Flexible / Dampening Polyurethane Adhesives and Sealants

ELAN-Tron® -- U 225 Black Resin / UH 510S Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Unfilled; Flexible; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Substrate Compatibility: Dissimilar Substrates
Cryogenically Serviceable Epoxy Urethane System -- EP30DP-NV
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Features: High Dielectric; Flexible; Laminaes; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7
from Master Bond, Inc.

Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance... [See More]

  • Features: High Dielectric; Flexible; Laminaes; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]

  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Thermoset; Two Component  
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Features: Unfilled; Flexible; Non-corrosive; Thermal Insulation
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Cure / Technology: Reactive or Moisture Cured; Single Component; Thermoset; UV or Radiation Cured
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Features: Flexible
  • Substrate Compatibility: Metal; Plastic
  • Compound Type: Thermally Conductive; Adhesive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component  
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Features: High Dielectric; Filled; Flame Retardant; Flexible; Thermal Insulation; UL Rating
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
Sheldahl Abrasive Belt Adhesive -- A651-20
from Sheldahl Flexible Technologies - a Flex company

PRODUCT DESCRIPTION. Sheldahl Polyurethane Adhesive is designed to be used in conjunction with an isocyanate curing agent as a two-component system. These systems produce a tough, flexible, temperature and chemical resistant bond. APPLICATIONS. Sheldahl Adhesives are specifically designed for... [See More]

  • Features: Flexible; Solvent Based
  • Type / Form: Liquid
  • Compound Type: Adhesive
  • Substrate Compatibility: Paper or Paperboard; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Splicing Abrasive Belts
Flexane® 80 Putty -- 15820 [15820 from ITW Devcon]
from Applied Industrial Technologies

1 lb Kit; Black; Functional Cure 25 hr; Working Time 20 min [See More]

  • Features: Unfilled; Flexible
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Rubber or Elastomer; Wood
  • Compound Type: Caulk, Grout; Leveling Filling; Sealant
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component  
3M™ Scotch-Weld™ Urethane Adhesive -- 3532 B/A
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ 3532 B/A Urethane Adhesive is a two-component, polyurethane adhesive which cures at room temperature or with heat to form tough, impact-resistant structural bonds. Provides excellent adhesion to many primed or painted metal and plastic substrates and is designed to... [See More]

  • Features: Flexible
  • Substrate Compatibility: Metal; Plastic
  • Compound Type: Adhesive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
Filter-bond™ Elastomeric Casting and Potting Compound -- E-3264
from Hapco, Inc.

Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]

  • Features: Flexible
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Cure / Technology: Two Component  
Flame retardant thermally conductive polyurethane -- 50-2150FR
from Epoxies Etc...

The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible polyurethane potting system. [See More]

  • Features: High Dielectric; Flame Retardant; Flexible
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Industry: Electronics
3M™ Scotch-Weld™ Urethane Adhesive -- 3535 B/A
from 3M Aerospace and Aircraft Maintenance Division

Two-component, polyurethane adhesive which cures at room temperature. Forms tough, impact-resistant structural bonds. Excellent adhesion to many primed or painted metal and plastic substrates. Designed to develop sag resistance approximately 30 seconds after mixing. Work Life: 100 grams mixed at 75F... [See More]

  • Features: Flexible
  • Substrate Compatibility: Metal; Plastic
  • Compound Type: Adhesive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Features: Unfilled; Flexible
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates
Flexible, Flame Retardant Urethane -- 20-2100FR
from Epoxies Etc...

20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]

  • Features: High Dielectric; Unfilled; Flame Retardant; Flexible; UL Rating
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component