Leveling / Filling Compound Epoxy Adhesives
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Unfilled
- Type / Form: Powder
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Solvent Based; Thermal Insulation; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100 °F to +500 °F with a glass transition temperature... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a mixed viscosity of 2,000-5,000 cps, enabling it to be used for potting small components. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety of substrates including metals, ceramics, glass, optical fibers, graphite and many rubbers and plastics. Its... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Sealant; Thermally Conductive; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]
- Features: Leveling Filling; Sealant
- Substrate Compatibility: Honeycomb Core
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; OEM or Industrial
from Henkel Corporation - Industrial
LOCTITE ABLESTIK CE 3104WXL, Epoxy, Electrically Conductive Adhesive LOCTITE ® ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. This product uses a unique blend of fillers with tightly controlled particle sizes to provide ultra-fine pitch... [See More]
- Features: Leveling Filling
- Substrate Compatibility: Metal
- Cure / Technology: Single Component
- Viscosity: 65000
from Epoxies Etc...
10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV Weatherometer... [See More]
- Features: High Dielectric; Leveling Filling; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics; OEM or Industrial
from Henkel Adhesive Technologies - Aviation, Space and Rail
LOCTITE ® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173... [See More]
- Features: Leveling Filling
- Industry: OEM or Industrial
- Cure / Technology: Thermoset
from R. S. Hughes Company, Inc.
3M 05883 blue two-part epoxy adhesive is compatible with frp and smc materials. Provides a 10 min working time. [See More]
- Features: Leveling Filling
from 3M Aerospace and Aircraft Maintenance Division
Dual-cure 120c or 180c curing, low-density, expandable product for these applications: honeycomb sandwich edge finishing, filling mismatched areas, and core splicing and reinforcing honeycomb core. Fulfills stand-alone fire, smoke and toxic gas emission (FST) requirements according to FAR 25.853 or... [See More]
- Features: Leveling Filling; Sealant
- Substrate Compatibility: Honeycomb Core
- Cure / Technology: Single Component
- Industry: Aerospace; OEM or Industrial
from Henkel Corporation - Industrial
LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE ® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend of fillers with tightly controlled particle sizes to provide fine pitch printing... [See More]
- Features: Leveling Filling
- Substrate Compatibility: Metal
- Cure / Technology: Single Component
- Viscosity: 54000
from R. S. Hughes Company, Inc.
3M 05885 blue two-part epoxy adhesive is compatible with frp and smc materials with a 4 hr cure time. Provides a 10 min working time. [See More]
- Features: Leveling Filling
from Henkel Corporation - Industrial
2-part industrial grade epoxy adhesive. It cures at room temperature to form a tough bondline with excellent resistance to peel and impact forces. LOCTITE ® EA E-120HP is an amber-beige, 2-part, high viscosity, industrial grade epoxy adhesive. The mixture cures at room temperature to form a... [See More]
- Features: Leveling Filling
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Use Temperature: 250 to 350
from R. S. Hughes Company, Inc.
3M 08107 clear two-part epoxy adhesive is compatible with fiberglass, glass, metal, plastic and wood materials with a 60 min cure time. Provides a 3 min working time. Delivers great performance with a shear strength of 110 psi and peel strength of 2 piw. [See More]
- Features: Leveling Filling
from Henkel Corporation - Industrial
2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive with extended work life. LOCTITE ® EA E-40HT is an off-white, 2-part, room temperature-cure, high viscosity, industrial grade structural epoxy adhesive with extended work life. It forms a tough bondline... [See More]
- Features: Leveling Filling
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
from R. S. Hughes Company, Inc.
3M 08115 black two-part epoxy adhesive is compatible with aluminum, frp, smc and steel materials with a 24 hr cure time. Provides a 90 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3309 psi. [See More]
- Features: Leveling Filling
from Henkel Corporation - Industrial
To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE ® E-40EXP Hysol, a two-component, room-temperature-curing epoxy potting compound designed to pass UL testing and maintain more than 85% of its compression... [See More]
- Features: Leveling Filling
- Viscosity: 24000
- Cure / Technology: Two Component
- Thermal Conductivity: 1.25
from R. S. Hughes Company, Inc.
3M 08116 amber two-part epoxy adhesive is compatible with aluminum, frp, smc and steel materials with a 24 hr cure time. Provides a 90 to 120 min working time. [See More]
- Features: Leveling Filling
from Henkel Corporation - Industrial
LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE ® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are required. This two-part adhesive... [See More]
- Features: Leveling Filling
- Industry: Optical
- Cure / Technology: Two Component
- Viscosity: 25000
from R. S. Hughes Company, Inc.
