset
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 56C CAT 9, Epoxy, Assembly. LOCTITE ® ABLESTIK 56C CAT 9 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures. LOCTITE ABLESTIK... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Use Temperature: 76 to 248
- Cure / Technology: Two Component
from Total Plastics, Inc.
A specifically formulated epoxy adhesive that will bond treated fluoropolymers to all common materials (wood, metal, glass, ceramics, etc.) One pint offers 80 square feet of coverage. Available Sizes. Container Size: pint [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Wood
from Epoxies Etc...
UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; FR4 Substrates, Ferrites
- Type / Form: Liquid
- Cure / Technology: Thermoset; Option of one or two component
- Features: High Dielectric; Unfilled
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 has medium viscosity that... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: Flexible
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 57C, Epoxy, Assembly. LOCTITE ® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the TDS for alternate cure schedules. Electrically conductive. Thermally conductive. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Use Temperature: 76 to 248
- Cure / Technology: Two Component
- Thermal Conductivity: 1.75
from Total Plastics, Inc.
A kit consisting of two components, epoxy resin and hardener. Note: For use with STRONGWELL Fiberglass products. Available Sizes. Kit (E502 Quart). Kit (E504 1/2 Gallon) [See More]
- Substrate Compatibility: Ceramic, Glass
- Cure / Technology: Two Component
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Features: Electrically Conductive; Filled
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; Filled
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 is a toughened, off white, two-part epoxy. 2:1 mix ratio, 20 minute work life and handling strength in 2 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 has medium viscosity... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component
- Viscosity: 8000 to 50000
from Henkel Corporation - Industrial
LOCTITE 3220W, Epoxy, Adhesive and Sealant LOCTITE ® 3220W is designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. LOCTITE 3220W is an white colored version of LOCTITE 3220 adhesive. One... [See More]
- Substrate Compatibility: Ceramic, Glass
- Features: Sealant
- Cure / Technology: Single Component
- Viscosity: 31800
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 is a gray, two-part epoxy. 1:1 mix ratio, 90 minute work life and handling strength in 12 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 has medium viscosity that allows for... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; OEM or Industrial
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 104, Epoxy, Assembly. LOCTITE ® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230 ºC. It has also been tested to withstand short term exposures up to... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Type / Form: Liquid
- Cure / Technology: Two Component
- Features: High Dielectric
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 is a toughened, two-part epoxy. 2:1 mix ratio, 60 minute work life and handling strength in 4 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 has medium viscosity that allows... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Industry: Aerospace; OEM or Industrial
- Cure / Technology: Thermoset; Two Component
- Viscosity: 8000 to 275000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2106T BIPAX, Epoxy, Assembly LOCTITE ® ABLESTIK 2106T BIPAX is designed for high strength structural bonding applications. LOCTITE ABLESTIK 2106T BIPAX develops significant properties 1 hour after mixing. Two component. Room temperature cure. Solvent-free. Low shrinkage. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Rubber or Elastomer
- Cure / Technology: Two Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Features: High Dielectric
- Cure / Technology: Two Component
- Viscosity: 60000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE ® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to weather, galvanic action, most petroleum solvents, lubricants, gasoline, jet... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Features: High Dielectric
- Cure / Technology: Two Component
- Viscosity: 100000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2143D, Epoxy, Medium viscosity adhesive, Assembly LOCTITE ® ABLESTIK 2143D medium viscosity adhesive is recommended for industrial bonding and sealing applications where toughness, impact resistance and superior mechanical properties are required. Good toughness. Easy mixing. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Wood
- Viscosity: 38000
- Cure / Technology: Two Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2158 BIPAX, Epoxy, a Two-part Adhesive, Electrically Insulating, Assembly, NCA LOCTITE ® ABLESTIK 2158 BIPAX is a two-part adhesive that develops strong, durable high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. LOCTITE... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Cure / Technology: Two Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2332-17, Solventless Epoxy, Assembly LOCTITE ® ABLESTIK 2332-17 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130 °C. It combines flexible at low temperatures plus high peel and tensile shear strength over a... [See More]
- Substrate Compatibility: Ceramic, Glass; Plastic
- Viscosity: 75000
- Cure / Technology: Single Component
- Use Temperature: 302
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive. LOCTITE ® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for alternate cure... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Liquid
