Flame Retardant (e.g. UL 94 Rated) Thermoset Adhesives
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; UL Rating
- Chemical System: Silicone
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP17 is a toughened one component heat curing epoxy resin system featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at a minimum temperature of 300 °F to 350 °F for 60-90 minutes. Post curing for 1... [See More]
- Features: Flame Retardant; Non-corrosive; Sealant
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP126 is a two component toughened epoxy resin based high temperature resistant adhesive system with continuous service capability at 500 °F and outstanding chemical resistance. This unique high performance epoxy adhesive compound can also withstand temperatures as... [See More]
- Features: Flame Retardant; Non-corrosive; Sealant
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
- Type / Form: Liquid; Powder
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]
- Features: Flame Retardant
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Type / Form: Liquid
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Features: Flexible; High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Thermal Insulation; UL Rating
- Chemical System: Polyurethane
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
- Type / Form: Liquid
from Wacker Chemical Corp.
ELASTOSIL ® RT 705 is a self-levelling, thixotropic, addition-cross-linking, thermal-curing, one-component silicone rubber. Special features. ready-to-use, one-component. self-levelling. high extrusion rate. fast curing at high temperatures. good heat stability -. excellent primerless adhesion... [See More]
- Features: Flame Retardant
- Chemical System: Silicone; Elastomeric
- Substrate Compatibility: Metal
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured material is flame retardant. Meets the flammability requirements of F.A.R. 25.853 (a). [See More]
- Features: Flame Retardant; Leveling Filling; Sealant
- Chemical System: Epoxy
- Substrate Compatibility: Honeycomb Core
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Features: Flexible; Electrically Conductive; Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive; UL Rating
- Chemical System: Silicone
- Substrate Compatibility: Metal
- Type / Form: Gel
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Structural Adhesive Film AF 126 FR is a flame retardant, thermosetting, toughened, epoxy adhesive film designed for structural bonding. Cure at temperatures as low as 180F (82C). Excellent strength for honeycomb sandwich applications. High degree of tack in the uncured... [See More]
- Features: Flame Retardant
- Chemical System: Epoxy
- Substrate Compatibility: Metal
- Type / Form: Sheet or Film