Epoxy (EP) Thermoset Adhesives

79 Results
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
  • Composition: Unfilled
LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach -- LOCTITE ABLESTIK 5025E
from Henkel Adhesive Technologies - Aviation, Space and Rail

LOCTITE ® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control. Provides RF/EMI shielding. Electrically conductive in x, y, z axes. Excellent electrical and... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
  • Type / Form: Sheet or Film
  • Industry: OEM or Industrial
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Thermoset; Two Component  
LOCTITE ABLESTIK 84-1LMINB1, Epoxy, Die attach -- LOCTITE ABLESTIK 84-1LMINB1
from Henkel Adhesive Technologies - Aviation, Space and Rail

LOCTITE ® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. Electrically conductive. Long work life. Bonds difficult to wet surfaces [See More]

  • Chemical System: Epoxy
  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset
  • CTE: 28
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Unfilled
LOCTITE ABLESTIK 84-1LMIT1, Epoxy, Die Attach -- LOCTITE ABLESTIK 84-1LMIT1
from Henkel Adhesive Technologies - Aviation, Space and Rail

LOCTITE ® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive. High thermal conductivity. Solvent-free formulation. Low viscosity [See More]

  • Chemical System: Epoxy
  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset
  • Viscosity: 22000
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations -- EP3HTND-2Med Black
from Master Bond, Inc.

EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Thermoset; Single Component
LOCTITE ABLESTIK CF 3366, Epoxy film, Assembly -- LOCTITE ABLESTIK CF 3366
from Henkel Adhesive Technologies - Aviation, Space and Rail

LOCTITE ® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. LOCTITE ABLESTIK CF 3366 passes NASA outgassing... [See More]

  • Chemical System: Epoxy
  • Industry: OEM or Industrial
  • Cure / Technology: Thermoset
  • Viscosity: 7500
Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C -- EP126
from Master Bond, Inc.

Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid; Powder
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
LOCTITE EA 9365FST AERO
from Henkel Adhesive Technologies - Aviation, Space and Rail

LOCTITE ® EA 9365FST AERO is a FST retardant toughened paste that provides high color stability after curing. The product is Halogen- and Antimony-free and curable at room temperature or accelerated with heat. Service temperature: -55 to 85 °C (-67 to 185 °F). Halogen- and... [See More]

  • Chemical System: Epoxy
  • Features: Flame Retardant
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing (optional feature)
  • Industry: OEM or Industrial
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
LOCTITE ECCOBOND UF 1173, Epoxy, 2nd Level Underfill -- LOCTITE ECCOBOND UF 1173
from Henkel Adhesive Technologies - Aviation, Space and Rail

LOCTITE ® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173... [See More]

  • Chemical System: Epoxy
  • Features: Leveling Filling
  • Cure / Technology: Thermoset
  • Industry: OEM or Industrial
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Filled
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Unfilled
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Unfilled
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51
from Master Bond, Inc.

Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Composition: Unfilled
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces
  • Cure / Technology: Thermoset; Two Component  
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31
from Master Bond, Inc.

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
  • Cure / Technology: Thermoset; Two Component  
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoset; Single Component
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Chemical System: Epoxy
  • Type / Form: Powder
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
  • Composition: Unfilled
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33
from Master Bond, Inc.

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Thermoset; Two Component  
High Tensile Strength, One Component Epoxy -- EP15
from Master Bond, Inc.

Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces; Dissimilar Substrates
  • Cure / Technology: Thermoset; Single Component
Low Exotherm, Two Component Epoxy -- EP29LP
from Master Bond, Inc.

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
  • Cure / Technology: Thermoset; Two Component  
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
  • Composition: Unfilled
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Unfilled
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
  • Composition: Unfilled
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Fiberglass/Tanks/Drums/Pipes & Fittings
  • Cure / Technology: Thermoset; Two Component  
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Filled
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Composition: Filled
5-Minute® Epoxy -- 14250 [14250 from ITW Devcon]
from Applied Industrial Technologies

25 ml dev-tube ™, a rapid-curing, general purpose adhesive/encapsulant [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
  • Composition: Unfilled
Devcon 2 Ton Epoxy Clear (14260) 50ml Cartridge -- ITEP14014
from Techsil Limited

Devcon 2 Ton Epoxy is extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, wood, concrete, glass etc. General purpose. It dries clear to achieve an extremely strong rigid bond with excellent thixotropic and void filling properties. The adhesive bond... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Composition: Unfilled
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoset; Single Component
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
3M™ Scotch-Weld™ Adhesive And Sealant Kit -- 3537
from 3M Aerospace and Aircraft Maintenance Division

Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]

  • Chemical System: Epoxy
  • Features: Flexible; Sealant
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Aerospace; OEM or Industrial
Magic Bond™ Epoxy Putty -- 11600 [11600 from ITW Devcon]
from Applied Industrial Technologies

