Encapsulating / Potting Polyurethane Adhesives and Sealants

Industrial Adhesives -- LOCTITE STYCAST UV 7993
from Henkel Corporation - Industrial

LOCTITE STYCAST UV 7993, Urethane, Conformal coating LOCTITE STYCAST UV 7993 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]

  • Compound Type: Encapsulant, Potting Compound; Adhesive
  • Viscosity: 120
  • Cure / Technology: Single Component; UV or Radiation Cured
ELAN-Tron® -- U 225 Black Resin / UH 510S Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Substrate Compatibility: Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
Cryogenically Serviceable Epoxy Urethane System -- EP30DP-NV
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
Techsil VT2420LV Clear Potting Polyurethane 250gm -- TEEP14085
from Techsil Limited

Techsil ® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Industry: Electronics
ELANTAS PDG CONATHANE EN-11 Polyurethane Encapsulant Part B 1 gal Can -- EN-11 PART B GAL [124948 from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-11 Polyurethane Amber is a two component, liquid molding and encapsulating system that is used to protect electrical assemblies against extreme environments. It offers flexibility, low viscosity, hydrolytic stability, high dielectric strength, and resistance to fungus,... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 4000 to 5750
  • Cure / Technology: Two Component  
  • Tensile (Break): 750
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7
from Master Bond, Inc.

Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
Techsil® PU23930 Pearl Polyurethane Twinpack 250gm -- TEEP14087
from Techsil Limited

Techsil ® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features. Excellent long term UV stability. Scratch and mark resistant. Non-toxic. High mechanical strength. Easy to mix... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Industry: Electronics
ELANTAS PDG CONATHANE EN-14 Polyurethane Encapsulant 1 gal Kit -- EN-14 GAL KIT [EN-14 GAL KIT from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-14 Polyurethane Elastomer System is a two component, unfilled polyurethane that is used for encapsulation and potting of electrical and heat sensitive assemblies. It offers flexibility, low viscosity, fast curing, fast gelling, and resistance to water and thermal shock. It... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 1200
  • Cure / Technology: Two Component  
  • Tensile (Break): 700
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
Techsil® PU23955 Pearl Potting PU 250gm -- TEPU14434
from Techsil Limited

Techsil PU23955 is a two part component potting compound which cures to an opaque translucent material that is stable in UV light. Once mixed, the system reacts at room temperature to produce a tough abrasion resistant material with good hydrolysis resistance. There are many applications for this... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Industry: Electronics
ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant Black 1 gal Kit -- EN-1556 BLACK GAL [EN-1556 BLACK GAL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-1556 Polyurethane Resin System Black is a two component, polyether based system that is used for casting, molding, potting, and encapsulating electrical assemblies such as connectors, print circuit boards, cables, pumps, and conveyors. It cures at room to elevated... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 10400
  • Cure / Technology: Two Component  
  • Tensile (Break): 5000
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Cure / Technology: Reactive or Moisture Cured; Single Component; Thermoset; UV or Radiation Cured
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Features: Unfilled; Flexible; Non-corrosive; Thermal Insulation
ELANTAS PDG CONATHANE EN-20 Polyurethane Encapsulant 1 gal Kit -- EN-20 GAL KIT [EN-20 GAL KIT from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-20 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 1200
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 5.10E-4
One Component, Biocompatible UV Curable Adhesive -- UV10Med
from Master Bond, Inc.

Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating and is castable beyond 1/8" thick. The cured system has good chemical resistant properties particularly to... [See More]

  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Single Component; Thermoset; UV or Radiation Cured
ELANTAS PDG CONATHANE EN-21 Polyurethane Encapsulant 1 gal Kit -- EN-21 GAL KIT [EN-21 GAL KIT from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 800 to 6000
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 7.10E-4
One Component, UV and Heat Curable Epoxy -- UV15DC80
from Master Bond, Inc.

Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80 °C for 15-30 minutes. In addition, UV15DC80 has outstanding physical properties including superb physical strength characteristics... [See More]

  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Single Component; Thermoset; UV or Radiation Cured
ELANTAS PDG CONATHANE EN-21 Polyurethane Encapsulant 1 qt Kit -- EN-21 QT KIT [EN-21 QT KIT from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Thermal Conductivity: 7.10E-4
  • Viscosity: 2000
  • Tensile (Break): 2000
Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
ELANTAS PDG CONATHANE EN-21 Polyurethane Encapsulant Part A 5 gal Pail -- EN-21 PART A 5-GAL [EN-21 PART A 5-GAL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 2000
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 7.10E-4
Transparent, Highly Flexible Epoxy Compound -- EP30D-10
from Master Bond, Inc.

Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
ELANTAS PDG CONATHANE EN-21 Polyurethane Encapsulant Part B 5 gal Pail -- EN-21 PART B 5-GAL [EN-21 PART B 5-GAL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Tensile (Break): 2000
  • Viscosity: 800
  • Elongation: 155.0
Two Component Epoxy with Outstanding Flexibility -- EP21TDC-2
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient, non-critical one to three mix... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
ELANTAS PDG CONATHANE EN-2521 Polyurethane Encapsulant Black 1 gal Kit -- EN-2521 BLACK GAL KIT [EN-2521 BLACK GAL KIT from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-2521 Polyurethane Resin System Black is a two component, filled system that is used for potting and encapsulation of transformers, circuitry, coils, and modules. It cures at room to elevated temperatures and offers good electrical properties, low exotherm, low shrinkage, and... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 4500
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.0015
Two Component, Highly Flexible Epoxy -- EP21TDC-4
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one-to-four mix ratio by weight. The cured... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
ELANTAS PDG CONATHANE EN-2523 Polyurethane Encapsulant Black 1 gal Kit -- EN-2523 BLACK GAL KIT [EN-2523 BLACK GAL KIT from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-2523 Polyurethane Casting System Black is a two component, filled system that is used for potting electrical assemblies that are exposed to extreme environments and thermal shock. It cures at room to elevated temperatures and offers good electrical properties, low exotherm,... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 2800
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 4.50E-4
Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System -- Super Gel 9AO
from Master Bond, Inc.

Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9... [See More]

  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Gel; Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
ELANTAS PDG CONATHANE EN-2534 Polyurethane Encapsulant Black 5 gal Kit -- EN-2534 BLACK 5-GAL KIT [EN-2534 BLACK 5-GAL KIT from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-2534 Polyurethane Potting System Black is a two component, filled, non-mercury system that is used for potting electrical assemblies that are exposed to extreme environments and thermal shock. It cures at room to elevated temperatures and offers good electrical properties,... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 2200
  • Cure / Technology: Two Component  
  • Tensile (Break): 1970
USP Class VI Certified, Two Component Epoxy -- EP30Med
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at evelated temperatures. It has a 4 to 1 mix ratio by weight... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
ELANTAS PDG CONATHANE EN-2550 Polyurethane Encapsulant Black 5 gal Kit -- EN-2550 BLACK 5-GAL KIT [EN-2550 BLACK 5-GAL KIT from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-2550 Polyurethane Resin System Black is a two component, filled, non-mercury system that is used for casting high voltage transforms, encapsulating and potting electrical assemblies. It cures at room to elevated temperatures and offers good electrical properties, low... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 3000
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 8.00E-4
USP Class VI, Flexible UV Curable Adhesive -- UV18Med
from Master Bond, Inc.

Master Bond UV18Med is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a... [See More]

  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Single Component; Thermoset; UV or Radiation Cured
ELANTAS PDG CONATHANE EN-4 Polyurethane Encapsulant Part A 1 gal Can -- EN-4 PART A GAL [EN-4 PART A GAL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-4 Polyurethane Resin System is a two component, non-MBOCA system that is used for molding and potting electrical assemblies that are exposed to extreme thermal changes. It is typically used for print circuit boards, electrical cables, connectors, strain sensitive devices,... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 9000
  • Cure / Technology: Two Component  
  • Tensile (Break): 2000
ELANTAS PDG CONATHANE EN-7 Polyurethane Encapsulant Part B 1 gal Can -- EN-7 PART B GAL [EN-7 PART B GAL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-7 Polyurethane Resin System is a two component, non-MBOCA system that is used for molding and potting electrical assemblies that are exposed to extreme thermal changes. It is typically used for print circuit boards, electrical cables, connectors, strain sensitive devices,... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 1000
  • Cure / Technology: Two Component  
  • Tensile (Break): 2000
ELANTAS PDG CONATHANE EN-7 Polyurethane Encapsulant Part B 1 qt Can -- EN-7 PART B QT [EN-7 PART B QT from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONATHANE EN-7 Polyurethane Resin System is a two component, non-MBOCA system that is used for molding and potting electrical assemblies that are exposed to extreme thermal changes. It is typically used for print circuit boards, electrical cables, connectors, strain sensitive devices,... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Viscosity: 1000
  • Cure / Technology: Two Component  
  • Tensile (Break): 2000
Electrical Encapsulation System -- VORATRON®
from Dow Polyurethanes

Energy has always had a special bond with Dow. Over 110 years ago, our company was founded when Herbert Dow used electricity to create bromine and chlorine from salt – a process still in use. Today, we ’re one of the largest suppliers of solutions that protect, conserve and manage energy... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Industry: Electric Power; Power Equipment, Power Transmission and Distribution Equipment
  • Substrate Compatibility: Metal; Plastic
Hysol STYCAST U2500 -- 8799570460673
from Henkel Corporation - Electronics

Stycast U2500 is an encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings. [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Industry: Electronics
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component  
  • Viscosity: 5000
Conap™ Flame Retardant Potting & Casting Compound -- CONATHANE® EN-2541
from ACCRAbond, Inc.

CONATHANES ® EN-2541 and EN-2543 are filled, flame resistant polyurethane resins, specially formulated for general purpose electrical/electronic potting, casting and encapsulation. When tested in accordance with UL-94, flame resistance ratings of 94V-O are obtained. EN-2541 and EN-2543 have... [See More]

  • Compound Type: Encapsulant, Potting Compound
Filter-bond™ Elastomeric Casting and Potting Compound -- E-3264
from Hapco, Inc.

Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Cure / Technology: Two Component  
  • Type / Form: Liquid
  • Features: Flexible
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Compound Type: Encapsulant, Potting Compound; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
Filled Polyurethane Elastomer -- 20-2350 (35%)
from Epoxies Etc...

This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
  • Type / Form: Liquid
  • Features: Filled
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Substrate Compatibility: Composites; Metal; Plastic
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Single Component; UV or Radiation Cured
Thermally Conductive PU Potting Compound -- 50-2366 FR
from Epoxies Etc...

50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
  • Type / Form: Liquid
  • Features: Filled; Flame Retardant; UL Rating