Solvent Based (Volatile Organic) Epoxy Adhesives Datasheets

Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation; Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Features: Solvent Based; Threadlocker or Retainer
  • Type / Form: Liquid
  • Cure / Technology: Single Component
  • Substrate Compatibility: Metal