Military / Government (MIL-SPEC / GG) Thermoset Adhesives
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76040 is a single component, U.V curable anaerobic sealant. 76040 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Silicone
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Aerospace; Electronics; Military; OEM or Industrial
- Chemical System: Epoxy
- Substrate Compatibility: Dissimilar Substrates
- Composition: Filled
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76041 is a single component U.V. anaerobic sealant. 76041 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Elastomeric
- Substrate Compatibility: Ceramic, Glass; Composites; Metal
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76060 is a single component U.V. anaerobic sealant. 76060 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76061 is a single component U.V. anaerobic sealant. 76061 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76081 is a single component U.V. anaerobic sealant. 76081 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Composition: Unfilled
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76082 is a single component U.V. anaerobic sealant. 76082 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating featuring a forgiving 1 to 1 mix ratio and high temperature resistance up to 400 °F. EP21HT produces high strength, durable bonds that hold up well to thermal cycling and resist many... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76083 is a single component U.V. anaerobic sealant. 76083 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal
- Composition: Unfilled
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76084 is a single component U.V. anaerobic sealant. 76084 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy; Polyurethane
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 40995 is a single component anaerobic thread locking and sealing adhesive. Grenade Igniter Case Sealant 40995 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high-performance thermoset plastic... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100% reactive system which is particularly... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Dissimilar Substrates; Filament Windings, Kevlar Fibers
- Composition: Unfilled
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 47422 is a single component UV and anaerobic curing adhesive. Grenade Igniter Case Sealant 47422 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high performance thermoset plastic suitable for... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Sealant
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP21LV is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a very forgiving 1 to 1 mix ratio by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
HASA 39781 is a single-component, anaerobic, structural adhesive designed for bonding rigid assemblies. HASA 39781 cure is accomplished when mating surfaces including metal, glass and ceramics are joined together. Accelerated cures are possible with the application of primers or by a short, low... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Ceramic
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Polyphenylene Sulfide; Epoxy; Polyurethane
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Filled
from Hernon Manufacturing, Inc.
HASA 722 is a single-component, anaerobic, structural adhesive designed for bonding rigid assemblies. HASA 722 cure is accomplished when mating surfaces including metal, glass and ceramics are joined together. Accelerated cures are possible with the application of primers or by a short, low... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Ceramic
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Tuffbond ® 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 394 will change from amber-yellow to a reddish brown upon cure. Bonding the... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Single Component
- Chemical System: Epoxy
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Hernon Manufacturing, Inc.
Tuffbond ® 395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond ® 395 will change from amber to a reddish brown upon cure. Bonding the voice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Two Component ; Single Component
- Chemical System: Epoxy
from Master Bond, Inc.
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100 °F to +500 °F with a glass transition temperature... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Substrate Compatibility: Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Ultrabond ® 3443 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 3443 is excellent for bonding and tacking many parts. Ultrabond ® 3443 can also be cured with heat above 200 °F (93 °C) or Activator 56 or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass
from Master Bond, Inc.
Master Bond Polymer System EP17 is a toughened one component heat curing epoxy resin system featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at a minimum temperature of 300 °F to 350 °F for 60-90 minutes. Post curing for 1... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
from Hernon Manufacturing, Inc.
Ultrabond ® 71813 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 71813 is excellent for bonding and tacking many parts. Ultrabond ® 71813 can also be cured with heat above 200 °F (93 °C) or Activator 56... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass
from Master Bond, Inc.
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Ultrabond ® 748 is a single component 100% solid adhesive/sealant formulated to bond and seal electronic assemblies. Ultrabond ® 748 can also be cured with heat above 200 °F (93 °C) or using a primer. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Type / Form: Liquid
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full load,... [See More]
- Industry: Automotive; Electronics; Electric Power; Sanitary; Military; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Liquid
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Industry: Electronics; Military; Photonics; Semiconductors, IC's
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Flexible Photovoltaic (Solar) Cell Packaging, Surface Acoustic Wave (SAW) Devices
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Fiber-Optics Packaging, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, Display Packaging / Bonding, Temperature Sensitive Electronics, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Radio Frequency Identification (RFID) tags, EMI / RFI Shielding, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; EMI / RFI Shielding, Grounding, Casting, Coating & Encapsulation, Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Cold Solder Replacement
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture/Repair, Photovoltaic Cell Packaging, Temperature Sensitive Electronics Bonding, Display Packaging/Bonding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Photovoltaic (Solar) Cells, Casting, Coating & Encapsulation, EMI / RFI Shielding, Solder Replacement, Display Packaging / Bonding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component