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  • Case Studies Highlighting Possibilities in Packaging Design
    range of packaging applications to provide exceptional properties that meet the most challenging and demanding conditions.
  • Fundamentals of Microsystems Packaging
    Fundamentals of Microsystems Packaging. Written by Rao Tummala, the field s leading author, this rigorous, thorough introduction to electronic packaging technologies provides a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and much more.
  • Basics of Medical Package Testing
    The release of a terminally sterilized medical device or product to the marketplace is the. culmination of monumental design and development effort. Efficient, effective and safe usage. characteristics are critical. Once the product has met its own design criteria, the package in. which
  • Packages Drop Testing
    . Able to withstand slump height and impact strength. Therefore, according to the actual situation of the product and the scope of national standards, improve and improve the packaging design.
  • Washington Letter: FMEA as a Packaging Tool
    labeling and packaging design and assessment, and that drug manufacturers be required to submit those assessments as part of any new drug application (NDA). It also urges the FDA to publish two separate guidance documents, one on naming, the other on labeling and packaging, by the end of 2006
  • Solid Dose Filling & Packaging Line Success Story
    Our customer's proposed package design had unique design elements that were not easily accommodated by readily available solid dose filling and packaging equipment. To offset the increased components' costs due to the nature of some of the package features, the new production platform would have to:
  • Updated ISO Packaging Standard Nears Publication
    , manufacturing, and package design requirements for terminally sterilized medical device packaging
  • System-in-Package RF Design and Applications
    System-in-Package RF Design and Applications. Offering a solid grasp of RF components together with state-of-the-art packaging strategies, this practical guide will help you meet today s increasingly demanding requirements for reliability, manufacturability, RF performance, size, and cost.

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