Filled / Reinforced Thermoset Adhesives
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Substrate Compatibility: Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from MacDermid Alpha Electronics Solutions
Silver-filled thermoplastic paste offers strong bonding for electronics, ideal for MCMs, and superior reworkability. Product Overview. STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or... [See More]
- Composition: Filled
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Thermoplastic / Hot Melt; Thermoset
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond LED405Med is a one part, nano filled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component; LED Cure
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Polyphenylene Sulfide; Epoxy
- Composition: Filled
from Master Bond, Inc.
EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from Master Bond, Inc.
For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K •m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Filled
- Chemical System: Epoxy; Polyurethane
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Silicone
- Composition: Filled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Substrate Compatibility: Ceramic, Glass
- Type / Form: Liquid
- Chemical System: Ceramic
- Composition: Filled
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]
- Substrate Compatibility: Metal; Plastic
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
- Type / Form: Liquid
- Chemical System: Polyurethane
- Composition: Filled
from Epoxies Etc...
10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]
- Substrate Compatibility: Dissimilar Substrates
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-NS10 ™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10 ™ has been developed based on advanced proprietary technology that... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11 ™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Protavic America, Inc.
Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Epoxies Etc...
20-3064 is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 80 Shore D. 20-3064 provides excellent thermal shock resistance and outstanding adhesion. 20-3064 FR... [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FRP ™ is a flexible version of our G6E-P ™ general purpose epoxy. G6E-FRP ™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Substrate Compatibility: Metal
- Type / Form: Liquid
- Chemical System: Epoxy
- Composition: Filled
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXNS ™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS ™ is developed based on advanced proprietary technology that requires... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-FXSG ™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG ™ is well suited for bonding of dissimilar materials that are... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-P ™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P ™ is formulated with proprietary nanomaterials and fillers. G6E-P ™ epoxy can be cured at room... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTC ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC ™ epoxy ’s properties result from being formulated with proprietary... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTNS ™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS ™ is developed based on advanced... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-HTSG ™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG ™ epoxy is formulated with... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTC ™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC ™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-RTSG ™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG ™ epoxy is also... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant
from Graphene Laboratories, Inc.
DESCRIPTION: G6E-SG ™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG ™ is formulated with proprietary nanomaterials and fillers. G6E-SG... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant