Fixmaster® Fast Cure Poxy Pak™ -- 81120 [81120 from Henkel Corporation]
from Applied Industrial Technologies

Bonds virtually any material to repair, fill, and seal holes, cracks, etc.. [See More]

  • Features: Flame Retardant; Leveling Filling; Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
3M™ Scotch-Weld™ Core Splice Adhesive -- EC-3500 Part A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]

  • Features: Leveling Filling; Sealant
  • Substrate Compatibility: Honeycomb Core
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; OEM or Industrial
Plastic Steel® -- 10110 [10110 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Features: Leveling Filling; Sealant; Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Porous Surfaces
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Filled
  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset
  • Use Temperature: 400
Ultra Clear Epoxy Adhesive -- 10-3713
from Epoxies Etc...

10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV Weatherometer... [See More]

  • Features: High Dielectric; Leveling Filling; Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Electronics; OEM or Industrial