3M 08217 clear two-part epoxy adhesive is compatible with glass, metal and plastic materials with a 60 min cure time. Provides a 3 min working time. Minimum to maximum operating temperatures are -20 F to +180 F. [See More]
- Features: Leveling Filling
- Use Temperature: -20 to 180
- Viscosity: 8000 to 15000
from R. S. Hughes Company, Inc.
3M 08227 white / black two-part epoxy adhesive with a 2 hr cure time. Provides a 4 min working time. Minimum to maximum operating temperatures are -20 F to +180 F. [See More]
- Features: Leveling Filling
- Use Temperature: -20 to 180
from R. S. Hughes Company, Inc.
3M 08274 black two-part epoxy adhesive is compatible with aluminum, frp, smc and steel materials with a 24 hr cure time. Provides a 90 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3309 psi. [See More]
- Features: Leveling Filling
from R. S. Hughes Company, Inc.
3M 08275 blue two-part epoxy adhesive is compatible with frp and smc materials. [See More]
- Features: Leveling Filling
from R. S. Hughes Company, Inc.
3M 08307 amber two-part epoxy adhesive. Provides a 15 min working time. [See More]
- Features: Leveling Filling
from R. S. Hughes Company, Inc.
3M 08641 black two-part epoxy adhesive with a 24 hr cure time. Provides a 5 min working time. [See More]
- Features: Leveling Filling
from R. S. Hughes Company, Inc.
3M 58115 epoxy adhesive is compatible with aluminum, frp, smc and steel materials. [See More]
- Features: Leveling Filling
from R. S. Hughes Company, Inc.
3M Scotch-Weld 100 amber two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal and wood materials with a 48 hr cure time. Provides a 5 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 1500 psi and peel strength of 2 piw. [See More]
- Features: Leveling Filling
- Viscosity: 5000 to 20000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 100 clear two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal and wood materials with a 48 hr cure time. Provides a 5 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 1500 psi and peel strength of 2 piw. [See More]
- Features: Leveling Filling
- Viscosity: 5000 to 20000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 100FR cream two-part epoxy adhesive is compatible with ceramic, glass and metal materials with a 48 hr cure time. Provides a 6 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2200 psi and peel strength of 2 piw. [See More]
- Features: Leveling Filling
- Viscosity: 50000 to 150000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 100NS clear two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal and wood materials with a 48 hr cure time. Provides a 5 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 1500 psi and peel strength of 2 piw. [See More]
- Features: Leveling Filling
- Viscosity: 50000 to 150000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 100NS clear two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal and wood materials with a 48 hr cure time. Provides a 5 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 1500 psi and peel strength of 2 piw. [See More]
- Features: Leveling Filling
- Viscosity: 50000 to 150000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 105 clear two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal, plastic, rubber and wood materials with a 48 hr cure time. Provides a 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2000 psi, tensile strength... [See More]
- Features: Leveling Filling
- Viscosity: 8000 to 16000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 105 clear two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal, plastic, rubber and wood materials with a 48 hr cure time. Provides a 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2000 psi, tensile strength... [See More]
- Features: Leveling Filling
- Viscosity: 8000 to 16000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 110 clear two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal, plastic, rubber and wood materials with a 48 hr cure time. Provides a 10 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2500 psi and peel... [See More]
- Features: Leveling Filling
- Viscosity: 30000 to 70000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 110 clear two-part epoxy adhesive is compatible with ceramic, fiberboard, metal, plastic, rubber and wood materials with a 48 hr cure time. Provides a 10 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2500 psi and peel strength of 20... [See More]
- Features: Leveling Filling
- Viscosity: 30000 to 70000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 110 gray two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal, plastic, rubber and wood materials with a 48 hr cure time. Provides a 8 to 13 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2500 psi and peel... [See More]
- Features: Leveling Filling
- Viscosity: 40000 to 90000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 110 gray two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal, plastic, rubber and wood materials with a 48 hr cure time. Provides a 8 to 13 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2500 psi and peel... [See More]
- Features: Leveling Filling
- Viscosity: 40000 to 90000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 125 gray two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal, plastic, rubber and wood materials with a 7 day cure time. Provides a 25 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 4300 psi, tensile strength... [See More]
- Features: Leveling Filling
- Viscosity: 35000 to 75000
from R. S. Hughes Company, Inc.
3M Scotch-Weld 125 gray two-part epoxy adhesive is compatible with ceramic, fiberboard, glass, metal, plastic, rubber and wood materials with a 7 day cure time. Provides a 25 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 4300 psi, tensile strength... [See More]
- Features: Leveling Filling
- Viscosity: 35000 to 75000