Non-corrosive Cure Polyurethane Adhesives and Sealants

ELAN-Tron® -- U 225 Black Resin / UH 510S Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Unfilled; Flexible; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Substrate Compatibility: Dissimilar Substrates
Cryogenically Serviceable Epoxy Urethane System -- EP30DP-NV
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Features: High Dielectric; Flexible; Laminaes; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7
from Master Bond, Inc.

Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance... [See More]

  • Features: High Dielectric; Flexible; Laminaes; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Features: Unfilled; Flexible; Non-corrosive; Thermal Insulation
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Cure / Technology: Reactive or Moisture Cured; Single Component; Thermoset; UV or Radiation Cured
One Component, Biocompatible UV Curable Adhesive -- UV10Med
from Master Bond, Inc.

Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating and is castable beyond 1/8" thick. The cured system has good chemical resistant properties particularly to... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Thermal Insulation
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
One Component, UV and Heat Curable Epoxy -- UV15DC80
from Master Bond, Inc.

Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80 °C for 15-30 minutes. In addition, UV15DC80 has outstanding physical properties including superb physical strength characteristics... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Thermal Insulation
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Transparent, Highly Flexible Epoxy Compound -- EP30D-10
from Master Bond, Inc.

Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Features: High Dielectric; Flexible; Laminaes; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System -- Super Gel 9AO
from Master Bond, Inc.

Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9... [See More]

  • Features: High Dielectric; Unfilled; Laminaes; Non-corrosive
  • Type / Form: Gel; Liquid
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
USP Class VI Certified, Two Component Epoxy -- EP30Med
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at evelated temperatures. It has a 4 to 1 mix ratio by weight... [See More]

  • Features: High Dielectric; EMI/RFI Shielding; Filled; Flexible; Laminaes; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates