Electrically Conductive Polyurethane Adhesives and Sealants
from MacDermid Alpha Electronics Solutions
This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview. UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal conductivity, making it ideal for applications where heat dissipation is... [See More]
- Features: Electrically Conductive; Flame Retardant
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one to one mix ratio. Upon curing the EP21TDCHT offers high shear and peel strength which allows it to be... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique... [See More]
- Features: Electrically Conductive; Unfilled; Thermal Insulation
- Type / Form: Liquid
- Compound Type: Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic