Two Component System Epoxy Adhesives
from Ellsworth Adhesives
3M Automix EZ Sand Rigid Parts Repair 5885 is a two component epoxy that is used as a cosmetic filler or for bonding SMC/fiberglass reinforced or rigid plastics for repairs. 200 mL Duo-Pak. [See More]
- Cure / Technology: Two Component
from Hernon Manufacturing, Inc.
Tuffbond ® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the... [See More]
- Cure / Technology: Thermoset; Two Component ; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Beijing Grish Hitech Co., Ltd.
Fiber Adhesive is a kind of thermo-cured epoxy resin adhesive, which is environmentally friendly solvent-free, 100% solid content. It can work continuously in the environment of 200°C, and can also work in the environment of 300-400°C for a short time. Fiber binders are ideal for most common... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
from ELANTAS North America LLC
Trickle resin system for impregnation or protective overcoat [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; UL Rating; Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Dexmet® Corporation, a part of PPG’s engineered materials division
Cuming Microwave currently offers a limited line of adhesives for bonding applications. The product line includes an epoxy and a silicone-based system. Pressure sensitive adhesives are available as options with our elastomeric and foam absorbers. For other adhesive recommendations, please contact... [See More]
- Cure / Technology: Two Component
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 1751 is a two component, room temperature curing, structural adhesive that is used for bonding and repairing metals. It is aluminum filled and has excellent void filling abilities. 1 gal Kit. [See More]
- Cure / Technology: Two Component
- Viscosity: 150000 to 400000
- Substrate Compatibility: Metal
- Thermal Conductivity: 0.2229
from Hernon Manufacturing, Inc.
Tuffbond ® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 395 will change from amber to a reddish brown upon cure. Bonding the voice... [See More]
- Cure / Technology: Thermoset; Two Component ; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 1751 Gray is a two component, room temperature curing, structural adhesive that is used for bonding and repairing metals. It is aluminum filled and has excellent void filling abilities. 2 oz Tube Kit. [See More]
- Cure / Technology: Two Component
- Viscosity: 150000 to 400000
- Substrate Compatibility: Metal
- Thermal Conductivity: 0.2229
from Hernon Manufacturing, Inc.
Tuffbond ® 47771 adhesive/sealant is a two-component epoxy. This adhesive is a 100% solid system, one to one ratio, room temperature cure system. [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 1838 Green is a two component, room temperature curing, structural adhesive that is used for bonding metal, plastics, rubber, and wood. It offers high shear strength, controlled flow, and environmental resistance. 1 qt Can Kit. [See More]
- Cure / Technology: Two Component
- Viscosity: 70000 to 1.00E6
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood
- Thermal Conductivity: 0.1690
from Hernon Manufacturing, Inc.
Tuffbond ® 326 is a two-component epoxy known for its low-viscosity, toughness, and long working life at ambient temperatures with shortened cure times at elevated temperatures. The resin offers a combination of high shear strength and hardness. Often used for potting, this epoxy creates a... [See More]
- Cure / Technology: Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 1838L Clear is a two component, room temperature curing, structural adhesive that is used for bonding metal, plastics, rubber, and wood. It offers high shear strength, flowability, and environmental resistance. 1 qt Kit. [See More]
- Cure / Technology: Two Component
- Viscosity: 6000 to 15000
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood
- Thermal Conductivity: 0.1160
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Clear is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 1:1 mix ratio by volume or... [See More]
- Cure / Technology: Two Component
- Viscosity: 5000 to 15000
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Thermal Conductivity: 0.1140
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Clear is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 1:1 mix ratio by volume or... [See More]
- Cure / Technology: Two Component
- Viscosity: 5000 to 15000
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Thermal Conductivity: 0.1140
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Sealant; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Clear is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 1:1 mix ratio by volume or... [See More]
- Cure / Technology: Two Component
- Viscosity: 5000 to 15000
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Thermal Conductivity: 0.1140
from Master Bond, Inc.
