Boards - Bare PCB Automated Test Equipment

Description

Bare PCB Automated Test Equipment is designed to verify the completeness and integrity of a printed circuit board (PCB) circuit before it undergoes assembly and wave soldering. This equipment ensures that the PCB is free from defects such as shorts or open circuits, which could affect the performance of the final assembled product.

Working Principle

Bare PCB Automated Test Equipment operates by connecting each circuit net on the board to a tester, typically using a configuration known as a bed-of-nails (BON). In this setup, pins are aligned to make contact with test points on the PCB, and these pins are connected to a measuring unit by wires. When the device under test (DUT) is pressed against the BON, contact is made simultaneously with numerous individual test points. This method allows for quick and efficient testing of the PCB's electrical pathways, ensuring that all connections are intact and functioning as intended. The equipment is useful because it automates the testing process, reducing the need for manual inspection and increasing the speed and accuracy of defect detection.

Applications

Bare PCB Automated Test Equipment is used in various industries where PCBs are a critical component. For example, in the electronics manufacturing industry, it is employed to test PCBs used in consumer electronics, automotive electronics, and telecommunications equipment. Specific applications include testing PCBs for smartphones, computers, and automotive control systems, where ensuring the integrity of the circuit before assembly is crucial to the reliability of the final product.

Advantages over other Automated Test Equipment

One of the primary advantages of bare PCB automated test equipment is its ability to quickly confirm whether a DUT works and pinpoint defects with minimal human interaction. This reduces testing time and increases repeatability and cost efficiency, especially in high-volume production environments. Compared to other testing methods like flying probe testing, the bed-of-nails configuration can provide faster test times due to its simultaneous contact with multiple test points.

Limitations

Despite its advantages, bare PCB automated test equipment has limitations. The upfront costs for programming and setup can be significant, which may not be justifiable for low-volume production runs. Additionally, the bed-of-nails configuration requires precise alignment of pins to test points, which can be challenging with high-density PCBs. This method also typically requires a vacuum or air source to ensure proper hold-down force, adding to the complexity and cost of the setup.

Considerations

When considering the implementation of bare PCB automated test equipment, several factors should be taken into account. Initial costs can be high due to the need for custom fixtures and programming. Operating expenses may include maintenance of the equipment and the need for a vacuum or air source. Durability and accuracy are generally high, but the equipment requires regular calibration and maintenance to ensure continued precision. Replacement and maintenance costs should also be considered, as wear and tear on the pins and fixtures can lead to additional expenses over time.

2 Results
Boundry Scan Controllers
from JTAG Technologies Inc.

Boundary-scan test and programming applications are only as dependable as the hardware they run on. JTAG Technologies has the industry's most reliable IEEE 1149.x controllers, specifically designed by us for high throughput and the best signal integrity. High-speed DataBlaster controllers are... [See More]

  • Component / Product Tested: BareBoard; Loaded PCBs
  • Type / Form: Module, Sub-system or ATE Component
VERTEX SERIES A -- A-75
from VJ Technologies, Inc.

Our Vertex Series-A is a versatile, all purpose X-Ray system with a new modular design based on solid SRT engineering and offering a 20" x 24" Inspection area with 100% coverage. [See More]

  • Component / Product Tested: BareBoard; Loaded PCBs; Electronic Components and Assemblies
  • Tester / Test Capability: Manufacturing Defect Analyzer; X-ray
  • Type / Form: Platform or Turnkey System; Output Measurement or Monitoring Unit
  • Features: SPC