Encapsulating / Potting Polyurethane Adhesives and Sealants

ELAN-Tron® -- U 225 Black Resin / UH 510S Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Substrate Compatibility: Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
Cytec CONATHANE EN-1554 Polyurethane Encapsulant Amber 1 gal Kit -- EN-1554 AMBER GAL KIT [EN-1554 AMBER GAL KIT from Cytec Corporation]
from Ellsworth Adhesives

Cytec CONATHANE EN-1554 Polyurethane Resin System Amber is a two component, polyether based system that is used for casting, molding, potting, and encapsulating electrical assemblies such as connectors, print circuit boards, cables, pumps, and conveyors. It cures at room to elevated temperatures and... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Two Component  
Hysol STYCAST U2500 -- 8799570460673
from Henkel Corporation - Electronics

Stycast U2500 is an encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings. [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Industry: Electronics
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component  
  • Viscosity: 5000
Cryogenically Serviceable Epoxy Urethane System -- EP30DP
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
Conap™ Filtration Adhesives & Sealants -- CONATHANE® FP-1303
from ACCRAbond, Inc.

CONATHANE ® FP-1303 White or Amber is a two-component, unfilled, fast setting polyurethane sealant designed for use in HEPA and other air filtration devices. CONATHANE ® FP-1303 is also used for potting, casting, embedding, and encapsulating of electronic circuits, components, and power... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Cure / Technology: Two Component  
Electrical Encapsulation System -- VORATRON®
from Dow Polyurethanes

Energy has always had a special bond with Dow. Over 110 years ago, our company was founded when Herbert Dow used electricity to create bromine and chlorine from salt – a process still in use. Today, we ’re one of the largest suppliers of solutions that protect, conserve and manage energy... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Industry: Electric Power; Power Equipment, Power Transmission and Distribution Equipment
  • Substrate Compatibility: Metal; Plastic
Filled Polyurethane Elastomer -- 20-2350 (35%)
from Epoxies Etc...

This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
  • Type / Form: Liquid
  • Features: Filled
Adhesive -- GSP 1539-4
from GS Polymers, Inc.

Two part, 1:2, fast cure, provides superior adhesion to vinyl [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Features: Unfilled
Filter-bond™ Elastomeric Casting and Potting Compound -- E-3264
from Hapco, Inc.

Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Cure / Technology: Two Component  
  • Type / Form: Liquid
  • Features: Flexible
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Compound Type: Encapsulant, Potting Compound; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component