Supreme 34CA exhibits exceptional resistance to aggressive chemicals. It features long term durability and bonds well to metals, glass, ceramics and plastics. It withstands both high and low temperatures. [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Non-corrosive; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 1 gal... [See More]
- Cure / Technology: Two Component
- Viscosity: 40000 to 150000
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Thermal Conductivity: 0.2280
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 1 pt... [See More]
- Cure / Technology: Two Component
- Viscosity: 40000 to 150000
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Thermal Conductivity: 0.2280
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Sealant; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 1 qt... [See More]
- Cure / Technology: Two Component
- Viscosity: 40000 to 150000
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Thermal Conductivity: 0.2280
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
- Type / Form: Powder
- Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive 2216 Gray is a two component, room temperature curing adhesive that is used for bonding metal, plastics, masonry, rubber, and wood. It offers high shear strength, high peel strength, and resistance to aging, vibration, shock, and flexing. 2:3 mix ratio by volume. 2 oz... [See More]
- Cure / Technology: Two Component
- Viscosity: 40000 to 150000
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Thermal Conductivity: 0.2280
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP100 Clear is a two component, fast curing, epoxy based resin that offers high flow, easy mixing, and machinability. 1:1 mix ratio by volume. 400 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Viscosity: 8000 to 16000
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Thermal Conductivity: 0.1070
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Flexible; Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
- Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP100 Clear is a two component, fast curing, epoxy based resin that offers high flow, easy mixing, and machinability. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1070
- Viscosity: 8000 to 16000
- Dielectric Strength: 860
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Type / Form: Liquid
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD; Flexible; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP100FR Cream is a two component, fast curing, self extinguishing, epoxy based resin that offers easy mixing and meets UL 94 V-O. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Viscosity: 40000 to 120000
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP100NS Clear is a two component, fast curing, epoxy based resin that offers non-sag, easy mixing, and machinability. 1:1 mix ratio by volume. 200 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1060
- Viscosity: 50000 to 150000
- Dielectric Strength: 1100
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP100NS Clear is a two component, fast curing, epoxy based resin that offers non-sag, easy mixing, and machinability. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1060
- Viscosity: 50000 to 150000
- Dielectric Strength: 1100
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Sealant; Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Fiberglass/Tanks/Drums/Pipes & Fittings
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP100 PLUS Clear is a two component, fast curing, epoxy based resin that offers flexibility and high shear and peel strength. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.0770
- Viscosity: 4000 to 13000
- Tensile (Break): 1850
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP105 Clear is a two component, fast curing, epoxy sealant/adhesive that is used for bonding dissimilar surfaces that may be exposed to thermal expansion. It offers high peel strength and flexibility. 1:1 mix ratio by volume. 200 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Viscosity: 1000 to 16000
- Features: Sealant
- Thermal Conductivity: 0.0850
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP105 Clear is a two component, fast curing, epoxy sealant/adhesive that is used for bonding dissimilar surfaces that may be exposed to thermal expansion. It offers high peel strength and flexibility. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Viscosity: 1000 to 16000
- Features: Sealant
- Thermal Conductivity: 0.0850
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Thermally Conductive; Anti-static, ESD; Filled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP110 Gray is a two component, fast curing, epoxy based resin that is used to bond metal and plastics. It offers a controlled flow, flexibility, and 20 minute handling time. 48.5 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Viscosity: 40000 to 90000
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Thermal Conductivity: 0.1040
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Features: Encapsulant, Potting Compound; Laminaes; Non-corrosive; Sealant; Thermal Insulation; Flexible
from ACCRAbond, Inc.
INSTAbond ® 804. A two component aluminum filled epoxy paste adhesive. Bonds to steel, porcelain, concrete and wood. In addition, it can be sanded, filed or machined to a featheredge without loss of bond strength. It can also be sawed, ground, taped drilled or threaded with conventional tools. [See More]
- Cure / Technology: Two Component
- Features: Filled
from 3M Aerospace and Aircraft Maintenance Division
Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; OEM or Industrial
- Features: Sealant; Flexible
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® EA 9365FST AERO is a FST retardant toughened paste that provides high color stability after curing. The product is Halogen- and Antimony-free and curable at room temperature or accelerated with heat. Service temperature: -55 to 85 °C (-67 to 185 °F). Halogen- and... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing (optional feature)
- Industry: OEM or Industrial
- Features: Flame Retardant
- Use Temperature: -67 to 185
from Total Plastics, Inc.
Grey. A two-part adhesive kit (2/3 full container of base, 1 full container of accelerator). 1 Quart. Bonds rubber, metal, wood, plastic and masonry. Available Sizes. 1 Quart [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Type / Form: Liquid
from Epoxies Etc...
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; Unfilled
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass
- Type / Form: Liquid
- Features: Encapsulant, Potting Compound; Sealant
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent impact resistance. The fully cured epoxy resin is resistant to various chemicals and solvents,... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from ND Industries, Inc.
Vibra-Tite is one of the world ’s market leaders in anaerobics, cyanoacrylates, epoxies and ultraviolet technologies. Vibra-Tite is quickly becoming one of the most highly respected names in the adhesive industry. And, as a result of ND ’s low overhead expenses and in-house capabilities,... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Metal; Wood
- Type / Form: Liquid
- Industry: Construction
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 16-1LV, Epoxy, General Assembly LOCTITE ® ABLESTIK 16-1LV epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. This material is the lower viscosity version of LOCTITE ABLESTIK 16-1 adhesive. [See More]
- Cure / Technology: Two Component
- Viscosity: 17000
from Protavic America, Inc.
Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for repair work in the field. It also has a convenient 1:1 mix ratio. [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal
- Type / Form: Gel
- Features: Electrically Conductive; Thermally Conductive; Filled
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
- Type / Form: Liquid
- Features: High Dielectric; Thermally Conductive
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Metal; Plastic
- Type / Form: Liquid
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Viscosity: 150000 to 155000
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Leveling Filling; Sealant
- Substrate Compatibility: Honeycomb Core
- Industry: Aerospace; OEM or Industrial
from Total Plastics, Inc.
Clear. A very clear, two-part adhesive for bonding a variety of materials. 1.7 oz. tube. Bonds ceramics, wood and many metals and plastics. Available Sizes. 1.7 oz. tube [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Encapsulant, Potting Compound; Unfilled
- Type / Form: Gel
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE ® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It can also be used as a "cold solder" for heat sensitive components... [See More]
- Cure / Technology: Two Component
- Viscosity: 6500
- Substrate Compatibility: Ceramic, Glass; Metal
from Protavic America, Inc.
Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer
- Type / Form: Liquid
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Unfilled
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Viscosity: 80000 to 85000
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
- Type / Form: Liquid
- Industry: Aerospace; OEM or Industrial
from Total Plastics, Inc.
A kit consisting of two components, epoxy resin and hardener. Note: For use with STRONGWELL Fiberglass products. Available Sizes. Kit (E502 Quart). Kit (E504 1/2 Gallon) [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Electrically Conductive; Filled
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2958, Epoxy, Bonding or Sealing LOCTITE ® ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications that require superior electrical and... [See More]
- Cure / Technology: Two Component
- Use Temperature: 76 to 347
- Viscosity: 40000
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal
- Type / Form: Gel
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive; Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Flexible Photovoltaic (Solar) Cell Packaging, Surface Acoustic Wave (SAW) Devices
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Flexible; Filled
- Viscosity: 285000 to 295000
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 is a flexible, two-part epoxy. 2:3 mix ratio, 90 minute work life and handling strength in 10 hours. This kit contains parts A and B. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 cures at room temperature and provides high strength bonds with... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Type / Form: Liquid
- Industry: Aerospace; OEM or Industrial
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 56C CAT 9, Epoxy, Assembly. LOCTITE ® ABLESTIK 56C CAT 9 adhesive is designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures. LOCTITE ABLESTIK... [See More]
- Cure / Technology: Two Component
- Use Temperature: 76 to 248
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Flexible; Filled
- Viscosity: 210000 to 220000
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Type / Form: Liquid
- Features: Flame Retardant
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 57C, Epoxy, Assembly. LOCTITE ® ABLESTIK 57C adhesive is designed to make electrical connections where hot soldering is impractical and room temperature cure is required. Please refer to the TDS for alternate cure schedules. Electrically conductive. Thermally conductive. [See More]
- Cure / Technology: Two Component
- Use Temperature: 76 to 248
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Thermal Conductivity: 1.75
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Flexible; Filled
- Viscosity: 110000 to 125000
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 has medium viscosity that... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Type / Form: Liquid
- Features: Flexible
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 64C, Epoxy, Assembly. LOCTITE ® ABLESTIK 64C non-silver, electrically conductive adhesive is designed for a wide variety of applications. It is special recommended for use where exposure to sea water causes silver based electrically conductive adhesives to corrode. Please refer... [See More]
- Cure / Technology: Two Component
- Use Temperature: 67 to 266
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, Display Packaging / Bonding, Temperature Sensitive Electronics, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Viscosity: 145000 to 155000
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 is a toughened, off white, two-part epoxy. 2:1 mix ratio, 20 minute work life and handling strength in 2 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 has medium viscosity... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; OEM or Industrial
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Viscosity: 8000 to 50000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 967-1, Epoxy, Die attach LOCTITE ® ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. Low temperature cure, electrically conductive paste with reduced risk to delicate components and increase manufacturing through-put with a... [See More]
- Cure / Technology: Two Component
- Viscosity: 14000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Viscosity: 18000 to 420000
from 3M Aerospace and Aircraft Maintenance Division
A two-component epoxy adhesive which cures at room temperature or with heat to form a tough, impact resistant bond. It has an excellent adhesion to many metal and plastic substrates. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; OEM or Industrial
- Substrate Compatibility: Metal; Plastic
- Viscosity: 8000 to 100000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK CE 3514-1, Epoxy, Assembly, ECA. LOCTITE ® ABLESTIK CE 3514-1 is designed for heat sensitive applications requiring a low cure temperature. Please refer to the TDS for alternate cure schedules. Electrically conductive. Two component. Low viscosity. Long shelf life. Low... [See More]
- Cure / Technology: Two Component
- Viscosity: 35000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Radio Frequency Identification (RFID) tags, EMI / RFI Shielding, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Viscosity: 220000 to 230000
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 is a gray, two-part epoxy. 1:1 mix ratio, 90 minute work life and handling strength in 12 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 has medium viscosity that allows for... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Type / Form: Liquid
- Industry: Aerospace; OEM or Industrial
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 104, Epoxy, Assembly. LOCTITE ® ABLESTIK 104 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 230 ºC. It has also been tested to withstand short term exposures up to... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Metal
- Type / Form: Liquid
- Features: High Dielectric
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation, Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Viscosity: 290000 to 310000
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 is a toughened, two-part epoxy. 2:1 mix ratio, 60 minute work life and handling strength in 4 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 has medium viscosity that allows... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; OEM or Industrial
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Viscosity: 8000 to 275000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2106T BIPAX, Epoxy, Assembly LOCTITE ® ABLESTIK 2106T BIPAX is designed for high strength structural bonding applications. LOCTITE ABLESTIK 2106T BIPAX develops significant properties 1 hour after mixing. Two component. Room temperature cure. Solvent-free. Low shrinkage. [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Rubber or Elastomer
from Graphene Laboratories, Inc.