- Cure / Technology: Two Component
- Features: High Dielectric
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 45, Epoxy, Assembly, General purpose, Adhesive LOCTITE ® ABLESTIK 45 is designed as a general purpose, adhesive and is particularly useful when bonding dissimilar substrates such as metal to plastic. It is designed for use where shock and peel resistance are desired. LOCTITE... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 37000
- Cure / Technology: Single Component
- CTE: 33
from Henkel Corporation - Industrial
LOCTITE ABLESTIK FDA 2T, Epoxy, Medical LOCTITE ® ABLESTIK FDA 2T is designed for medical device applications. LOCTITE ABLESTIK FDA 2T bonds offer resistance to water, weather, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis and other organic and inorganic... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Industry: Sanitary
- Cure / Technology: Two Component
- Viscosity: 26000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK FDA 8, Epoxy, Medical LOCTITE ® ABLESTIK FDA 8 is designed for bonding and coating applications. LOCTITE ABLESTIK FDA 8 bonds offer resistance to water and weathering, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis and other organic and inorganic... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Industry: Sanitary
- Cure / Technology: Two Component
- Viscosity: 1500
from Henkel Corporation - Industrial
LOCTITE ABLESTIK G 757, Epoxy, Assembly LOCTITE ® ABLESTIK G 757 is specially designed to bond automobile headlamp lenses to reflectors. One component. Thixotropic. Bonds to a wide variety of substrates. Excellent stress reduction and absorption properties. Flexible over temperature range of -40... [See More]
- Substrate Compatibility: Ceramic, Glass; Plastic
- Use Temperature: 40 to 284
- Cure / Technology: Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK G 909, Epoxy, Assembly LOCTITE ® ABLESTIK G 909 is designed for very high strength structural bonding especially for dissimilar substrates that will be exposed to a wide range of operating temperatures. One component. High strength. Non-sag. Thixotropic. Excellent peel strength. [See More]
- Substrate Compatibility: Ceramic, Glass; Plastic
- Use Temperature: 40 to 302
- Cure / Technology: Single Component
from Henkel Corporation - Industrial
LOCTITE ECCOBOND F 113, Epoxy, Assembly LOCTITE ® ECCOBOND F 113 is an optically clear adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays and other optical components. LOCTITE ECCOBOND F 113 bonds offer resistance to... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 180
- Industry: Optical
- Use Temperature: 76 to 230
from Henkel Corporation - Industrial
LOCTITE ECCOBOND F 123, Epoxy, Assembly LOCTITE ® ECCOBOND F 123 is formulated for terminating single or multi-channel fiber optic connectors. LOCTITE ECCOBOND F 123 bonds offer resistance to water and weathering, gasses, petroleum products and other organic and inorganic compounds. Fast cure. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 4000
- Cure / Technology: Two Component
- Use Temperature: 76 to 347
from Henkel Corporation - Industrial
LOCTITE ECCOBOND F 202, Epoxy, Component assembly, NCA LOCTITE ® ECCOBOND F 202 epoxy adhesive is recommended for photonic applications exposed to high temperatures. This material exhibits low exotherm during its short cure cycle and, for most applications, does not require degassing. Two... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 1000
- Cure / Technology: Two Component
- Use Temperature: 76 to 509
from Henkel Corporation - Industrial
LOCTITE ECCOBOND F 253, Two-part, Epoxy, Assembly LOCTITE ® ECCOBOND F 253 two-part epoxy is formulated to change color during the cure process to indicate the cure status. LOCTITE ECCOBOND F 253 bonds offer resistance to water and weathering, gasses and vapors, petroleum products and other... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 1750
- Cure / Technology: Two Component
- Use Temperature: 76 to 347
from Henkel Corporation - Industrial
LOCTITE STYCAST 3103 BIPAX, Epoxy, Potting, Encapsulant LOCTITE ® STYCAST 3103 BIPAX epoxy casting compound is designed for use in applications where a combination of good mechanical, thermal and electrical insulating properties are required. LOCTITE STYCAST 3103 BIPAX passes cytotoxicity... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Cure / Technology: Two Component
from Henkel Corporation - Industrial
Off-white, 2-part, epoxy adhesive which cures at room temperature to form a tough bondline providing high peel resistance and high shear strengths. LOCTITE ® EA M-21HP is an off-white, 2-part, epoxy adhesive which cures at room temperature once mixed, to form a tough bondline which provides... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Industry: Sanitary
from Henkel Corporation - Industrial
2-part industrial grade epoxy adhesive. It cures at room temperature to form a tough bondline with excellent resistance to peel and impact forces. LOCTITE ® EA E-120HP is an amber-beige, 2-part, high viscosity, industrial grade epoxy adhesive. The mixture cures at room temperature to form a... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Features: Leveling Filling
- Cure / Technology: Two Component
- Use Temperature: 250 to 350
from Henkel Corporation - Industrial
2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive with extended work life. LOCTITE ® EA E-40HT is an off-white, 2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive with extended work life. It forms a tough bondline... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Features: Leveling Filling
- Cure / Technology: Two Component