4 oz stick, two-colors, can be painted, sanded, machined, drilled, tapped [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
  • Cure / Technology: Thermoset; Two Component  
Devcon 2 Ton Epoxy Clear (20222) 200ml Cartridge -- ITEP14020
from Techsil Limited

Devcon 2 Ton epoxy is an extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, woods, concrete, glass etc. 2 Ton Epoxy is a general purpose material which dries to a clear product to achieve an extremely strong rigid bond with excellent thixotropic... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; FR4 Substrates, Ferrites
  • Composition: Unfilled
3M™ Scotch-Weld™ Core Splice Adhesive -- EC-3500 Part A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Honeycomb Core
  • Features: Leveling Filling; Sealant
Plastic Steel® 5 Minute® Putty -- 10240 [10240 from ITW Devcon]
from Applied Industrial Technologies

1 lb kit, fast-curing steel-filled epoxy for emergency repairs up to 40F [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Porous Surfaces
  • Composition: Filled
Devcon 5 Minute Epoxy (14251) 25ml - 28gm Devtube -- ITEP14011
from Techsil Limited

Devcon 5 minute epoxy is a rapid curing multi purpose adhesive and encapsulating resin. It bonds rigid, durable substrates such as metal, glass, ceramics, concrete, and wood in minutes. The bonds are permanent and non shrinking and can work down to -40C when cured. It has good dielectric strength... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Electrically Conductive Epoxy -- 40-3905
from Epoxies Etc...

40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Metal
  • Composition: Filled
3M™ Scotch-Weld™ Epoxy Adhesive -- 1838
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Plastic Steel® Putty (A) -- 10110 [10110 from ITW Devcon]
from Applied Industrial Technologies

1 lb kit, metal-filled epoxy putty, can be drilled, tapped, machined, paint [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Porous Surfaces
  • Composition: Filled
Devcon 5 Minute Epoxy (14270) 50ml Cartridge -- ITEP14012
from Techsil Limited

Devcon 5 minute epoxy is a rapid curing multi purpose adhesive and encapsulating resin. It bonds rigid, durable substrates such as metal, glass, ceramics, concrete, and wood in minutes. This Devcon epoxy offers bonds which are permanent, non shrinking and will continue working all the way down to... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Chemical System: Epoxy
  • Type / Form: Gel
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Composition: Filled
3M™ Scotch-Weld™ Epoxy Adhesive -- 2216 Gray B/A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 is a flexible, two-part epoxy. 2:3 mix ratio, 90 minute work life and handling strength in 10 hours. This kit contains parts A and B. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2216 cures at room temperature and provides high strength bonds with... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Titanium Putty -- 10760 [10760 from ITW Devcon]
from Applied Industrial Technologies

1 lb kit, use to make repairs that can be precision machined [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Porous Surfaces
  • Composition: Filled
Devcon Wear Resistant Epoxy Putty (WR-2) 500gm -- ITEP14026
from Techsil Limited

Devcon Wear Resistant Putty is a smooth, non-rusting ceramic-filled epoxy putty used to repair and rebuild interfacing metallic, low-friction surfaces such as machine ways and flanges. This product will repair in tight spots where a fine flowing putty is required, it will easily bond to steel, iron,... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic
  • Features: Sealant
3M™ Scotch-Weld™ Epoxy Adhesive -- DP100 FR
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  
LOCTITE® 3513 Underfill Epoxy Adhesive 20ml -- HEEP50004
from Techsil Limited

LOCTITE ® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits. Cures rapidly on exposure to heat. Low viscosity allow gap filling. Reworkable. Provides excellent protection from mechanical stress. Technical... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
3M™ Scotch-Weld™ Epoxy Adhesive -- DP125
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP125 has medium viscosity that... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  
LOCTITE® 3513 Underfill Epoxy Adhesive 30ml -- HEEP50005
from Techsil Limited

LOCTITE ® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits. Cures rapidly on exposure to heat. Low viscosity allow gap filling. Reworkable. Provides excellent protection from mechanical stress. Technical... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
3M™ Scotch-Weld™ Epoxy Adhesive -- DP420 Off-White
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 is a toughened, off white, two-part epoxy. 2:1 mix ratio, 20 minute work life and handling strength in 2 hours. 3M ™ Scotch-Weld ™ EPX ™ 200 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP420 has medium viscosity... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Industry: Aerospace; OEM or Industrial
MG Chemicals 8331 Silver Conductive Epoxy 115gm -- MGEP00007
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Industry: Electronics
3M™ Scotch-Weld™ Epoxy Adhesive -- EC-2214
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]

  • Chemical System: Epoxy
  • Composition: Filled
  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
MG Chemicals Med Cure Thermal Epoxy Adhesive 6ml -- MGEP00014
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Chemical System: Epoxy
  • Features: Thermally Conductive
  • Cure / Technology: Thermoset
  • Industry: Electronics
3M™ Scotch-Weld™ Epoxy Adhesive -- EC1386 Cream
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 is a cream colored, one-part heat curing high viscosity epoxy,. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1386 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Metal
  • Composition: Unfilled
MG Chemicals Silver Conductive Epoxy (10 Min) 14gm -- MGEP00006
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Industry: Electronics
3M™ Scotch-Weld™ Epoxy Adhesive -- EC1469 Cream
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 is a cream colored, one-part heat curing low viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-1469 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Metal
  • Composition: Unfilled
MG Chemicals Silver Conductive Epoxy (10 Min) 19gm -- MGEP00004
from Techsil Limited

MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]

  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Industry: Electronics
3M™ Scotch-Weld™ Epoxy Adhesive -- EC2086 Gray
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 is a gray colored, one-part heat curing very high viscosity epoxy. 3M ™ Scotch-Weld ™ Epoxy Adhesive EC-2086 eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Metal
  • Composition: Unfilled
MG Chemicals Silver Conductive Epoxy (4 Hour) 21gm -- MGEP00005
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Industry: Electronics
3M™ Scotch-Weld™ Structural Adhesive -- DP 190 Gray
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 is a gray, two-part epoxy. 1:1 mix ratio, 90 minute work life and handling strength in 12 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP190 has medium viscosity that allows for... [See More]

  • Chemical System: Epoxy
  • Type / Form: Liquid
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  
MG Chemicals Silver Conductive Epoxy (4 Hour)125gm -- MGEP00008
from Techsil Limited

MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]

  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Industry: Electronics
3M™ Scotch-Weld™ Structural Adhesive -- DP 460 Off-White
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 is a toughened, two-part epoxy. 2:1 mix ratio, 60 minute work life and handling strength in 4 hours. 3M ™ Scotch-Weld ™ EPX ™ Plus II applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP460 has medium viscosity that allows... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Industry: Aerospace; OEM or Industrial
MG Chemicals Slow Cure Thermal Epoxy Adhesive 6ml -- MGEP00003
from Techsil Limited

MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Chemical System: Epoxy
  • Features: Thermally Conductive
  • Cure / Technology: Thermoset
  • Industry: Electronics
3M™ Scotch-Weld™ Structural Adhesive Film -- AF 126 FR
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Structural Adhesive Film AF 126 FR is a flame retardant, thermosetting, toughened, epoxy adhesive film designed for structural bonding. Cure at temperatures as low as 180F (82C). Excellent strength for honeycomb sandwich applications. High degree of tack in the uncured... [See More]

  • Chemical System: Epoxy
  • Type / Form: Sheet or Film
  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component
MG Chemicals Thermal Conductive Epoxy 50ml -- MGEP00002
from Techsil Limited

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]

  • Chemical System: Epoxy
  • Features: Electrically Conductive; Thermally Conductive
  • Cure / Technology: Thermoset
  • Industry: Electronics
3M™ Scotch-Weld™ Structural Adhesive Film -- AF 130-2
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Structural Adhesive Film AF 130-2 is designed for the bonding of honeycomb to metal and metal applications where high performance properties are needed over the -67 to 400 °F (-55 to 204 °C) temperature range. Scotch-Weld AF 130-2 film can be used with 3M... [See More]

  • Chemical System: Epoxy
  • Type / Form: Sheet or Film
  • Substrate Compatibility: Metal; Honeycomb Core
  • Cure / Technology: Thermoset; Single Component
Panacol Vitralit UC 1619 UV Curable Epoxy 30gm -- PNVI00023
from Techsil Limited

Panacol Vitralit ® UC 1619 is a uv-curable compound designed for opto-electronic components like LED and VCSEL. This product features excellent transmission (650-1300nm) along with ionic pureness, non-yellowing and extremely good thermal shock resistance when operating between -55 °C and... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; UV or Radiation Cured
3M™ Scotch-Weld™ Structural Splice Adhesive Film -- AF 3002
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Core Splice Adhesive Film AF 3002 is a 250-350 °F (121-177 °C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C)... [See More]

  • Chemical System: Epoxy
  • Type / Form: Sheet or Film
  • Substrate Compatibility: Honeycomb Core
  • Cure / Technology: Thermoset; Single Component
Techsil® EP20860 Clear Rapid Epoxy Adhesive 50ml -- TEEP14131
from Techsil Limited

Techsil ® EP20860 is a two part, rapid curing epoxy adhesive that cures at room temperature with low shrinkage and forms an ultra-clear bond line. Techsil ® EP20860 offers a flexible and impact resistant bond that is resistant to a wide range of chemicals with excellent electrical... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Techsil® EP21480 Black UL Approved Epoxy 250gm -- TEEP14133
from Techsil Limited

Techsil ® EP21480 is a two part epoxy resin systems that cures at room temperature to a high gloss black finish. It is flame retardant and thermally conductive. This resin system is slightly flexible to allow for thermal fluctuations and is suitable for the encapsulation of PCB's and general... [See More]

  • Chemical System: Epoxy
  • Features: UL Rating
  • Cure / Technology: Thermoset