Our G6E-TSHV ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; Thermal Interface Materials (TIMs), Solar panels
- Features: Electrically Conductive; Sealant; Filled
- Viscosity: 400000 to 450000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2112 BIPAX, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Viscosity: 60000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Cold Solder Replacement
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Viscosity: 320000 to 500000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2116, Epoxy, Staking compound LOCTITE ® ABLESTIK 2116 adhesive is designed for bonding and enhancing the mechanical and structural rigidity of assemblies. LOCTITE ABLESTIK 2116 bonds offer resistance to weather, galvanic action, most petroleum solvents, lubricants, gasoline, jet... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 100000
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Viscosity: 93000 to 440000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2143D, Epoxy, Medium viscosity adhesive, Assembly LOCTITE ® ABLESTIK 2143D medium viscosity adhesive is recommended for industrial bonding and sealing applications where toughness, impact resistance and superior mechanical properties are required. Good toughness. Easy mixing. [See More]
- Cure / Technology: Two Component
- Viscosity: 38000
- Substrate Compatibility: Ceramic, Glass; Metal; Wood
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Solder Replacement, Display Packaging / Bonding
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Filled
- Viscosity: 110000 to 120000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2158 BIPAX, Epoxy, a Two-part Adhesive, Electrically Insulating, Assembly, NCA LOCTITE ® ABLESTIK 2158 BIPAX is a two-part adhesive that develops strong, durable high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. LOCTITE... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
from Graphene Laboratories, Inc.
Our G6E-TSAL ™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; Thermal Interface Materials (TIMs), Solar panels
- Features: Electrically Conductive; Sealant; Filled
- Viscosity: 40000 to 50000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive. LOCTITE ® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for alternate cure... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Liquid
- Features: High Dielectric
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 285 CAT 11, Epoxy, Thermally conductive adhesive LOCTITE ® ABLESTIK 285 CAT 11 adhesive is designed for assembly applications that require thermal management. It is also recommended for low stress bonding applications. LOCTITE ABLESTIK 285 CAT 11 can be used with a variety of... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 1.44
- Use Temperature: 58 to 311
- Dielectric Constant: 5.8
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 342-3.5, Epoxy, General Assembly LOCTITE ® ABLESTIK 342-3.5 epoxy adhesive is designed for general purpose applications. This adhesive cures at room temperature, while providing a reasonable work life. LOCTITE ABLESTIK 342-3.5 adhesive may be used to bond semi-porous materials... [See More]
- Cure / Technology: Two Component
- Viscosity: 5000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 45 CLEAR, Epoxy, Assembly, Controllable Flexibility, Clear, Unfilled Adhesive LOCTITE ® ABLESTIK 45 CLEAR is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can adjust the hardness from flexible to rigid. It has an easy mix ratio and bonds well to... [See More]
- Cure / Technology: Two Component
- Viscosity: 20000
- Features: High Dielectric
- Use Temperature: 67 to 176
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Cure / Technology: Two Component
- Viscosity: 247500
- Features: High Dielectric; Thermally Conductive
from Henkel Corporation - Industrial
LOCTITE ABLESTIK FDA 2 BIPAX, Epoxy, Medical LOCTITE ® ABLESTIK FDA 2 BIPAX is designed for medical device applications. This material bonds offer resistance to water, weather, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis and other organic and inorganic... [See More]
- Cure / Technology: Two Component
- Industry: Sanitary
- Substrate Compatibility: Metal
- Viscosity: 14000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK FDA 2T, Epoxy, Medical LOCTITE ® ABLESTIK FDA 2T is designed for medical device applications. LOCTITE ABLESTIK FDA 2T bonds offer resistance to water, weather, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis and other organic and inorganic... [See More]
- Cure / Technology: Two Component
- Industry: Sanitary
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 26000