Encapsulating / Potting Polyurethane Adhesives and Sealants
from MacDermid Alpha Electronics Solutions
Flame-retardant polyurethane UL94-approved resin. Soft enough for dig-out work, it remains flexible over a wide temperature range. Product Overview. UR5044 Flame Retardant Polyurethane Resin is a UL94-approved two-part system developed for potting and encapsulation of electronics. Once cured, it has... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Features: Flame Retardant
- Cure / Technology: Two Component
- Industry: Electronics; Marine; Semiconductors, IC's
from ELANTAS North America LLC
The smart meter market, encompassing electric, water, and gas sectors, is pivotal in shaping a sustainable and connected future. As these meters become integral to our utilities, they face multifaceted challenges. From fluctuating environmental conditions to potential electronic interference, the... [See More]
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset
- Type / Form: Liquid
- Industry: Aerospace; Electronics; Military
from RS Components, Ltd.
RS PRO ERUR5640RP250G Potting Compound [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant
- Type / Form: Liquid
from Ellsworth Adhesives
ELANTAS PDG CONAP DS-1832 Polyurethane Encapsulant Black is used in electrical potting, casting, or encapsulation. It has high compatibility with most epoxy and urethane systems, heat-stable pigments, and improved heat and light resistance. 1 gal Can. [See More]
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Single Component
from Master Bond, Inc.
Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-11 Polyurethane Amber is a two component, liquid molding and encapsulating system that is used to protect electrical assemblies against extreme environments. It offers flexibility, low viscosity, hydrolytic stability, high dielectric strength, and resistance to fungus,... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 4000 to 5750
- Cure / Technology: Two Component
- Tensile (Break): 750
from Master Bond, Inc.
Master Bond Polymer System EP30D-7 is a versatile two component flexible epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance characteristics of... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-14 Polyurethane Elastomer System is a two component, unfilled polyurethane that is used for encapsulation and potting of electrical and heat sensitive assemblies. It offers flexibility, low viscosity, fast curing, fast gelling, and resistance to water and thermal shock. It... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 1200
- Cure / Technology: Two Component
- Tensile (Break): 700
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-1556 Polyurethane Resin System Black is a two component, polyether based system that is used for casting, molding, potting, and encapsulating electrical assemblies such as connectors, print circuit boards, cables, pumps, and conveyors. It cures at room to elevated... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 10400
- Cure / Technology: Two Component
- Tensile (Break): 5000
from Master Bond, Inc.
UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Cure / Technology: Reactive or Moisture Cured; Single Component; Thermoset; UV or Radiation Cured
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Features: Unfilled; Flexible; Non-corrosive; Thermal Insulation
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-20 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 1200
- Cure / Technology: Two Component
- Thermal Conductivity: 5.10E-4
from Master Bond, Inc.
Master Bond UV10Med is a one component, UV curable system that fully meets USP Class VI specifications. This low viscosity, optically clear system is a superior adhesive, sealant and coating and is castable beyond 1/8" thick. The cured system has good chemical resistant properties particularly to... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Single Component; Thermoset; UV or Radiation Cured
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 800 to 6000
- Cure / Technology: Two Component
- Thermal Conductivity: 7.10E-4
from Master Bond, Inc.
Master Bond UV15DC80 is a very special dual cured (UV/heat) curable system featuring the capacity to cure in shadowed out of areas by supplementary heat curing at 80 °C for 15-30 minutes. In addition, UV15DC80 has outstanding physical properties including superb physical strength characteristics... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Single Component; Thermoset; UV or Radiation Cured
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]
- Compound Type: Encapsulant, Potting Compound
- Thermal Conductivity: 7.10E-4
- Viscosity: 2000
- Tensile (Break): 2000
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 2000
- Cure / Technology: Two Component
- Thermal Conductivity: 7.10E-4
from Master Bond, Inc.
Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-21 Polyurethane Resin System is a two component, non-MBOCA system that is used for casting, embedding, potting, and encapsulation of electrical assemblies and power devices. It is recommended for potting print circuit boards, voltage regulators, transformers, rectifiers, and... [See More]
- Compound Type: Encapsulant, Potting Compound
- Tensile (Break): 2000
- Viscosity: 800
- Elongation: 155.0
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient, non-critical one to three mix... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-2521 Polyurethane Resin System Black is a two component, filled system that is used for potting and encapsulation of transformers, circuitry, coils, and modules. It cures at room to elevated temperatures and offers good electrical properties, low exotherm, low shrinkage, and... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 4500
- Cure / Technology: Two Component
- Thermal Conductivity: 0.0015
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a 4 to 1 mix ratio by weight... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-2523 Polyurethane Casting System Black is a two component, filled system that is used for potting electrical assemblies that are exposed to extreme environments and thermal shock. It cures at room to elevated temperatures and offers good electrical properties, low exotherm,... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 2800
- Cure / Technology: Two Component
- Thermal Conductivity: 4.50E-4
from Master Bond, Inc.
Master Bond UV18Med is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Single Component; Thermoset; UV or Radiation Cured
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-2534 Polyurethane Potting System Black is a two component, filled, non-mercury system that is used for potting electrical assemblies that are exposed to extreme environments and thermal shock. It cures at room to elevated temperatures and offers good electrical properties,... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 2200
- Cure / Technology: Two Component
- Tensile (Break): 1970
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-2550 Polyurethane Resin System Black is a two component, filled, non-mercury system that is used for casting high voltage transforms, encapsulating and potting electrical assemblies. It cures at room to elevated temperatures and offers good electrical properties, low... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 3000
- Cure / Technology: Two Component
- Thermal Conductivity: 8.00E-4
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-2553 Polyurethane Encapsulant is a two-component polyurethane potting system. It is used for potting and encapsulation of electronic components, modules, and circuit boards. It also offers low stress cure for protection of sensitive components and excellent thermal shock... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 300
- Cure / Technology: Two Component
- Tensile (Break): 1050
from Ellsworth Adhesives
ELANTAS PDG CONATHANE EN-4 Polyurethane Resin System is a two component, non-MBOCA system that is used for molding and potting electrical assemblies that are exposed to extreme thermal changes. It is typically used for print circuit boards, electrical cables, connectors, strain sensitive devices,... [See More]
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 9000
- Cure / Technology: Two Component
- Tensile (Break): 2000
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Compound Type: Encapsulant, Potting Compound; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
Techsil ® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and... [See More]
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Epoxies Etc...
This two component urethane series are low durometer (25-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition... [See More]
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Type / Form: Liquid
- Features: Filled
from Henkel Corporation - Industrial
LOCTITE STYCAST UV 7993, Urethane, Conformal coating LOCTITE STYCAST UV 7993 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Compound Type: Encapsulant, Potting Compound; Adhesive
- Viscosity: 120
- Cure / Technology: Single Component; UV or Radiation Cured
from Hapco, Inc.
Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Two Component
- Type / Form: Liquid
- Features: Flexible
from Henkel Corporation - Electronics
Stycast U2500 is an encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings. [See More]
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
- Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component
- Viscosity: 5000
from ACCRAbond, Inc.
CONATHANES ® EN-2541 and EN-2543 are filled, flame resistant polyurethane resins, specially formulated for general purpose electrical/electronic potting, casting and encapsulation. When tested in accordance with UL-94, flame resistance ratings of 94V-O are obtained. EN-2541 and EN-2543 have... [See More]
- Compound Type: Encapsulant, Potting Compound
from Techsil Limited
Techsil ® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features. Excellent long term UV stability. Scratch and mark resistant. Non-toxic. High mechanical strength. Easy to mix... [See More]
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Substrate Compatibility: Composites; Metal; Plastic
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
Techsil PU23955 is a two part component potting compound which cures to an opaque translucent material that is stable in UV light. Once mixed, the system reacts at room temperature to produce a tough abrasion resistant material with good hydrolysis resistance. There are many applications for this... [See More]
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Single Component; UV or Radiation Cured
from Epoxies Etc...
50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component
- Type / Form: Liquid
- Features: Filled; Flame Retardant; UL Rating