Electrically Conductive Compound (Adhesive, Grease) Thermoset Adhesives
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications. Electrically conductive. Thermally conductive. Good dispensing characteristics. Hydrophobic [See More]
- Features: Electrically Conductive
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Thermoset
- CTE: 34
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Filled
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Phase Change; Sealant; Thermally Conductive
- Chemical System: Silicone
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive
- Chemical System: Polyphenylene Sulfide; Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT-1 has... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT has an... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Optical Fibers and Reinforcements
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Thermally Conductive; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]
- Features: Flexible; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Laminaes; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Sealant; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Sealant; Thermally Conductive; Anti-static, ESD
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Composition: Filled
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Features: Flexible; Electrically Conductive; EMI/RFI Shielding; Non-corrosive; Sealant; Thermally Conductive
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Composition: Filled
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Composition: Filled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Thermally Conductive
- Chemical System: Silicone
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Liquid
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Epoxies Etc...
40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat. [See More]
- Features: Electrically Conductive
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Composition: Filled
from Wacker Chemical Corp.
SEMICOSIL ® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features. Low volume resistivity. Thixotropic paste. Solvated. Excellent adhesion to many substrates. Application. SEMICOSIL ® 979 EC is an electrically conductive adhesive for... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from Protavic America, Inc.
ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing process. [See More]
- Features: Electrically Conductive; Thermal Insulation
- Type / Form: Liquid
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Composition: Unfilled
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Features: Flexible; Electrically Conductive; Thermally Conductive
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal
- Composition: Filled
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics