Metal Thermoset Adhesives

Devcon Wear Resistant Epoxy Putty (WR-2) 500gm -- ITEP14026
from Techsil Limited

Devcon Wear Resistant Putty is a smooth, non-rusting ceramic-filled epoxy putty used to repair and rebuild interfacing metallic, low-friction surfaces such as machine ways and flanges. This product will repair in tight spots where a fine flowing putty is required, it will easily bond to steel, iron,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Features: Sealant
Electrically and Thermally Conductive Epoxy Adhesive -- EPO-TEK® EK1000-1-D
from Epoxy Technology

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Electrically and Highly Thermally Conductive Die Attach Adhesive -- ALPHA® ATROX® HT900-1
from MacDermid Alpha Electronics Solutions

ATROX ® HT900-1 is a thermosetting conductive die attach adhesive designed for LED packages. The unique chemistry of the ATROX ® HT900-1 allows the material to be cured at lower temperatures compared to standard die attach adhesives, while maintaining its material properties. ATROX ®... [See More]

  • Substrate Compatibility: Metal; Si
  • Features: Electrically Conductive
  • Cure / Technology: Thermoset; Cured by Thermal Processing in Standard IR, Full Convection, Conduction or Vapor Phase Oven Equipment
  • Industry: Electronics; Semiconductors, IC's
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Silicone
  • Composition: Unfilled
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid; Powder
  • Chemical System: Epoxy
  • Composition: Unfilled
Elastomer Based, One Component Adhesive and Primer -- X21
from Master Bond, Inc.

Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal
  • Type / Form: Liquid
  • Chemical System: Elastomeric
  • Composition: Unfilled
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Composition: Filled
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Silicone
  • Composition: Unfilled
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
High Performance, Elastomer-Based, One Component Adhesive -- X-5
from Master Bond, Inc.

Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal
  • Type / Form: Liquid
  • Chemical System: Elastomeric
  • Composition: Unfilled
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
  • Type / Form: Powder
  • Chemical System: Epoxy
  • Composition: Unfilled
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
High Tensile Strength, One Component Epoxy -- EP15
from Master Bond, Inc.

Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Silicone
  • Composition: Filled
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Thermcoat Cement & Lacquer Kit -- THERMCOAT Series
from OMEGA Engineering, Inc.

OMEGA's THERMCOAT KIT is used for cementing fine-gage thermocouples in place on metal, plastic and ceramic surfaces and for assembling and installing thermopiles, temperature probes and thermocouple bolometers. THERMCOAT CO and THERMCOAT COL This is a fast-setting two-part cement which should be... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid (optional feature); Powder (optional feature)
  • Chemical System: Ceramic
  • Cure / Technology: Air Setting / Film Drying (optional feature); Thermoset (optional feature); Single Component
Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. [See More]

  • Substrate Compatibility: Metal; Used with Isobar® Heat Pipe
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Features: Thermally Conductive
5-Minute® Epoxy -- 14250 [14250 from ITW Devcon]
from Applied Industrial Technologies

25 ml dev-tube ™, a rapid-curing, general purpose adhesive/encapsulant [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Flowable, Two-part, Condensation Curing Silicone Rubber -- ELASTOSIL® RT772
from Wacker Chemical Corp.

ELASTOSIL ® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features. two-part, 1 : 1 mixing ratio. low viscosity. low hardness. low risk of inhibition. rapid heat cure. primerless adhesion. Application. encapsulation of electronic components. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Condensation Cured
  • Chemical System: Silicone; Elastomeric
  • Features: Flame Retardant (optional feature); Sealant
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
  • Chemical System: Silicone
  • Composition: Unfilled
3M™ Scotch-Weld™ Epoxy Adhesive -- 1838
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
Magic Bond™ Epoxy Putty -- 11600 [11600 from ITW Devcon]
from Applied Industrial Technologies

4 oz stick, two-colors, can be painted, sanded, machined, drilled, tapped [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Type / Form: Liquid
  • Chemical System: Polyurethane
  • Composition: Filled
3M™ Scotch-Weld™ Epoxy Adhesive -- 2216 Gray B/A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 is a flexible, two-part epoxy. 2:3 mix ratio, 90 minute work life and handling strength in 10 hours. This kit contains parts A and B. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 cures at room temperature and provides high strength bonds with... [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Plastic Steel® 5 Minute® Putty -- 10240 [10240 from ITW Devcon]
from Applied Industrial Technologies

1 lb kit, fast-curing steel-filled epoxy for emergency repairs up to 40F [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Porous Surfaces
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
Clear UV Adhesive -- ANA-97773
from Protavic America, Inc.

ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Composition: Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
3M™ Scotch-Weld™ Epoxy Adhesive -- DP100 FR
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Polyurethane elastomer series -- 70-2800R
from Epoxies Etc...

70-2800 Polyurethane Elastomer Series are a line of high performance urethane prepolymers based on menthane diisocyanate, MDI. They do not contain MOCA or TDI. 70-2800 Urethanes are very low in viscosity, have extremely low shrinkage, and excellent air release properties. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Plastic Steel® Putty (A) -- 10110 [10110 from ITW Devcon]
from Applied Industrial Technologies

1 lb kit, metal-filled epoxy putty, can be drilled, tapped, machined, paint [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Porous Surfaces
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
3M™ Scotch-Weld™ Epoxy Adhesive -- DP125
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 has medium viscosity that... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Titanium Putty -- 10760 [10760 from ITW Devcon]
from Applied Industrial Technologies

1 lb kit, use to make repairs that can be precision machined [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Porous Surfaces
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Filled
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; FR4 Substrates, Ferrites
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
3M™ Scotch-Weld™ Epoxy Adhesive -- DP420 Off-White
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 is a toughened, off white, two-part epoxy. 2:1 mix ratio, 20 minute work life and handling strength in 2 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 has medium viscosity... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Industry: Aerospace; OEM or Industrial
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Type / Form: Liquid
  • Chemical System: Polyurethane
  • Composition: Unfilled
3M™ Scotch-Weld™ Epoxy Adhesive -- EC 2615 B/A
from 3M Aerospace and Aircraft Maintenance Division

Two component epoxy adhesive that cures at room temperature or with heat to form a tough, impact-resistant bond. High shear strength. High peel strength. Outstanding environmental resistance. 20 minute worklife. Excellent adhesion to many metal and plastic substrates. [See More]

  • Substrate Compatibility: Metal; Plastic
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
3M™ Scotch-Weld™ Epoxy Adhesive -- EC-2214
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]

  • Substrate Compatibility: Metal; Plastic
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
3M™ Scotch-Weld™ Epoxy Adhesive -- EC1386 Cream
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 is a cream colored, one-part heat curing high viscosity epoxy,. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
3M™ Scotch-Weld™ Epoxy Adhesive -- EC1469 Cream
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
3M™ Scotch-Weld™ Epoxy Adhesive -- EC2086 Gray
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 is a gray colored, one-part heat curing very high viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled
3M™ Scotch-Weld™ High Performance Plastic Adhesive -- 1099L Tan
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Nitrile High Performance Plastic Adhesive 1099L is a low viscosity fast drying and heat curable Nitrile adhesive. Tan can bond most vinyls (supported and unsupported) wood, metal, rubber to fiberglass, painted, primed or bare steel, and molded plastics. This product... [See More]

  • Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood; Dissimilar Substrates; Fiberglass
  • Type / Form: Liquid
  • Chemical System: Elastomeric
  • Cure / Technology: Air Setting / Film Drying; Thermoset; Single Component
3M™ Scotch-Weld™ Structural Adhesive -- DP 190 Gray
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 is a gray, two-part epoxy. 1:1 mix ratio, 90 minute work life and handling strength in 12 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 has medium viscosity that allows for... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
3M™ Scotch-Weld™ Structural Adhesive -- DP 460 Off-White
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 is a toughened, two-part epoxy. 2:1 mix ratio, 60 minute work life and handling strength in 4 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 has medium viscosity that allows... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Industry: Aerospace; OEM or Industrial
3M™ Scotch-Weld™ Structural Adhesive Film -- AF 126 FR
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Structural Adhesive Film AF 126 FR is a flame retardant, thermosetting, toughened, epoxy adhesive film designed for structural bonding. Cure at temperatures as low as 180F (82C). Excellent strength for honeycomb sandwich applications. High degree of tack in the uncured... [See More]

  • Substrate Compatibility: Metal
  • Type / Form: Sheet or Film
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
3M™ Scotch-Weld™ Structural Adhesive Film -- AF 130-2
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Structural Adhesive Film AF 130-2 is designed for the bonding of honeycomb to metal and metal applications where high performance properties are needed over the -67 to 400 °F (-55 to 204 °C) temperature range. Scotch-Weld AF 130-2 film can be used with 3M... [See More]

  • Substrate Compatibility: Metal; Honeycomb Core
  • Type / Form: Sheet or Film
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
3M™ Scotch-Weld™ Structural Adhesive Film -- AF 30
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Structural Adhesive Film AF 30 is an unsupported, thermosetting film adhesive developed for structural bonding of metals and high strength plastic laminates (epoxy and phenolic). Some advantages of Scotch-Weld ™ AF 30 are high shear strength, high peel strength,... [See More]

  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Type / Form: Sheet or Film
  • Features: Flexible
3M™ Scotch-Weld™ Structural Adhesive Primer -- EC-1593 Blue
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Structural Adhesive Primer EC-1593 is a sprayable primer for use with 3M ™ Scotch-Weld ™ Structural Adhesive Film AF 30. This product is suggested for use where good aluminum and magnesium overlap shear strengths from -67 °F to 180 °F (-55 °C to... [See More]

  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Chemical System: Elastomeric
  • Cure / Technology: Thermoset; Single Component
3M™ Scotch-Weld™ Urethane Adhesive -- 3532 B/A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ 3532 B/A Urethane Adhesive is a two-component, polyurethane adhesive which cures at room temperature or with heat to form tough, impact-resistant structural bonds. Provides excellent adhesion to many primed or painted metal and plastic substrates and is designed to... [See More]

  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Features: Flexible
3M™ Scotch-Weld™ Urethane Adhesive -- 3535 B/A
from 3M Aerospace and Aircraft Maintenance Division

Two-component, polyurethane adhesive which cures at room temperature. Forms tough, impact-resistant structural bonds. Excellent adhesion to many primed or painted metal and plastic substrates. Designed to develop sag resistance approximately 30 seconds after mixing. Work Life: 100 grams mixed at 75F... [See More]

  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Features: Flexible
3M™ Scotch-Weld™ Urethane Adhesive -- 3549 B/A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Urethane Adhesive 3549 is a flexible, two-part urethane. This kit contains parts A and B. 3M ™ Scotch-Weld ™ Urethane Adhesive 3549 cures at room temperature or with heat to produce impact-resistant, high peel strength bonds on primed or painted metal and... [See More]

  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Industry: Aerospace; OEM or Industrial